X-C13SM 802.11bgn and BLE SoC X-C13SM datasheet v1.0 Based on RISCV SOC Support Wi-Fi (802.11b/g/n) and BLE5.0 Wireless Standards www.chipfresh.com sales@chipfresh.com Shanghai ChipFresh Internet of Things Technology Co.
X-C13SM 802.11bgn and BLE SoC 1 Module Overview 1.1 Features MCU BLE • 32-bit RISC-V single-core processor • BLE 5.0 • 160 MHz CPU • Center frequency range of • 276 KB RAM operating • 128 KB ROM channel:2400MHz-2483.5MHz • 1 Kb eFuse • Transmit Power(Max 8dBm) Wi-Fi • IEEE 802.11 b/g/n-compliant • Center frequency range of operating channel:2400MHz-2483.5MHz • Supports 20 MHz bandwidth in 2.
X-C13SM 802.11bgn and BLE SoC 1.2 Description X-C13SM is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi and BLE baseband/MAC designs, which provide a wireless interface to any equipment with a serial or other interface for data transfer. X-C13SM integrate MAC, base band processor, RF transceiver in hardware and all Wi-Fi protocol and configuration functionality and networking stack, embedded firmware to make a fully self-contained solution for a variety of applications.
X-C13SM 802.11bgn and BLE SoC CONTENTS 1 MODULE OVERVIEW....................................................................................................................................... 2 1.1 FEATURES..................................................................................................................................................... 2 1.2 DESCRIPTION.........................................................................................................................................
X-C13SM 802.11bgn and BLE SoC LIST OF FIGURES FIGURE 1. BLOCK DIAGRAM...............................................................................................................................3 FIGURE 2. X-C13SM PIN LAYOUT (TOP VIEW)................................................................................................... 8 FIGURE 3. PHYSICAL DIMENSIONS.....................................................................................................................9 FIGURE 4.
X-C13SM 802.11bgn and BLE SoC LIST OF TABLES TABLE1. PINS DEFINITION.................................................................................................................................. 9 TABLE2. ABSOLUTE MAXIMUM RATINGS........................................................................................................12 TABLE3. RECOMMENDED OPERATING CONDITIONS...................................................................................... 12 TABLE4. ESD.............................
X-C13SM 802.11bgn and BLE SoC HISTORY V 1.0 10-05-2021 First Version. Shanghai ChipFresh Internet of Things Technology Co.
X-C13SM 802.11bgn and BLE SoC 2 Hardware Introduction Pin Layout 2.1 X-C13SM comes with a on-board PCB antenna, please refer to Figure 2. Figure 2. X-C13SM Pin Layout (Top View) Pin Description 2.2 The module has 16 pins. See pin definitions in Table 1. Pin 1 Describtion Type GPIO17 O 2 GPIO11 I 3 GPIO12 I/O 4 5 GPIO14 GPIO16 IPU/O O,PU 6 GPIO7 I Function 3.3V TTL UART1 Debug Output DEBUG-TX 3.3V TTL UART1 Debug Input DEBUG-RX SPI,PWM,ADC SPI,DAC,ADC 3.
X-C13SM 802.11bgn and BLE SoC 7 GPIO8 IPD 8 GPIO21 IPU/O Internal 10K pull-down resistor, Boot select: Low: boot from module flash. High: boot from external UART. This is used for factory firmware program, leave it unconnected for user application SPI,PWM 9 GPIO0 IPU/O SPI,PWM 10 11 RESET GPIO4 Ready GPIO3 Factory GPIO5 Link GPIO1 +3.3V 3V3 Ground I,PU O “Low” effective reset input.
X-C13SM 802.11bgn and BLE SoC 2.4 Ordering Information Figure 4. 2.5 Ordering Information On-board Chip Antenna X-C13SM-1 support internal on-board chip antenna option.
X-C13SM 802.11bgn and BLE SoC Figure 6. 4 Dimensions of External Antenna Connector Electrical Characteristics 4.1 Absolute Maximum Ratings Parameter Power supply voltage I/O PIN Storage temperature Symbol VDD - Min -0.3 -0.3 -40 Shanghai ChipFresh Internet of Things Technology Co., Ltd Max 3.6 VDD+0.
X-C13SM 802.11bgn and BLE SoC Table2. 4.2 Recommended Operating Conditions Parameter Power supply voltage Operating ambient temperature Symbol VDD - Table3. 4.3 Absolute Maximum Ratings Min 2.1 -40 Unit V ℃ Typ +/- 2000 2 +/-500 Unit V V Recommended Operating Conditions Description Human body model class 2 Moisture sensitivity level Charge device model Table4.
X-C13SM 802.11bgn and BLE SoC Figure 7. Peripheral Schematics Shanghai ChipFresh Internet of Things Technology Co.
X-C13SM 802.11bgn and BLE SoC Product Handling 6 Reflow Profile 6.1 Solder the module in a single reflow. ℃ Peak Temp. 235 ~ 250 ℃ 250 217 200 Cooling zone Preheating zone Reflow zone 150 ~ 200 ℃ 60 ~ 120 s >217 ℃ 60 ~ 90s –1 ~ –5 ℃/s Soldering time > 30 s Ramp-up zone 1 ~ 3 ℃/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.
X-C13SM 802.11bgn and BLE SoC 6.2 6.3 Storage Conditions Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH). Recommend to store at ≦10% RH with vacuum packing. The module is rated at the moisture sensitivity level (MSL) of 3. Device Handling Instruction (Module IC SMT Preparation) Baked required with 24 hours at 125+-5℃ before rework process. After bag is opened, devices that will be re-baked required after last baked with window time 168 hours.
X-C13SM 802.11bgn and BLE SoC A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product,or host device) by the grantee or other equipment manufacturer. A host product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion.