EMW3081 Date Sheet Embedded Wi-Fi module Version：1.0 Date：2016-2-23 Number： Overview Features 1x HS UART zSupport 802.11 b/g/n standard，Consists of a 1x I2C Cortex-M3 microcontroller, WLAN MAC, Base Band and RF. z512 KB SRAM ,2 MB SDRAM and 2 MB FLASH configuration zOperating Voltage：DC 3.3V zWhen uses 20MHz bandwidth, the maximum transmission rate reached 72.2Mbps zWhen uses 40MHz bandwidth, the maximum transmission rate reached 150Mbps zWi-Fi related features Support 802.
Copyright statement: Without permission, prohibition of the use or copying any content of this manual in whole or in part, and this applies especially to brand, model name, part number and diagram.
Content Overview .................................................................................................................................................................................. 1 1. 2. 3. Product summary ......................................................................................................................................................... 4 1.1. Pinouts ....................................................................................................................
Table 3. Rated voltage parameters ........................................................................................................................... 8 Table 4. EMW3081 power parameters..................................................................................................................... 8 Table 5. Temperature and humidity conditions ................................................................................................... 9 Table 6.ESD parameters .............................
Table 5. Temperature and humidity conditions ................................................................................................. 9 Table 6.ESD parameters .............................................................................................................................................. 9 Table 7.RF Standard....................................................................................................................................................
1.Product summary EMW3081 is a low-power and high performance embedded Wi-Fi module, which highly integrates ARM-Cortex M3, WLAN MAC/baseband/RF, and built-in 512KB SRAM and 2MB SDRAM， EMW3162 is 3.3V single-power supply，supports stamp hole SMT or DIP，and supports serial transmission and development two times，peripheral： 1x HS UART / 1x SPI /1x I2C / 4x PWM / Up to 15 GPIOs.
1.1. Pinouts EMW3081 uses DIP packages and stamps hole packages interface design，DIP packages（figure 2）can effectively reduce the risk of quality of secondary patch；Stamp hole packages（figure 3） facilitate customers to debug and easy installation, designed to provide customers diversity selection. Windows and solder pads have the same size ， recommended SMT stencil thickness is 0.12mm-0.14mm. Figure 2.DIP package dimension Figure 3.
1.2. Pins Definition Table1.
7
2.Electrical Parameters 2.1 Operating Conditions EMW3081 input voltage falls below the minimum rated voltage will cause instability. Must note this point when designed power supply. Table 2. Input voltage range Detail Symbol Description VDD Condition Power supply Min Typ Max Unit 3.0 3.3 3.6 V Stresses above the absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied.
n TX(when power CPU clock at 166MHZ, UART/SPI/I2C is 260mA transmission is 13 dBm) available, Wi-Fi operates in 11n TX data transmission mode Note: The test data at different firmware versions may be different. 2.3 Operating Environment Table 5. Temperature and humidity conditions Symbol TSTG TA Humidity Name Storage temperature Operate temperature Range Unit -40 to +85 ℃ -20 to +85 ℃ 95 % Noncondensing , relative humidity 2.4 ESD Table 6.
10
3.RF Parameters 3.1. General Specification Table 7.RF Standard project Instructions Operating Frequency 2.412~2.462GHz Wi-Fi Standard IEEE802.11b/g/n 11b：1,2,5.5,11Mbps 11g : 6,9,12,18,24,36,48,54Mbps 20MHz 11n : MCS0~7, 72.
4.Antenna Information 4.1. Antenna type EMW3081 have two antenna types: PCB built-in antenna and external antenna, the models are EMW3081-P and EMW3081-E. Figure 4. EWM3081‐P Figure 5. EMW3081‐E 4.2. PCB antenna design requirements Components are strictly forbidden to place in the surrounding 15mm of PCB antenna area in module.
Figure 6. PCB antenna minimum clearance zone（Unit: mm） 4.3. Approved External Antenna Specification Model Name:IPEX1.13-2.4G Brass Pipe Antenna-L32 Manufacture Name: Shenzhen Zhengda Letter Communications Equipment Co.,Ltd NO. NAME DESCRIPTION QUANTITY PART NUMBER 1 Cable L =32±2mm 1 1301-0010 2 Brass Pipe 4.
3 IPEX 20278-113R 1 1101-0001 Gain: <2.0dBi Impedance: 50OHM Frequency Range: 2400-2500MHz VSWR <2.0 To meet requirements of design, External Antenna must satisfy parameters above.
4.4. U.F.L RF Connector Figure 7.
5.The assembly information and manufacturing guidance 5.1. Mechanical dimensions Figure 8. Side View（Unit: mm） Figure 9. Vertical View（Unit: mm） Figure 10.
5.2. Use guidelines(Please read carefully) zStamps Wi-Fi modules from MXCHIP must be soldered with SMT machine.
Table 11.
color ring, need to continue to bake for 14 hours module; zBaking parameters are as follows: Baking temperature: 125 ℃ + / - 5 ℃; Set the alarm temperature as 130 ℃; Under the condition of natural cooling < 36 ℃, SMT placement can be made; Dry times: 1 times; zIf opened the time more than 3 months, please ban the use of SMT process welding this batch module, zedoary because PCB process, more than 3 months bonding pad oxidation, SMT is likely to cause virtual welding, welding, the resulting problems we
zDon't open the door, as far as possible when baking box running if must open, shortening the time of can open the door as far as possible; zAfter baking, must be natural cooling modules to < 36 ℃ before wear anti-static gloves out, so as not to burn. zOperation, forbidden module bottom touch water or dirt; zTemperature and humidity control level for Level3, storage and baking conditions based on IPC/JEDEC J - STD - 020. 5.4. MSL/Storage Condition Figure 12. Storage Condition 5.5.
Figure 13.
6.
7.Firmware encrypt Firmware version : 0000.0000.AL10 In order to make sure the firmware could not be modified after programming in the module by unauthorized party, firmware must be encrypted with the bootloader drivers and the chip ID MXCHIP offered. Bootloaderdriver is used to drive the device in the module and integrated with one AES encryption way.
8.FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the user's authority to operate the equipment.
between the radiator & your body. This module is only used into fixed host applications. The module is only for integration in fixed applications. Label Information to the End User by the OEM or Integrators This Module used affixed label with FCC ID: P53-EMW3081. If the FCC ID of this module is not visible when it is installed inside another device, then the outside of the device into which the module is installed must be label with "Contains FCC ID: P53-EMW3081".
Changes or modification unapproved on module may break compliance, otherwise additional approvals are performed. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.
9.Sales Information and Technical Support If you need to get the latest information on this product or our buy this product，please call us during the working hours. Office hours： From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9F, 5 Building, No.2145 Jinshajiang Road, Shanghai, China Postcode : 200333 Email: sales@mxchip.
