SPEC. No. ISSUE DGJan-21-08 ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR LIGHT EMITTING DIODE MODULE MODEL No. ＧＷ５□□Ｃ１５Ｌ０２ Ｓｐｅｃｉｆｉｅｄ ｆｏｒ □ □ depends on the emission of light color. Normal white Lamp ： ： Hi color rendering ： ： GW5BWC15L02 GW5BDC15L02 GW5BNC15L02 (５０００K) GW5BNC15L１2 (６５００K) Reference CUSTOMERS' APPROVAL PRESENTED Date Date By By Y.
No. DG1/14 PRODUCT NAME MODEL No. Light Emitting Diode Module ＧＷ５□□Ｃ１５Ｌ０２ 1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below.
DGMODEL No. GW5□□C15L00 Page 2/14 GW5□□C15L00 specification 1. Application This specification applies to the light emitting diode module Model No. GW5□□C15L00 [White (from InGaN Blue LED chip + Phosphor) LED module] Main use : Illumination 2. Outline dimensions and terminal connections -------------------------- Refer to the attached sheet Page 3. 3. Ratings and characteristics ------------------------------------------------ Refer to the attached sheet Page 4. ～ 8. 3-1. Absolute maximum ratings 3-2.
DGMODEL Page GW5□□C15L00 2. Outline dimensions and terminal connections (Outline dimension) Fixing screw position Screw size:M2.6 Screw head:smaller than 4.5φ Annode (Connection terminal) Light emission t Cathode (Connection terminal) ② ① Cross section * ( ) is reference. (Internal circuit diagram) Annode + Cathode "3series × 10parallel=30 pcs of LED" (3 serially connected LED compose a block.10 blocks are parallelly connected) ※ This specification is reference.
DGMODEL No. GW5□□C15L00 3. Ratings and characteristics 3-1. Absolute maximum ratings Item Power dissipation *1 Forward current *1 Reverse Voltage Operating temperature *2 Storage temperature Symbol P IＦ VR Topr Tstg Rating 4.4 400 -5 -30～+90 *3 -40～+100℃ Unit W ｍＡ V ℃ ℃ *1 Power dissipation and forward current are the value when the module temperature is set lower than the rating by using an adequate heat sink. *2 Operating temperature is fixed to the temperature of module's external part.
DGMODEL No. GW5□□C15L00 3-3. Derating Curve Forward current derating curve Forward current IF [mA] 500 400 300 200 100 0 -40 -20 0 20 40 60 Case temperature Ｔｃ [℃] 80 100 *To keep the case temperature lower than the rating, enough heat-radiation performance needs to be secured by using an adequate heat sink. To secure long-term life,use it by the current equal to or less than 360mA .
DGMODEL No. Page GW5□□C15L00 6/14 3-4. Characteristics Diagram 3-4-① Normal white "BW"type.
DGMODEL No. Page GW5□□C15L00 7/14 3-4-② Lamp "BD"type. (*1) "Forward current VS Forward Voltage" Ｔｃ=25℃ 1000 Forward current IF [mA] 12 11 10 9 8 7 6 5 -40 100 10 1 -20 0 20 40 60 80 Case temperature Tc [℃] 100 Relative luminous flux VS Case temperature IF=360mA 120 110 100 90 80 70 60 50 40 30 20 10 0 -40 -20 0 20 40 60 80 100 Case temperature Tc [℃] 5 6 7 1 10 100 Forward current IF [mA] Color temperature [K] 0.42 Ｙ -20℃ 20℃ 50℃ 0.39 0.38 0.43 0.44 0.45 Ｘ 0.46 IF=360mA 0.
DGMODEL No. Page GW5□□C15L00 8/14 3-4-③ Hi color ｒendering "BN"type.
DGMODEL No. Page GW5□□C15L00 9/14 4. Reliability The reliability of products shall be satisfied with items listed below. 4-1. Test items and test conditions No. Test items Confidence level: 90% Test conditions Samples Defective LTPD １ Temperature cycle ２ High temp and high humidity storage ３ High temperature storage ４ Low temperature storage ５ Operating test Tc=60 ℃，IF=400mA, t=1000h ６ Mechanical shock test ７ Variable frequency vibration 15000 m/s2, 0.
DGMODEL No. Page GW5□□C15L00 5. Incoming inspection 5-1. Inspection method A single sampling plan, normal inspection S-4 based on ISO 2859-1 shall be adopted. 5-2. Description of inspection and criteria No. Inspection items 1 2 3 4 Emission Electro-optical characteristics Outline dimensions Appearance No emission Criteria Defect Major defect AQL 0.1% Not conforming to the specification (Forward voltage, Luminous flux and Chromaticity) Not conforming to the specification Minor 0.
DGMODEL No. Page ＧＷ５□□Ｃ１５Ｌ００ 11/14 6．Supplement 6-1 Chromaticity coordinates （Chromaticity table） (IF=360mA, Ta=25℃) BW: Normal white ｘ ｙ 0.3380 0.3640 0.3367 0.3332 0.3541 0.3586 0.3592 0.3946 BD：Lamp ｘ ｙ 0.4467 0.4310 0.4212 0.3770 0.4565 0.3861 0.4901 0.4424 BN：Hi color rendering ｘ （5000K） ｙ 0.3380 0.3640 0.3365 0.3275 0.3513 0.3390 0.3571 0.3797 BN：Hi color rendering ｘ （6500K） ｙ 0.3024 0.3361 0.3101 0.2984 0.3235 0.3110 0.3206 0.3544 (Measurement accuracy : ±0.
DGMODEL No. Page ＧＷ５□□Ｃ１５Ｌ００ 6-2 12/14 Packing ・Amount in one box ： 400 (2 bags) ・Amount in one bag ： 200 (5 trays) ・Amount in one tray ： 40 ・Putting 5 pieces of tray in a dampproofing packing bag and 2 bags in a box. ・Dimensions of the box: 235×220×90mm (Packing form: Box） 200×2bags= 400 (Packing form: bag） 40×5trays= 200 (Packing form: Tray） 5×8= 40 210mm 225mm *The packing dimensions are reference. There is a case to become another packing specifications.
DGMODEL No. ＧＷ５□□Ｃ１５Ｌ００ Page 13/14 7. Precautions ① Storage conditions Please follow the conditions below. ・Before opened： Temperature 5～30℃, humidity less than 60%RH ・After opened： Temperature 5～30℃, humidity less than 60%RH (Please apply soldering within 1 week.) ・Avoid exposing to air with corrosive gas. If exposed, electrode surface would be damaged, which may affect soldering. ② Usage conditions The products are not designed for the use under any of the following conditions.
DGMODEL No. ＧＷ５□□Ｃ１５Ｌ００ Page 14/14 ⑤ Module surface strength Module surface is subject to mechanical stress. Applying stress to surface of modules results in damage on resin, and inside-failure. ⑥ Connecting method In case of solder connecting method, apply solder to the leads by soldering iron with thermo controller (tip temperature 380℃), within 10seconds per one place. Put the board on materials whose conductivity is poor enough not to radiate heat of soldering.
