BL-M7663BU3 802.11a/b/g/n/ac 867Mbps WLAN + Bluetooth v5.1 USB Combo Module SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.
Top view Bottom view Module Name: BL-M7663BU3 Module Type: 802.11a/b/g/n/ac 867Mbps WLAN + Bluetooth v5.1 USB Combo Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision 1 Summary Release Date 0.1 Initial release 2021-08-21 1.0 Official version 2021-10-18 http://www.b-link.net.
1. Introduction The BL-M7663BU3 is a highly integrated 2T2R 802.11a/b/g/n/ac Wireless LAN (WLAN) network and bluetooth combo module. The module’s interface is USB 1.0/1.1/2.0. It combines a WLAN MAC, a 2T2R capable WLAN base band. Bluetooth support 5.1 performance. The BL-M7663BU3 module provides a complete solution for a high throughput performance integrated WLAN and BT device. 1.1 Features Operating Frequencies: 2.4~2.4835GHz and 5.15~5.85GHz Host Interface is USB2.0 IEEE Standards: IEEE 802.
1.3 General Specifications Module Name BL-M7663BU3 Chipset MT7663BUN WLAN Standard IEEE 802.11 a/b/g/n/ac BT Specification Bluetooth Core Specification v5.1/4.2/4.1/2.1 Host Interface USB2.0 for WiFi and Bluetooth Antenna Connect to the external antennas through IPEX connectors Dimension SMD 32Pins --27.0*18.0*3.0mm (L*W*H), Tolerance: +/-0.15mm Power Supply DC 3.3V±0.2V @ 1500 mA (Max) Operation Temperature -20℃ to +70℃ Operation Humidity 10% to 95% RH (Non-Condensing) 2.
2.1 Pin Definition Lev No. Pin Name Type 1 NC - - NC 2 NC - - NC 3 NC - - NC 4 NC - - NC 5 GND P GND 6 USB_DP I/O USB differential data line 7 USB_DM I/O USB differential data line 8 GND P GND 9 NC - - NC 10 NC - - NC 11 GND P 12 NC - 13 GND P 14 BT_WAKE_HOST O 3.
30 VDD33 P 31 NC - 32 GND P GND CON1 BT_RF RF IPEX connector for BT RF to BT_ANT CON2 WLAN_RF0 RF IPEX connector for 2.4G / 5G RF to WLAN_ANT0 CON3 WLAN_RF1 RF IPEX connector for 2.4G / 5G RF to WLAN_ANT1 P: Power or Ground; Main Power supply - I/O: In/Output; NC I: Input; O:Output; RF: Analog RF Port or RF Ground; 3. Electrical and Thermal Specifications 3.
2.4G 11n HT40 MCS15 RX (2RX RF test) 119 149 mA 5G 11a 6Mbps TX @ 18dBm (1TX RF test) 456 506 mA 5G 11a 6Mbps RX (1RX RF test) 127 177 mA 5G 11n HT20 MCS8 TX@15.5dBm (2TX RF test) 703 753 mA 5G 11n HT20 MCS8 RX (2RX RF test) 144 194 mA 5G 11n HT40 MCS15 TX@14dBm (2TX RF test) 508 558 mA 5G 11n HT40 MCS15 RX (2RX RF test) 146 196 mA 5G 11ac VHT80 MCS9 TX@14dBm (2TX RF test) 476 526 mA 5G 11ac VHT80 MCS9 RX (2RX RF test) 156 206 mA 4. WLAN & Bluetooth RF Specifications 4.
02.11ac (VHT40): MCS0~MCS9(2T2R)27~400Mbps; Frequency Tolerance ≦±15ppm 2.4G Receiver Specifications (WLAN_ANT0 & WLAN_ANT1) RX Rate Min Input Level（dBm） Max Input Level（dBm） PER 802.11b@1Mbps -92dBm -5 < 8% 802.11b@11Mbps -86dBm -5 < 8% 802.11g@6Mbps -90dBm -5 < 10% 802.11g@54Mbps -74dBm -5 < 10% 802.11n@HT20_MCS0 -88dBm -5 < 10% 802.11n@HT20_MCS7 -70dBm -5 < 10% 802.11n@HT40_MCS0 -86dBm -5 < 10% 802.11n@HT40_MCS7 -68dBm -5 < 10% 802.
802.11a (OFDM): BPSK, QPSK, QAM16, QAM64; Modulation 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64; 802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256; 802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps; 802.11n (HT40): MCS0~MCS7(1T1R) 13.5~150Mbps; 802.11n (HT40): MCS8~MCS15(2T2R) 27~300Mbps; Date Rate 802.11ac (VHT20): MCS0~MCS8(1T1R) 6.5~86.7Mbps; 802.11ac (VHT20): MCS0~MCS8(2T2R) 13~173.3Mbps; 802.
4.3 Bluetooth RF Specification Conditions: VDD33=3.3V ; Ta:25℃ Features Description Bluetooth Specification Bluetooth Core Specification v5.1/4.2/4.1/2.1 Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Channels Power Classes Bluetooth Classic: Ch0~Ch78 (For 1MHz Channels); Bluetooth Low Energy: Ch0~Ch39 (For 2MHz Channels); Bluetooth Classic: Class1; Bluetooth Low Energy: Class1.
Δf1avg 140KHz 158.9.kHz 175KHz Δf2avg / 159.15.kHz / Δf2max 115KHz 154.3kHz / Δf2avg/Δf1avg 0.8 0.89 / Items Min Typ Max EDR_3M(3DH5) EDR Carrier Frequency Stability and Modulation Accuracy ωi -75KHz -8.16kHz +75KHz ωi+ωo -75KHz -9.03kHz +75KHz ωo -10KHz -0.9kHz +10KHz 8DPSK RMS DEVM / 0.026 0.13 8DPSK DEVM / 0.059 0.25 Items Min Typ Max Δf1avg 225KHz 250KHz 275KHz Δf2avg / 234.4KHz / Δf2max 185KHz 225KHz / Δf2avg/Δf1avg 0.8 0.
5. Mechanical Specifications 5.1 Module Outline Drawing Top View Module dimension: 27.0mm*18.0mm*3.0mm Side View （L*W*H ; Tolerance: ±0.15mm） IPEX / MHF-1 connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm) Module Bow and Twist：≤0.1mm 11 http://www.b-link.net.
5.2 Mechanical Dimensions Top View 12 http://www.b-link.net.
6. Application Information 6.1 Recommend PCB Layout Footprint Bottom View 6.2 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 13 http://www.b-link.net.
7. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset MT7663BUN MediaTek Inc. Shenzhen Tie Fa Technology CO. LTD 2 PCB BL-M7663BU3 Guangdong KINGSHINE ELECTRONICS CO., LTD Quzhou Sunlord Electronics CO., LTD Lucki Electronics Co., Ltd 3 Crystal 40MHz-12pF-10ppm- Shenzhen Kaiyuexiang Electronics Co., Ltd 3225 Chengde Oscillator Electronic Technology Co., Ltd. 4 Diplexer DP1608-A2455DTB2 Advanced Ceramic X Corp. RFDIP160806ELM6T63 Walsin Technology CORP. 8.
Package specification: 1、 700 modules per roll and 2,800 modules per box. 2、Outer box size: 37.5*36*29cm. 3、 The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt). 4、 Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5、 Each carton is packed with 4 boxes. 8.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
