Track Number: AN00048EN MXCHIP Co., Ltd Version: 0.3 11.17.2016 Open Category: Application Note EMW3166 _Guide For User Design Abstract This note lists the matters need attention in each stage of designing and manufacturing while using MXCHIP module. In order to achieve rapid mass production, application designers need learn this note first. Consider and avoid all possible problems which may happen during designing, manufacturing, firmware programming and testing ahead of time.
Application Note Version Record Date Version Update content 9-23-2016 V0.1 Initial version. 9-23-2016 V0.2 Add reference circuit 11-17-2016 V0.
Application Note [Page 2] Catalog EMW3166 _Guide For User Design .................................................................................................................................. 1 Version Record .................................................................................................................................................................... 1 1. Introduction..................................................................................................................
Application Note [Page 3] Picture Catalog Figure 1 EMW3166 top view .............................................................................................................................. 4 Figure 2 EMW3166 Hardware block................................................................................................................... 5 Figure 3 Vertical view ..........................................................................................................................................
Application Note [Page 4] 1. Introduction This note lists the matters need attention in each stage of designing and manufacturing while using MXCHIP module. In order to achieve rapid mass production, application designers need learn this note first. Consider and avoid all possible problems which may happen during designing, manufacturing, firmware programming and testing ahead of time.
Application Note Figure 1 EMW3166 top view EMW3166_Guide For User Design [Page 4]
Application Note [Page 5] EMW3166 model list: Module model Antenna type Description EMW3166-P PCB printed Antenna Default EMW3166-E External antenna to IPX Optional EMW3166-B PIFA antenna Optional Antenna Type: EMW3166 Wi-Fi Module Hardware Block Network Processor UART WLAN Subsystem I2C 802.11b/g/n MAC/Baseband/ radio 100MHz Cortex-M4 MCU ADC SRAM 256K bytes GPIO SDIO Timer/PWM On-board PCB Ant SPI SPI Flash 2M bytes Flash 1M bytes 26MHz OSC 2.4GHz radio U.F.
[Page 6] 1.2 Pin Designation EMW3166 owns two groups of pins (1X20 + 1X21). The lead pitch is 1mm. EMW3166 has half-hole footprint fit for hand-soldering EMW3166 pinouts: Figure 5 Half-hole package dimension 1.3 Recommended Footprint Design Recommended footprint (Unit: mm): Figure 6 Recommended Footprint 1.
[Page 7] Table 1 EMW3166 pin arrangement Pins Name Type I/O level 1 2 3 - - PB2 I/O - - Functions Note FT NC GPIO BOOT1 - √ NC SPI2_MOSI GPIO TIM12_CH2 I2S2_SD √ GPIO CAN2_RX I2S2_WS √ FT SPI2_SCK GPIO CAN2_TX I2S2_CK √ 7 PB14 I/O FT SPI2_MISO GPIO TIM12_CH1 8 PC6 I/O FT UART6_TXD GPIO TIM3_CH1 9 PA15 I/O FT GPIO 10 VBAT S - VBAT 11 - 4 PB15 I/O FT 5 PB12 I/O FT SPI2_NSS 6 PB13 I/O - - I2S2_MCK JTDI TIM2_CH1 USART1_TXD ×DEBUG_OUT ×（EasyLink） × NC UART6_RX
[Page 8] Pins Name Type I/O level Functions I2C1_SDA GPIO TIM4_CH4 18 PB9 I/O FT 19 PB10 I/O FT GPIO TIM2_CH3 Note CAN1_TX √ I2S2_CK √ 20 GND S - GND × 21 GND S - GND × 22 - - - NC 23 - - - NC 24 - - - NC 25 PA14 I/O FT SWCLK × 26 PA13 I/O FT SWDIO × 27 PB3 I/O FT GPIO 28 - - TIM2_CH2 USART1_RXD - √ NC 29 PB7 I/O FT UART1_RXD GPIO TIM4_CH2 I2C1_SDA √ USER_UART_RX 30 PB6 I/O FT UART1_TXD GPIO TIM4_CH1 I2C1_SCL 31 PB4 I/O FT 32 - - GPIO JT
[Page 9] Pins Name Type I/O level Functions Note 37 PB0 I/O FT GPIO ADC1_8 ×（STATUS） 38 PA4 I/O TC GPIO ADC1_4 √ 39 VDD S - 3.3V × 40 VDD S - 3.3V × 41 ANT - - ANT × Notes: 1. PIN10, PIN39, PIN40 need connect to VDD 3V3 power and PIN20, PIN21 connects to GND. 2. PIN8 and PIN12 are used for secondary burning, ATE and QC auto detection. 3. PIN29 and PIN30 are used as serial communication port for application. 4.
Application Note [Page 10] 2. Hardware design attention 2.1 Mechanical dimensions EMW3166mechanical dimension of vertical view: Figure 3 Vertical view EMW3166 mechanical dimension of side view: Figure 4 side view 2.2 Recommended package design The figure followed below is the recommended package design MXCHIP suggested while designing the baseplate. The solder window has the same size of the pad.
Application Note [Page 11 Figure 5 Recommended Package for SMT 2.3 DC power design Peak current of EMW3166 is about 320mA. The DC/DC power chip MXCHIP recommended should be whose maximum output current is over 600mA. DC/DC gets more superiority on power conversion than LDO. When using DC/DC power chip, except for the requirements of output voltage (3.3V) and maximum current (600mA), application designer should pay more attention on the arrangement of wires.
[Page 12] Application Note 2.5 RF design 2.5.1 PCB antenna design When integrating the WiFi module with on board PCB printed antenna, make sure the area around the antenna end the module protrudes at least 15mm from the mother board PCB and any metal enclosure. The area under the antenna end of the module should be keep clear of metallic components, connectors, sensors, traces and other materials that can interfere with the radio signal.
Application Note Figure 8 Module Position Recommended on Mother Board 2.5.2 T U.F.L RF Connector Make sure the connector is matched when choosing the external antenna. Mechanical dimensions of U.F.L RF connector shows as followed.
Application Note [Page 14] Figure 9 U.F.L Connector Size 2.6 ESD design ESD grade of module: Human Body Model (HBM) sensitivity is 2000V, Charged Device Model (CDM) sensitivity is 500V. If a higher ESD level is required, the pins that may be connected to the outside should be reserved place for the ESD protection device. If the module connects the mother board by outside leads, application designers should notice the EMI problems.
Application Note [Page 15] 3. Firmware programming and warehousing detection method 3.1 Receiving Inspection Device List Auxiliary Equipment list shows below: Table 1 Warehousing Detection Auxiliary Equipment List Auxiliary Equipment Quantity PC 1（pcs） Fixture 1（pcs） EMWE-3166-A V1.0 Development Board 1（pcs） Note: It is not for sale in above the table Auxiliary Equipment. Application software and firmware: FT230XS (drivers on PC), download link: http://www.ftdichip.com/Drivers/VCP.
Application Note [Page 16] Set as followed: Property Set ports Bit Data bits parity None stop data flow control None Reset Ensure Cancel Apply Figure 11 Hyper Terminal Setting Connection 3.3.2 Module testing Click “connect” in “Hyper Terminal” to connect the PC to EMWE-3166-A V1.0 development board. Place the module on the fixture. Press down the handle. 3.3.3 Testing result It lists the testing result from serial on “Hyper Terminal”.
Application Note [Page 17] version Liblary version Application version Driver version MAC Address Hotspot Name signal strength Figure 12 Testing Results 3.4 Statements MXCHIP has the obligation to guarantee there is no quality problem for the module delivered at each batch. If problems are found while sampling module, customer has the right to require MXCHIP to give a timely replacement.
Application Note [Page 18] 4. SMT matters 4.1 Note for stencil aperture The recommended stencil aperture: 0.12mm (0.1~0.15mm), laser polishing hole. The recommended solder paste is SAC305 and lead free. The recommended extend length of welding pad: 0.15mm. It can enhance the adhesive ability of solder as shown below. It can check the right position of the module by eyes if using SMT line without AOI testing to reduce the risk of cold solder joint. Figure 13 Recommended Stencil Aperture 4.
Application Note Figure 14 Reflow soldering temperature curve EMW3166_Guide For User Design [Page 19]
Application Note [Page 20] 5. Mass production testing and firmware upgrading In addition to considering the product features, application designer need to think over how to do test and upgrade firmware when developing. 5.1 Mass production test Avoid finding problem after installing the PCB boards in machine 5.1.1 EMSP command way Connect the module to the MCU of the mother board by serial port and use the EMSP command.
Application Note [Page 21] 6. Firmware encrypt In order to make sure the firmware could not be modified after programming in the module, firmware must be encrypted with the bootloader drivers and the chip ID MXCHIP offered. Bootloader driver is used to drive the device in the module and integrated with one AES encryption way.
Application Note 7. Sales and technical support information If you need to buy this product, please call MXCHIP during the working hours. (Monday ~ Friday ： A.M. 9:00~12:00; P.M. 1:00~6:00) Telephone: +86-021-52655026 Address: 9th Floor, 5# building, Lane 2145, Jinshajiang Road, Putuo District, Shanghai Post Code: 200333 Email: sales@mxchip.com Company email: http://www.mxchip.com For the latest information about products, please refer to: http://www.mxchip.com Related technical support please contact: a.
Application Note [Page 23] 8. FCC Statement FCC identification number is not visible when the device is installed inside another device, then the outside of the device into which the device is installed must also display a label referring to the enclosed device. This exterior label can use wording such as the following: “Contains FCC ID:P53- EMW3166” This device complies with part 15 of the FCC Rules.
