EMW3072 Datasheet Embedded Wi-Fi Module Version：1.2 Date：2019-07-28 Number：DS0151EN Abstract Application ⚫ Intelligent Lighting ⚫ Supports 802.11b/g/n standard, integrates ARM-CM4F, WLAN MAC/Baseband/RF. ⚫ Smart Home/Home Appliances ⚫ Industrial Automation ⚫ Contains 256KB RAM/2MB FLASH ⚫ Intelligent Security ⚫ Operation voltage：DC 3.
Datasheet [Page 1] Version Record Data Version 2019-05-20 1.0 Update Note Initial version Revise supply voltage to 3.3V. 2019-05-30 1.1 PWM9 in pin13 function table is corrected to PWM0, PIN14 is removed as the annotation of PWM1. Definition of Pin2 is changed to PWM1 and revised. 2019-07-30 1.
Datasheet [Page 2] Catalogue Abstract ................................................................................................................................................................................. 1 Version Record...................................................................................................................................................................... 1 1. Product Introduction.....................................................................................
Datasheet [Page 3] Figure Catalogue Figure 1 EMW3072 Hardware Block and Interface ........................................................................................ 4 Figure 2 EMW3072 label picture.................................................................................................................... 5 Figure 3 Stamp Hole Packaging Dimension Diagram ..................................................................................... 6 Figure 4 EMW3072 Packaging Definition Diagram ......
Datasheet [Page 4] 1. Product Introduction EMW3072 is a cost-effective embedded W-Fi module launched by Shanghai Qingke (MXCHIP). It is highly integrated with ARM CM4F, WLAN MAC/Baseband/RF, with a maximum main frequency of 240MHz, built-in 256KB SRAM, 2M FLASH and 3.3V single power supply. The following diagram is the hardware block diagram of EMW3072 module, which mainly includes four parts: ⚫ CM4F main core ⚫ WLAN MAC/BB/RF/ANT ⚫ SWD debugging ⚫ Power management Among them: 1.
Datasheet [Page 5] EMW3072 Label Information Figure 2 EMW3072 label picture Label Information: CMIIT ID: XXXXXXXXXXXXX, SRRC Authentication ID. FCC ID: P53-XXXXXXXX, FCC Authentication ID. MXCHIP: Company Logo. EMW3072 : Module Main Model. D0BAE45000DF: MAC Address(Each module has a unique MAC address). X1916：Production batch. 0000.0000.A213: Module Firmware Serial Number. This device complies with part 15 of the FCC Rules.
Datasheet Figure 3 Stamp Hole Packaging Dimension Diagram TOP VIEW EMW3072 [Page 6]
Datasheet [Page 7] Pin Definition 1.3.1 EMW3072 Package Definition Figure 4 EMW3072 Packaging Definition Diagram 1.3.
Datasheet 10 I2C0_SDA 11 I2C0_SCL 12 I2C0_SDA 13 STRAP/SEL1 14 MODE_SEL3 15 SDIO_INT SDIO_INT [Page 8] UART1_RXD SPI1_MOSI GPIO_3 UART1_TXD SPI1_MISO GPIO_2 UART1_RXD SPI1_MOSI GPIO_3 UART1_CTS PWM0 SPI2_SCK GPIO_14 UART1_CTS PWM1 SPI2_SCK GPIO_10 SWD UART0_RXD PWM7 SPI1_SCK GPIO_1 16 SWC UART0_TXD PWM5 SPI1_CSN GPIO_0 17 BOOT UART2_TXD SPI2_CSN GPIO_12 18 PAD_SEL ADC7 Description: (1) PIN 17 pin is used by BOOT by default, PIN 3 pin is used by EASYLINK, PIN
Datasheet [Page 9] 2. Electrical Parameters Operating Ratings Be noticed that when the input voltage is lower than the minimum rated voltage, EMW3072 may work abnormally. Please pay attention while designing power circuit. Table 2 Input voltage range Detail Symbol VDD Description Condition Power supply Min. Typ. Max. Unit 3.
Datasheet Power Save mode(Idle) Monitor mode [Page 10] 12.4mA 58.3mA Wi-Fi is in connection state, MCU is in idle state 56.5mA 59.3mA Wi-Fi start monitor mode Notice: the power consumption data may be different in different firmware. MAX working circuit is 290mA.
Datasheet [Page 11] 3. RF Parameters Basic RF Parameters Table 7 RF Standard Item Description Frequency Range 2412~2.462MHz Wi-Fi Wireless Standard IEEE802.11b/g/n 11b: DBPSK, DQPSK,CCK for DSSS Modulation Mode 11g: BPSK, QPSK, 16QAM, 64QAM for OFDM 11n: MCS0~7,OFDM 11b：1,2,5.5 和 11Mbps Data Rate 20MHz 11g : 6,9,12,18,24,36,48,54Mbps 11n : MCS0~7,65Mbps Antenna Type PCB antenna （Default） TX Performance 11g: BPSK, QPSK, 16QAM, 64QAM for OFDM 11n: MCS0~7,OFDM 3.2.1 IEEE802.
Datasheet 3. Frequency Offset [Page 12] -15 -1.5 +15 ppm 4. EVM( Peak EVM) 35%（or 11dB） 1) 1~11Mbps 3.2.2 IEEE802.11g mode TX Performance Table 9 IEEE802.11g Mode OFDM_54 TX Performance Parameters Item Description Mode IEEE802.11g Channel CH1 to CH13 Rate 6, 9, 12, 18, 24, 36, 48, 54Mbps TX Performance Minimum Typical. Maximum Unit Remark 14.0 15.5 17 dBm 6Mbps 13.0 14.5 16 dBm 54Mbps 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr -40 dBr 1.
Datasheet 3.2.3 [Page 13] IEEE802.11n-HT Mode TX Performance Table 10 IEEE802.11n-HT 20MHz Mode MCS7 TX Performance Item Description Mode IEEE802.11n HT20 Channel CH1 to CH13 Rate MCS0/1/2/3/4/5/6/7, maximum 65Mbps TX Performance Typical. Maximum 13.5 15 12 1) at fc +/- 11MHz 2) at fc +/- 20MHz 1.Output Power Minimum Unit Remark 16.5 dBm MCS0 13.5 15.0 dBm MCS7 - - -20 dBr - - -28 dBr -45 dBr 2.Spectrum Template 3) at fc > +/-30MHz -15 -1.
Datasheet IEEE802.11g. Mode RX Performance 3.3.2 RX Minimum Receiving Sensitivity 3.3.3 Minimum Typical. Maximum Unit 6Mbps (FER≦10%) - -92.5 -92.5 dBm 54Mbps (FER≦10%) - -76 -75.5 dBm Minimum Typical. Maximum MCS0 (FER≦10%) - -92.5 -92 dBm MCS7 (FER≦10%) - -73 -73 dBm Remark IEEE802.11n HT20 Mode RX Performance RX Minimum Receiving Sensitivity 3.3.4 [Page 14] Unit Remark IEEE802.11n HT40 Mode RX Performance RX Minimum Receiving Sensitivity Minimum Typical.
Datasheet [Page 15] 4. Antenna Information Antenna Type EMW3072 only has PCB antenna model. Figure 5 EMW3072 Drawings Table 11 PCB Antenna PCB Antenna Information Frequency Range 2412MHz~2462MHz 50Ω Impedance VSWR Gain Efficiency <2 2dBi≥Gain>0.8dBi >50% or >-3dB Note: The above conditions are obtained under the condition of module welding to motherboard and darkroom testing.
Datasheet Figure 6 PCB Minimum clearance area of antenna（Unit: mm） EMW3072 [Page 16]
Datasheet [Page 17] 5. Production Instruction Production Guidelines Qingke stamp port packaging module must be SMT machine patches, module humidity sensitivity grade MSL3, after unpacking more than a fixed time patches to bake module. SMT need machine: 1. Reflow soldering SMT machine 2. The AOI detector 3. 6-8 mm diameter suction nozzle Baking need equipment: 1. Cabinet baking box 2. The antistatic, high temperature resistant tray 3.
Datasheet [Page 18] ⚫ If opened the time more than 3 months, please ban the use of SMT process welding this batch module, zedoary because PCB process, more than 3 months bonding pad oxidation, SMT is likely to cause virtual welding, welding, the resulting problems we do not assume corresponding responsibility.
Datasheet Storage Condition Figure 8 Storage Condition EMW3072 [Page 19]
Datasheet [Page 20] Recommended Reflow Profile Solder paste recommendations: SAC305, Lead -Free solder paste. Reflow times should be no more than twice.
Datasheet [Page 21] 6. Reference Circuit The EMW3072 power supply reference circuit is shown in Figure 10, Figure 10 USB serial port reference circuit and Figure 11 external interface reference design for user reference. Figure 10 Power Reference Circuit Figure 11 USB to UART Reference Circuit Figure 12 EMW3072 External Interface Reference Design EMW3072 UART is 3.3V UART. If the UART of the chip is 5V, the user needs to convert 5V U ART to 3.3V UART to communicate with EMW3072 UART. The 5V-3.
Datasheet Figure 13 3.
Datasheet [Page 23] 7. FCC and IC Information FCC Warning Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
Datasheet [Page 24] Note：The host product manufacturers need to provide a physical or e-label stating “Contains FCC ID” with their finished product.
Datasheet [Page 25] 8. Module MOQ and packaging information Table 12 Module MOQ and packaging information Material number MOQ(pcs) Shipment packing method Outer packing box size Remark 650pcs/volume， EMW3072 650 Tape reel 385*275*370(mm) EMW3072 one volume in one box four boxes in one case.
Datasheet [Page 26] 9. Sales Information and Technical Support If you need to get the latest information on this product or our other product information, you can visit: http://www.mxchip.com/. If you need to get technical support, please call us during the working hours. From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86 (021)52655026 Email: sales@mxchip.com Postcode: 200333 Contact address: 9F, 5 Building, No.
