DX-BT24-S MODULE SPECIFICATION Version：2.
DX-BT24-S MODULE SPECIFICATION Update record Version Date Illustrate V2.1 2018/10/1 V2.2 2022/01/06 new version initial version Author DL DL Contact Us Shenzhen DX-SMART Technology Co., Ltd. Email：sales@szdx-smart.com Tel：0755-29978125 Web：www.szdx-smart.
DX-BT24-S MODULE SPECIFICATION Contents 1. Introduction ...................................................................................................................................................... - 5 1.1. Overview .................................................................................................................................................. - 5 1.2. Key Features ......................................................................................................................
DX-BT24-S MODULE SPECIFICATION 5.4. Packing Specification ......................................................................................................................... - 26 - Table index Table 1 ：Basic parameter table ...............................................................................................................- 7 Table 2 ：Pin definition description table ............................................................................................. - 8 Table 3 ：Work mode table .
DX-BT24-S MODULE SPECIFICATION 1. 1.1. Introduction Overview DX-BT24-S Bluetooth module is built by Shenzhen DX-SMART Technology Co., Ltd. for intelligent wireless data transmission，It uses the DIALOG 14531 chip and follows the Bluetooth BLE 5.1 specification.
DX-BT24-S MODULE SPECIFICATION 1.3. Application Smart home Smart education equipment Medical equipment monitoring and wireless control Measurement and monitoring system Industrial sensors and controls Tracking and positioning 1.4.
DX-BT24-S MODULE SPECIFICATION 1.5. Basic Parameters Table 1：Basic parameter table Parameter Details Parameter Details Chip model DA14531 Module model DX-BT24-S Bluetooth specifications BLE 5.1 Module size 14.5(L) x 12 (W) x 2.2(H) mm Operating Voltage 3.3V Working current 270 uA protocol GATT，ATT，GAP MTU value 253 bytes Sensitivity -94dBm@0.1%BER Transmit power -19.5~+2.5dBm Modulation GFSK Frequency band RF input impedance 50Ω 2.402GHz -2.
DX-BT24-S MODULE SPECIFICATION Figure 2：Module pin definition 2.2. Pin Definition Description Table 2：Pin definition description table Pin number Pin name Pin function 1 RF External antenna pin 2,3,4,6,11 GND Power Ground 5 UART-TX Serial data output Corresponding chip P0_6 pin 7 VBAT Power input pin 3.
DX-BT24-S MODULE SPECIFICATION 12 P0_0 NC Corresponding chip P0_0 pin 13 UART-RX Serial data input Corresponding chip P0_7 pin Reset 14 Wake up from RST hibernation mode For details, please refer to 2.5.4 Corresponding chip P0_5 pin 15 KEY Disconnect pin For details, please refer to 2.5.5 Low power mode For details, please refer to 2.5.5 wake up Corresponding chip P0_9 pin Enter pairing mode For details, please refer to 2.5.
DX-BT24-S MODULE SPECIFICATION 2.4. Energy-saving Mode 2.4.1. Low Power Mode When the host and the module are connected through the serial port, the module can enter the low power consumption mode through the following steps； Use AT+PWRM command to enable low power consumption function. For more information about AT commands, Please refer to "DX-BT24&BT24-S&BT24-PA Bluetooth Module_Serial UART_Application Guide". In low power consumption mode, the module can be found and connected.
DX-BT24-S MODULE SPECIFICATION Figure 3：Energy-saving mode control diagram 2.5. Power Design 2.5.1. Power Interface Power interface pin definition Table 4：Power interface pin definition table Pin name Pin number describe Minimum Typical value VBAT 7 Module power 2.8 GND 2,3,4,6,11 Land - Max unit 3.3 3.6 V 0 - V 2.5.2. Power Supply Stability Requirements The power supply range of DX-BT24-S is 2.8~3.6V. It is necessary to ensure that the input voltage is not lower than 2.8V.
DX-BT24-S MODULE SPECIFICATION Figure 4：Burst transmission power supply requirements In order to reduce the voltage drop, it is recommended to reserve 2 (22uF, 0.1uF) chip multilayer ceramic capacitors (MLCC) with the best ESR performance for VBAT, and the capacitors should be placed close to the VBAT pin. The reference circuit is as follows： Figure 5：powered reference circuit 2.5.3.
DX-BT24-S MODULE SPECIFICATION Pin name Pin number I/O describe RST 14 DI Module reset Remark Active low ；NC if not used Table 6：RST pin definition Module status Method of operation Result Hibernation Pull down the RST pin for at least 200ms and then release Reset wake Other status Pull down the RST pin for at least 200ms and then release Reset Remark The RST signal is more sensitive to interference, so it is recommended that the trace should be as short as possible, and it needs to be han
DX-BT24-S MODULE SPECIFICATION 2.5.5.
DX-BT24-S MODULE SPECIFICATION 2.6. Hardware Physical Interface 2.6.1. UART Interface Four signal pins are used to realize UART function. When DX-BT24-S is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two pins, UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control, and they are both active at low level, that is, transmission is allowed at low level, and transmission is stopped at high level.
DX-BT24-S MODULE SPECIFICATION 2.6.2. Universal Digital IO Port Five general digital lO ports are defined in the module. All these IO ports can be configured through software to realize various functions, such as button control, LED drive or interrupt signal of the main controller, etc. Keep floating when not in use 2.6.3.
DX-BT24-S MODULE SPECIFICATION Ultra-low power consumption (20 uA Typical power supply current, 100 ksample/s) Configurable attenuator: 1x, 2x,3x, 4x The device integrates a 10-bit high-speed and ultra-low-power general-purpose analog-to-digital converter (ADC). It can operate in unipolar (single-ended> mode and bipolar (differential) mode. ADC has its own 0.9v regulator (LDO), which represents the full-scale reference voltage 3. Electrical Characteristics & Reliability 3.1.
DX-BT24-S MODULE SPECIFICATION Table 10：Working voltage table Operating Voltage parameter Minimum Typical Max unit VIN- Core supply voltage（VDD） 2.8 3.3 3.6 V VIN- I/O power supply/voltage（VDDIO） 2.8 3.3 3.6 V 3.2. Working And Storage Temperature Table 11：Working and storage temperature table 3.3.
DX-BT24-S MODULE SPECIFICATION 3.4. RF Characteristics Table 13：RF characteristics table Function 3.5. Value BLE transmit power -19.5 ~2.5dBm BLE sensitivity -94dBm@0.1%BER Static Protection In the application of the module, due to the static electricity generated by human body static electricity and charged friction between microelectronics, it is discharged to the module through various ways, which may cause certain damage to the module, so ESD protection should be taken seriously.
DX-BT24-S MODULE SPECIFICATION 4.1. Module Mechanical Size Figure 13：Module top and side dimension drawing Figure 14：Bottom view size of the module Shenzhen DX-SMART Technology Co., Ltd. - 21 - www.szdx-smart.
DX-BT24-S MODULE SPECIFICATION 4.2. Recommend Encapsulation Figure 15：Recommended package dimensions 4.3. Module Top View & Bottom View Figure 16：Top and bottom views of the module Remark The above picture is for reference only. For the actual product appearance and label information, please refer to the actual module. Shenzhen DX-SMART Technology Co., Ltd. - 22 - www.szdx-smart.
DX-BT24-S MODULE SPECIFICATION 4.4. Hardware Design Layout Recommendations The DX-BT24-S Bluetooth module works in the 2.4G wireless frequency band and uses an on-board antenna. The standing wave ratio (VSWR) and efficiency of the antenna depend on the placement of the patch. Various factors should be avoided as far as possible to the wireless signal transmission and reception. Pay attention to the following What time is it： 1、Avoid using metal for the product shell surrounding the Bluetooth.
DX-BT24-S MODULE SPECIFICATION 5. 5.1. Patch Requirements Storage Conditions Modules are shipped in vacuum sealed bags. The humidity sensitivity level of the module is 3 (MSL 3), and its storage must comply with the following conditions： 1. Recommended storage conditions: temperature 23±5°C, and relative humidity 35~60%. 2. Under the recommended storage conditions, the module can be stored in a vacuum sealed bag for 12 months. 3.
DX-BT24-S MODULE SPECIFICATION Remark 1. In order to prevent and reduce the occurrence of defective welding such as blistering and delamination caused by damp, strict control should be carried out. It is not recommended to expose to the air for a long time after unpacking the vacuum package. 2.
DX-BT24-S MODULE SPECIFICATION Figure 18：Recommended reflow soldering temperature profile Table 15：Recommended reflow soldering temperature Statistics name Lower limit Upper limit Slope 1 (target=2.0) is between 30.0 and 70.0 unit 1 3 Degree/sec 1 3 Degree/sec -5 -0.5 Degree/sec Constant temperature time 110-190℃ 60 120 sec @220℃ Reflow time 30 65 sec Peak temperature 235 250 Celsius @235℃ total time 10 30 sec Slope 2 (target=2.0) is between 70.0 and 150.0 Slope 3 (target = -2.
DX-BT24-S MODULE SPECIFICATION high mm, and 25 modules are placed on each tray. Every 1000 modules are placed in a box with length 250mm*width 200mm*height 70mm, and each box with length 430mm*width 210mm*height 770mm can hold 5000 modules. The specific specifications are as follows Figure 19：Pallet size (unit: mm) Figure 20：Packing box size (unit: mm) Shenzhen DX-SMART Technology Co., Ltd. - 27 - www.szdx-smart.
Single Module General Statements 1. Antenna List: Antenna type: PCB Antenna BT Antenna Gain: 0dBi Antenna impedance: 50 (Ω) Frequency range: 2400-2500MHz 2. Any change of antenna type is not allowed. The module only used PCB antenna. 3. Host containing the modules must comply with FCC Rule requirement FCC Statement This device complies with part 15 of the FCC Rules.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AKS8-DX-BT24-S Or Contains FCC ID: 2AKS8-DX-BT24-S” When the module is installed inside another device, the user manual of the host must contain below warning statements; 1.
OEM INTEGRATION INSTRUCTIONS: This device is intended only for OEM integrators under the following conditions: The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the internal on-board antenna that has been originally tested and certified with this module. External antennas are not supported.
that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C(15.247)/RSS-247. 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on FCC s, etc.
e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design.
2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.
