BL-M6158NS1 802.11n 150Mbps WiFi SDIO Module Specification SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.
Module Name: BL-M6158NS1 Module Type: 802.11b/g/n 150Mbps SDIO Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision 1 Summary Release Date 0.1 Initial release 2021-01-25 1.0 Final release 2021-03-23 http://www.b-link.net.
1. Introduction BL-M6158NS1 wireless SDIO module is designed base on SV6158. It operates at 2.4~2.4835GHz supports IEEE802.11b/g/n 1T1R, wireless data rate can reach up to 150Mbps. The SDIO interface complies with SDIO 1.1/2.0 and SPI. It supports external antenna, which adapts different kinds of work environment. It’s easy and convenient to connect wireless network. 1.1 Features Operating Frequencies: 2.4~2.4835GHz Host Interface is SDIO IEEE Standards: IEEE 802.
1.3 General Specifications Module Name BL-M6158NS1, WiFi Module Chipset SV6158 WiFi Standards IEEE802.11b/g/n/, 1T1R, 2.4G, 150Mbps (Max) Host Interface SDIO2.0 Antenna Connect to external antenna through Half hole pads Dimension SMD 44Pins, 12.0*12.0*1.5mm (L*W*H) Power Supply DC 3.3V±0.2V @350 mA (Max) Operation Temperature -20℃ to +50℃ Operation Humidity 10% to 95% RH (Non-Condensing) Storage Temperature -40℃ to +85℃ Storage Humidity 10% to 95% RH (Non-Condensing) 2.
2.1 Pin Definition No Pin Name Type Description 1 GND P Ground 2 RF I/O WLAN RF pad/2.4G 3 GND P Ground 4 NC / NC 5 GPIO12 I/O Strapping Purpose I/O Pins 6 NC / NC 7 NC / NC 8 NC / NC 9 VDD P VDD3.
32 NC / NC 33 GND P Ground 34 NC / NC 35 NC / NC 36 GND P Ground 37 GPIO00/UART_LOG_RX I/O General Purpose I/O Pins 38 GPIO01/UART_LOG_TX I/O General Purpose I/O Pins 39 NC / NC 40 NC / NC 41 NC / NC 42 NC / NC 43 NC / NC 44 NC / NC P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port 3. Electrical and Thermal Specifications 3.
3.3 Power On Sequence 3.4 Current Consumption Conditions:VDD=3.3V，Ta = 25 °C，unit: mA VDD Current(average) Supply current Typ Max Units WiFi Unassociated(Linux Driver) 118 326 mA 2.4G 1Mbps TX(RF-Test) 17 212 220 mA 2.4G 1Mbps RX(RF-Test) 80 85 mA 2.4G 11Mbps TX(RF-Test) 17 200 210 mA 2.4G 11Mbps RX(RF-Test) 80 85 mA 2.4G 6Mbps TX(RF-Test) 14 182 192 mA 2.4G 6Mbps RX(RF-Test) 80 85 mA 2.4G 54Mbps TX(RF-Test) 14 182 192 mA 2.
2.4G MCS0(HT20) TX(RF-Test) 14 215 225 mA 2.4G MCS0(HT20) RX(RF-Test) 80 85 mA 2.4G MCS7(HT20) TX(RF-Test) 14 183 193 mA 2.4G MCS7(HT20) RX(RF-Test) 80 85 mA 2.4G MCS0(HT40) TX(RF-Test) 14 183 193 mA 2.4G MCS0(HT40) RX(RF-Test) 80 85 mA 2.4G MCS7(HT40) TX(RF-Test) 14 183 193 mA 2.4G MCS7(HT40) RX(RF-Test) 80 85 mA 4. Interface Functional and Timing Specifications 4.1 SDIO Interface Functional Description Complies With SDIO 1.1/2.0/3.
Symbol Parameter Condition Min. Typ. Max. Units fpp Clock Frequency SDR12/25/50 0 - 50 MHz tTLH Clock rise time SDR12/25/50 7 - - ns tTHL Clock fall time SDR12/25/50 7 - - ns tISU Input set-up time SDR12/25/50 6 - - ns tIH Input hold time SDR12/25/50 2 - - ns TOOLY Output Delay time during Data Transfer Mode SDR12/25/50 - - 14 ns ToH Output Hold time SDR12/25/50 2.5 - - ns 5. WiFi & Bluetooth RF Specifications 5.1 2.
802.11n@HT40_MCS0 14dBm ±1.5dBm ≦-10dB 802.11n@HT40_MCS7 14dBm ±1.5dBm ≦-27dB RX Rate Min Input Level(Typ) Max Input Level(Typ) PER 802.11b@1Mbps -92dBm -10dBm < 8% 802.11b@11Mbps -85dBm -10dBm < 8% 802.11g@6Mbps -84dBm -20dBm < 10% 802.11g@54Mbps -68dBm -20dBm < 10% 802.11n@HT20_MCS0 -84dBm -20dBm < 10% 802.11n@HT20_MCS7 -65dBm -20dBm < 10% 802.11n@HT40_MCS0 -84dBm -20dBm < 10% 802.11n@HT40_MCS7 -65dBm -20dBm < 10% 2.4G Receiver Specifications 6.
Module Bow and Twist：≤0.1mm 6.2 Mechanical Dimensions 7. Application Information 7.1 Typical Application Circuit 10 http://www.b-link.net.
7.2 Recommend PCB Layout Footprint 7.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 11 http://www.b-link.net.
8. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset SV6158 iComm-semi Note Shenzhen Tie Fa Technology 2 PCB BL-M6158NS1 Quzhou Sunlord Electronics Co., Ltd Jiangsu Lantek Electronics Tech Co., Ltd. Lucki Electronics Co., Ltd 3 Crystal 24MHZ-10PPM-12p- Shenzhen Kaiyuexiang Electronics Co., Ltd 3225 Chengde Oscillator Electronic Technology Co., Ltd. 9. Package and Storage Information 9.1 Package Dimensions 12 http://www.b-link.net.
Package specification: 1. 2000 modules per roll and 10,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 25.3mm (with a width of 21.3mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 5 boxes. 8.
FCC WARNING FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labelled in a visible area with the following: “Contains Transmitter Module 2AL6KBL-M7663BU1” The module can be used for camera with 2dBi antenna.
Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See alsoSection 2.
module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured.
The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The EUT has one PCB antenna, the antenna can not be replaced by other authorized antennas. 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product.
as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.
