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802.11bgn and BLE SoC

Shanghai ChipFresh Internet of Things Technology Co., Ltd

X-C13SL Series

Based on RISC󶁓V SOC

Support Wi-Fi (802.11b/g/n) and BLE Wireless Standards

www.chipfresh.com

sales@chipfresh.com

Summary of content (18 pages)

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802.11bgn and BLE SoC X-C13SL Series Based on RISCV SOC Support Wi-Fi (802.11b/g/n) and BLE Wireless Standards www.chipfresh.com sales@chipfresh.com Shanghai ChipFresh Internet of Things Technology Co.
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802.11bgn and BLE SoC 1 Module Overview 1.1 Features MCU • 32-bit RISC-V single-core processor • 160 MHz CPU • 276 KB RAM • 128 KB ROM • 1 Kb eFuse Wi-Fi • IEEE 802.11 b/g/n-compliant • Operation Frequency： 2412-2462MHz（802.11b/g/n ht20） BLE • Operation Frequency： 2402-2480MHz • Transmit Power（13.46dBm） • Receiver Sensitivity（-97 dBm） • Advertising extensions Hardware • Peripherals: GPIO、SPI、UART、ADC、 DAC、IR、LED、 PWM • Supports 20 MHz bandwidth in 2.4 GHz band • Support XTAL 24/32/38.
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X-C13SL 802.11bgn and BLE SoC 1.2 Description X-C13SL is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi and BLE baseband/MAC designs, which provide a wireless interface to any equipment with a serial or other interface for data transfer. X-C13SL integrate MAC, base band processor, RF transceiver in hardware and all Wi-Fi protocol and configuration functionality and networking stack, embedded firmware to make a fully self-contained solution for a variety of applications.
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X-C13SL 802.11bgn and BLE SoC CONTENTS 1 MODULE OVERVIEW....................................................................................................................................... 2 1.1 FEATURES..................................................................................................................................................... 2 1.2 DESCRIPTION.........................................................................................................................................
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X-C13SL 802.11bgn and BLE SoC LIST OF FIGURES FIGURE 1. BLOCK DIAGRAM...............................................................................................................................3 FIGURE 2. X-C13SL PIN LAYOUT (TOP VIEW)..................................................................................................... 8 FIGURE 3. X-C13SL-1 PHYSICAL DIMENSIONS................................................................................................. 10 FIGURE 4.
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X-C13SL 802.11bgn and BLE SoC LIST OF TABLES TABLE1. PINS DEFINITION.................................................................................................................................. 9 TABLE2. ABSOLUTE MAXIMUM RATINGS........................................................................................................11 TABLE3. RECOMMENDED OPERATING CONDITIONS...................................................................................... 11 TABLE4. ESD.............................
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X-C13SL 802.11bgn and BLE SoC HISTORY V 1.0 10-05-2021 First Version. Shanghai ChipFresh Internet of Things Technology Co.
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X-C13SL 802.11bgn and BLE SoC 2 Hardware Introduction 2.1 Pin Layout  X-C13SL comes with a on-board PCB antenna, please refer to Figure 2. Figure 2. 2.2 X-C13SL Pin Layout (Top View) Pin Description The module has 34 pins. See pin definitions in Table 1. Pin 1,17,18,34 2,3,4,5,6 7 8 9,20 Describtion Ground GPIO1 GPIO20 +3.3V 3V3 Type P IPU/O IPU/O P GPIO21 IPU/O Function GND SPI,PWM SPI,PWM The maximum output current of the external power supply is recommended to be above 500mA.
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X-C13SL 802.11bgn and BLE SoC 15 GPIO2 I/O 16 19 GPIO11 N,C I 21 GPIO17 O 22,23 24 GPIO8 IPD 25 GPIO16 O,PU 26 27 GPIO14 GPIO7 IPU/O I 28 GPIO12 I/O 29 GPIO5 Link GPIO4 Ready GPIO3 Factory IPU/O RESET I,PU 30 31 32 33 O IPU SPI,PWM 3.3V TTL UART1 Debug Input DEBUG-RX 3.3V TTL UART1 Debug Output DEBUG-TX Null Internal 10K pull-down resistor, Boot select: Low: boot from module flash. High: boot from external UART.
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X-C13SL 802.11bgn and BLE SoC Figure 3. 2.4 X-C13SL-1 Physical Dimensions On-board PCB Antenna X-C13SL-1 support internal on-board PCB antenna option.
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X-C13SL 802.11bgn and BLE SoC 2.5 Ordering Information Figure 5. 3 Ordering Information Electrical Characteristics 3.1 Absolute Maximum Ratings Parameter Power supply voltage I/O PIN Storage temperature Symbol VDD Table2. 3.2 Max 3.6 VDD+0.3 125 Unit V V ℃ Absolute Maximum Ratings Recommended Operating Conditions Parameter Power supply voltage Operating ambient temperature Table3. 3.3 Min -0.3 -0.3 -40 Symbol VDD - Min 2.7 -40 Type 3.3 - Max 3.
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X-C13SL 802.11bgn and BLE SoC Table4. 3.4 ESD WiFi/BLE RF Standards Class Item Wireless standard Frequency range Transmit Power Wi-Fi Receiver Sensitivity BLE Wireless standard Frequency range Transmit Power Receiver Sensitivity Parameters 802.11 b/g/n 2400MHz-2483.5MHz 802.11b@1Mbps 802.11g@6Mbps 802.11n@HT20, MCS0 802.11b@1Mbps 802.11b@11Mbps 802.11g@6Mbps 802.11g@54Mbps 802.11n@MCS0 802.11n@MCS7 Bluetooth 2400MHz-2483.5MHz Max Typ 16.69dBm 25.12dBm 24.
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X-C13SL 802.11bgn and BLE SoC Product Handling 4 Reflow Profile 4.1 Solder the module in a single reflow. ℃ Peak Temp. 235 ~ 250 ℃ 250 217 200 Cooling zone Preheating zone Reflow zone 150 ~ 200 ℃ 60 ~ 120 s >217 ℃ 60 ~ 90s –1 ~ –5 ℃/s Soldering time > 30 s Ramp-up zone 1 ~ 3 ℃/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.
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X-C13SL 802.11bgn and BLE SoC 5.3  Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH).  Recommend to store at ≦10% RH with vacuum packing.  The module is rated at the moisture sensitivity level (MSL) of 3. Device Handling Instruction (Module IC SMT Preparation)   Baked required with 24 hours at 125±5℃before rework process. After bag is opened, devices that will be re-baked required after last baked with window time 168 hours.
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X-C13SL 802.11bgn and BLE SoC 5 Contact Information Address: Floor 1, Building 28, No. 6055, Jinhai highway, Fengxian District,Shanghai,China Web: www.chipfresh.com Sales Contact: sales@chipfresh.com Shanghai ChipFresh Internet of Things Technology Co.
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Caution： Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference,and (2) this device must accept any interference received, including interference that may cause undesired operation.
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OEM Guidance 1. Applicable FCC rules This module is granted by Single Modular Approval. It complies to the requirements of FCC part 15C, section 15.247 rules. 2. The specific operational use conditions This module can be used in IoT devices. The input voltage to the module is nominally 2.7 ~ 3.6 V DC. The operational ambient temperature of the module is -40 to 85 degree C.Allows embedding of PCB antenna and FPC antenna. 3.Limited module procedures N/A 4.Trace antenna design N/A 5.
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6. Antenna Antenna type :PCB Antenna; Antenna Max. Peak Gain 2 dBi FPC Antenna; Antenna Max. Peak Gain 2 dBi 7. Label and compliance information An exterior label on OEM’s end product can use wording such as the following: “Contains FCC ID:2A3M5-X-C13SL” 8.