DX-BT24-M MODULE SPECIFICATION Version：2.
DX-BT24-M MODULE SPECIFICATION Update record Version Date Illustrate V2.1 2018/10/1 V2.2 2022/01/06 new version initial version Author DL DL Contact Us Shenzhen DX-SMART Technology Co., Ltd. Email：sales@szdx-smart.com Tel：0755-29978125 Web：www.szdx-smart.
DX-BT24-M MODULE SPECIFICATION Contents 1. Introduction ...................................................................................................................................................... - 5 1.1. Overview .................................................................................................................................................. - 5 1.2. Key Features ......................................................................................................................
DX-BT24-M MODULE SPECIFICATION 5.4. Packing Specification ......................................................................................................................... - 26 Table index Table 1 ：Basic parameter table ...............................................................................................................- 6 Table 2 ：Pin definition description table ............................................................................................. - 8 Table 3 ：Work mode table ....
DX-BT24-M MODULE SPECIFICATION 1. 1.1. Introduction Overview DX-BT24-M Bluetooth module is built by Shenzhen DX-SMART Technology Co., Ltd. for intelligent wireless data transmission，It uses the DIALOG 14531 chip and follows the Bluetooth BLE 5.1 specification. Support AT commands, users can query and modify the corresponding parameters according to their needs, flexible to use.
DX-BT24-M MODULE SPECIFICATION Industrial sensors and controls Tracking and positioning 1.4. Block Diagram The following figure shows the functional block diagram of the DX-BT24-M Bluetooth module，Explains the following main functions： Power section Baseband part Memory RF part Peripheral interface Figure 1：Functional block diagram 1.5.
DX-BT24-M MODULE SPECIFICATION Bluetooth specifications BLE 5.1 Module size 11.3(L) x 8 (W) x 2.3(H) mm Operating Voltage 3.3V Working current 270 uA protocol GATT，ATT，GAP MTU value 253 bytes Sensitivity -94dBm@0.1%BER Transmit power -19.5~+2.5dBm Modulation GFSK Frequency band RF input impedance 50Ω 2.402GHz -2.
DX-BT24-M MODULE SPECIFICATION 2.2. Pin Definition Description Table 2：Pin definition description table Pin number 1 Pin name KEY Pin function illustrate Disconnect pin For details, please refer to 2.5.5 Low power mode wake up Enter pairing mode 2 P0_5 LINK-STATUS input/output line connection status pin 4 UART-RTS For details, please refer to 2.5.5 Programmable Bluetooth 3 For details, please refer to 2.5.
DX-BT24-M MODULE SPECIFICATION 2.3. Operating Mode Table 3：Work mode table mode Function Normal working mode All functions and peripheral interfaces can be used normally When not connected, Only open broadcast, all peripheral interfaces are Low power mode closed In the connected state, all functions and peripheral interfaces can be used normally All running RAM blocks of the module are closed, and only the tick Hibernation mode clock inside the chip is reserved for wake-up.
DX-BT24-M MODULE SPECIFICATION 2.4.2. Hibernation Mode When the host and the module are connected through the serial port, the module can enter the hibernation mode through the following steps； Use the AT+PWRM command to enable the hibernation function. For detailed information about the AT command, Please refer to "DX-BT24-M&BT24-T Bluetooth Module_Serial UART_Application Guide". In hibernation mode, the module cannot be found and connected.
DX-BT24-M MODULE SPECIFICATION 2.5.2. Power Supply Stability Requirements The power supply range of DX-BT24-M is 2.8~3.6V. It is necessary to ensure that the input voltage is not lower than 2.8V. The following figure shows the voltage drop of VBAT during radio frequency burst transmission. Figure 4：Burst transmission power supply requirements In order to reduce the voltage drop, it is recommended to reserve 2 (22uF, 0.
DX-BT24-M MODULE SPECIFICATION 2.5.4.
DX-BT24-M MODULE SPECIFICATION 2.5.5.
DX-BT24-M MODULE SPECIFICATION Figure 9：Key reset reference circuit 2.6. Hardware Physical Interface 2.6.1. UART Interface Four signal pins are used to realize UART function. When DX-BT24-M is connected to another digital device, UART_RX and UART_TX transfer data between the two devices.
DX-BT24-M MODULE SPECIFICATION 2.6.2. Universal Digital IO Port Five general digital lO ports are defined in the module. All these IO ports can be configured through software to realize various functions, such as button control, LED drive or interrupt signal of the main controller, etc. Keep floating when not in use 2.6.3.
DX-BT24-M MODULE SPECIFICATION 2.6.4. SPI Interface Master and slave mode From 4bit to 32bit operation Main clock up to 32MHz Support DMA This controller implements serial peripheral interface (SPI™) in master-slave mode. The serial interface can transmit and receive from 4-bit to 32-bit in master/slave mode. The controller includes separate TX and RXFIFOs and DMA handshake support. From the mode clock speed is independent of the system clock speed.
DX-BT24-M MODULE SPECIFICATION 3. Electrical Characteristics & Reliability 3.1. Maximum Rating The absolute maximum ratings of the supply voltage and voltage on the digital and analog pins of the module are listed below. Exceeding these values will cause permanent damage. The average GPIO pin output current is defined as the average current value flowing through any corresponding pin in a 100mS period.
DX-BT24-M MODULE SPECIFICATION storage temperature 3.3.
DX-BT24-M MODULE SPECIFICATION 3.5. Static Protection In the application of the module, due to the static electricity generated by human body static electricity and charged friction between microelectronics, it is discharged to the module through various ways, which may cause certain damage to the module, so ESD protection should be taken seriously. In the process of R&D, production, assembly and testing, especially in product design, ESD protection measures should be taken.
DX-BT24-M MODULE SPECIFICATION 4.1. Module Mechanical Size Figure 14：Module top and side dimension drawing Figure 15：Bottom view size of the module Shenzhen DX-SMART Technology Co., Ltd. - 21 - www.szdx-smart.
DX-BT24-M MODULE SPECIFICATION 4.2. Recommend Encapsulation Figure 16：Recommended package dimensions 4.3. Module Top View & Bottom View Figure 17：Top and bottom views of the module Remark The above picture is for reference only. For the actual product appearance and label information, please refer to the actual module. Shenzhen DX-SMART Technology Co., Ltd. - 22 - www.szdx-smart.
DX-BT24-M MODULE SPECIFICATION 4.4. Hardware Design Layout Recommendations The DX-BT24-M Bluetooth module works in the 2.4G wireless frequency band and uses an on-board antenna. The standing wave ratio (VSWR) and efficiency of the antenna depend on the placement of the patch. Various factors should be avoided as far as possible to the wireless signal transmission and reception. Pay attention to the following What time is it： 1、Avoid using metal for the product shell surrounding the Bluetooth.
DX-BT24-M MODULE SPECIFICATION 5. 5.1. Patch Requirements Storage Conditions Modules are shipped in vacuum sealed bags. The humidity sensitivity level of the module is 3 (MSL 3), and its storage must comply with the following conditions： 1. Recommended storage conditions: temperature 23±5°C, and relative humidity 35~60%. 2. Under the recommended storage conditions, the module can be stored in a vacuum sealed bag for 12 months. 3.
DX-BT24-M MODULE SPECIFICATION Remark 1. In order to prevent and reduce the occurrence of defective welding such as blistering and delamination caused by damp, strict control should be carried out. It is not recommended to expose to the air for a long time after unpacking the vacuum package. 2.
DX-BT24-M MODULE SPECIFICATION Figure 19：Recommended reflow soldering temperature profile Table 15：Recommended reflow soldering temperature Statistics name Lower limit Upper limit Slope 1 (target=2.0) is between 30.0 and 70.0 unit 1 3 Degree/sec 1 3 Degree/sec -5 -0.5 Degree/sec Constant temperature time 110-190℃ 60 120 sec @220℃ Reflow time 30 65 sec Peak temperature 235 250 Celsius @235℃ total time 10 30 sec Slope 2 (target=2.0) is between 70.0 and 150.0 Slope 3 (target = -2.
DX-BT24-M MODULE SPECIFICATION high mm, and 25 modules are placed on each tray. Every 1000 modules are placed in a box with length 250mm*width 200mm*height 70mm, and each box with length 430mm*width 210mm*height 770mm can hold 5000 modules. The specific specifications are as follows Figure 20：Pallet size (unit: mm) Figure 21：Packing box size (unit: mm) Shenzhen DX-SMART Technology Co., Ltd. - 27 - www.szdx-smart.
Single Module General Statements 1. Antenna List: Antenna type: PCB Antenna BT Antenna Gain: 0dBi Antenna impedance: 50 (Ω) Frequency range: 2400-2500MHz 2. Any change of antenna type is not allowed. The module only used PCB antenna. 3. Host containing the modules must comply with FCC Rule requirement FCC Statement This device complies with part 15 of the FCC Rules.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AKS8-DX-BT24-M Or Contains FCC ID: 2AKS8-DX-BT24-M” When the module is installed inside another device, the user manual of the host must contain below warning statements; 1.
OEM INTEGRATION INSTRUCTIONS: This device is intended only for OEM integrators under the following conditions: The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the internal on-board antenna that has been originally tested and certified with this module. External antennas are not supported.
that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C(15.247)/RSS-247. 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on FCC s, etc.
e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design.
2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.
