EMC3080 Wi-Fi/BLE Module Built-in Cortex-M33 MCU Datasheet 2.4G Hz IEEE 802.11 b/g/n, BLE4.2, ultra-high integration, rich peripherals version：0.5 data：2020-05-13 Number：DS0156EN Abstract ⚫ Input Voltage：3.0V~3.
EMC3080 Series Wireless Module Data Manual Order Code For example, EMC 3 08 0 -P I 5 -xxx Product Series EMC=IoT Wi-Fi/BLE Module Product Type 3=Welding type wireless module Typical target applications and features 08=IOT Application 8 Series Dimensions, enhancements 18mm x 33mm, 2 x 6pin 2.0 Spacing double row stamp hole + 9 pin 2.0 Spacing stamp hole or pin 2.0 Spacing stamp hole or pin RF Interface P=2.4GHz On-Board PCB Antenna E=2.
EMC3080 Series Wireless Module Data Manual Version Update Instructions Date Version Update Contents 2019-12-06 0.1 First edition 2020-01-08 0.2 Improve power consumption parameters and RF parameters 2020-03-12 0.3 Pin definition update 2020-04-22 0.4 Label update, power consumption data update 2020-05-13 0.
EMC3080 Series Wireless Module Data Manual Contents INTRODUCTION ..................................................................................................................................................... 5 PIN DEFINITION ..................................................................................................................................................... 6 Pin Arrangement ...............................................................................................................
EMC3080 Series Wireless Module Data Manual Table 15 RF TX Parameters in IEEE802.11n HT20 mode ......................................................................................... 13 Table 16 RF RX Parameters in IEEE802.11n HT20 mode ......................................................................................... 13 Table 17 EMC3080 BLE4.2 TX/RX Parameters ..........................................................................................................
EMC3080 Series Wireless Module Data Manual Introduction The EMC308x series modules are mainly used for IoT data communication. Data collection and control are realized through a rich peripheral interface, and data can be transmitted to the Internet of Things cloud service platform through a Wi-Fi network connection to realize the Internet of Everything.
EMC3080 Series Wireless Module Data Manual Pin Definition Pin Arrangement Figure 2 Pin Arrangement 1 25 2 24 3 23 4 22 5 21 6 20 7 19 8 18 9 10 11 12 13 14 15 16 17 Pin Definition Table 1 pin definition Pin Number Name Main Function (After Reset) PWM UART I2C SPI 1, 3 PA_0 SWCLK PWM_0 UART1_RX 2, 4 PA_1 SWDIO PWM_1 UART1_TX 5 NC 6 PA_4 PA_4 PWM_4 UART1_CTS 7 PA_2 PA_2 PWM_2 UART1_RX I2C_SCL SPI_CS 8 PA_3 PA_3 PWM_3 UART1_TX I2C_SDA SPI_CLK 9 PA_14
EMC3080 Series Wireless Module Data Manual Notes： 1. Module working mode selection signal. During the startup phase, the module detects the level of these pins and enters a specific working state.
EMC3080 Series Wireless Module Data Manual during which the IO is pulled to the high level is about 20ms. Figure 3 IO The power-on state interface 5. The processing of chip pins inside the module is as follows: ⚫ PA_0, PA_1, PA_23: 10K pull-down resistor. ⚫ CHIP_EN: 100K pull-up resistor and 22nF capacitance to ground.Electrical Parameter Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
EMC3080 Series Wireless Module Data Manual Electric Parameter Absolute Maximum Parameters Operation of the module outside of its absolute maximum ratings may result in permanent damage. At the same time, long-term exposure to the maximum rated conditions will affect the reliability of the module. Table 3 Absolute Maximum Parameter：Voltage Symbol Ratings Min Max Unit VDD–VSS Voltage –0.3 3.6 V VIN Input voltage on any other pin VSS−0.3 VDD+0.
EMC3080 Series Wireless Module Data Manual (2). Flash power consumption is not included in the data in Table 6. When reading code or reading and writing data from the Flash, the power consumption of the Flash is not higher than 20mA, and the power consumption of the Flash in standby mode (CS signal is pulled high) is not higher than 50mA. General I/O interface Table 6 DC current: digital I/O Symbol Note Conditions VIH Input-High Voltage VIL Specification Min. Typical Max. Unit LVTTL 2.
EMC3080 Series Wireless Module Data Manual Temperature Table 8 Temperature and humidity parameters Symbol Ratings Max Unit TSTG Storage temperature –55 to +125 ℃ Twork Ambient Operating Temperature -20 to +85 ℃ TJun Junction Temperature 0 to +125 ℃ k ESD Table 9 Electrostatic discharge parameters Symbol Name Name Level Max.
EMC3080 Series Wireless Module Data Manual IEEE 802.11b mode Table 11 RF TX Parameters in IEEE802.11b mode TX Characteristics Min. Typical Max. Unit 14 16 18 dBm fc +/-11MHz to +/-22MHz -30 dBr fc > +/-22MHz -50 dBr ＋10 ppm Transmitter Output Power 11b Target Power Spectrum Mask Frequency Error -10 -2 Constellation Error (peak EVM) 1~11Mbps -15.5 35%（or -11dB） Table 12 RF RX parameters in IEEE802.11b mode RX Characteristics Min. Typical Max.
EMC3080 Series Wireless Module Data Manual Table 14 RF RX Parameters in IEEE802.11g mode RX Characteristics Min. Typical Max. Unit 6Mbps (FER≦10%) -92 - dBm 54Mbps (FER≦10%) -75 - dBm Minimum Input Level Sensitivity IEEE802.11n HT20 Table 15 RF TX Parameters in IEEE802.11n HT20 mode TX Characteristics Min. Typical Max. Unit Transmitter Output Power 11n Target Power@MCS0 11 12.5 14 dBm 11n Target Power@MCS7 11 12.
EMC3080 Series Wireless Module Data Manual EMC3080 Bluetooth RF Parameters Table 17 EMC3080 BLE4.2 TX/RX Parameters Item DataRate Min Typical Max Unit POWER_AVERAGE LE_1M 6 8 10 dBm Frequency Drift Error LE_1M -50 -5 50 KHz -150 6.1 150 KHz Carrier frequency offset and drift at NOC: ∆Fn max LE_1M |F0-Fn| LE_1M 2.37 50 KHz |F1-F0| LE_1M 2.1 20 KHz |Fn-Fn5| LE_1M 0.
EMC3080 Series Wireless Module Data Manual Antenna Information EMC3080 has two specifications: PCB antenna and external antenna, please refer to the order code for order. IPX antenna connectors are not soldered on the modules using PCB antennas. By connecting an external antenna through an IPX connector, you can get better RF performance. PCB antenna parameters and use 4.1.1. On-board PCB parameter Table 18 On-board PCB parameter Item Min. Frequency 2400 Impedance Typical Max.
EMC3080 Series Wireless Module Data Manual The following is a copper tube antenna with an IPEX connector commonly used by MXCHIP: Figure 5 Copper tube antenna size ⚫ Frequency range：2400-2500 MHz ⚫ Input independace：50 OHM ⚫ VSWR：< 2.0 ⚫ Gain：2.0DBI ⚫ Polarization: vertical ⚫ Directivity: Omnidirectional ⚫ Copper tube: 4.4 * 23mm ⚫ Wire: 1.
EMC3080 Series Wireless Module Data Manual Dimensions and Production Guidance Assembly Dimension Diagram Figure 7 Assembly Dimension Diagram（unit: mm, tolerance: ±0.1, outside tolerance±0.2） ） Recommended Package Drawing The solder resist window and the pad size are the same. SMT recommends a steel mesh thickness of 0.12mm-0.14mm. Figure 8 DIP package dimension(unit: mm) Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
EMC3080 Series Wireless Module Data Manual Figure 9 Stamp hole package size (mounting pad, unit: mm) Figure 10 Stamp hole package size (no mounting pad, unit: mm) Notes: The two-dot chain line indicates the outline of the module, and components cannot be arranged on the main board in the outline. The hatching in the middle oblique line indicates the mounting pad of the module on the main board and expresses the size of the mounting position of the module on the main board.
EMC3080 Series Wireless Module Data Manual Production Guidelines MXCHIP stamp port packaging module must be SMT machine patches, module humidity sensitivity grade MSL3, after unpacking more than a fixed time patches to bake module.
EMC3080 Series Wireless Module Data Manual If the disassembly time exceeds 3 months, SMT process is forbidden to weld this batch of modules, because PCB gold deposition process, over 3 months, pad oxidation is serious, SMT patch is likely to lead to virtual welding, leak welding, resulting in various problems, our company does not assume the corresponding responsibility; Before SMT patch, ESD (Electrostatic Discharge, Electrostatic Release) protection should be applied to the module.
EMC3080 Series Wireless Module Data Manual Storage Condition Figure 12 Storage Conditions Diagram Secondary Reflux Temperature Curve We recommend solder paste model: SAC305, lead-free. No more than 2 reflux times. Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
EMC3080 Series Wireless Module Data Manual Figure 13 Reference Secondary Reflux Temperature Curve Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
EMC3080 Series Wireless Module Data Manual FCC and IC Information FCC Warning ✓ Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. ✓ Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
EMC3080 Series Wireless Module Data Manual Label Information Figure 14 Module Label Schematic Diagram 1. MXCHIP: Company Logo. 2. CMIIT ID: SRRC Model Authorization ID 3. FCC ID: FCC Model Authorization ID 4. EMC3080-P: Product Main Type. 5. ZI5: Product Auxiliary Model. 6. X19521: Production serial number 7. B0F893100008: MAC Address. Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
EMC3080 Series Wireless Module Data Manual Sales and Technical Support Information If you need to consult or purchase this product, please call Shanghai MXCHIP Information Technology Co., Ltd. during office hours. Office hours: Monday to Friday morning: 9:00-12:00, afternoon: 13:00-18:00 Contact Tel: +86-21-52655026 Address: 9th Floor, Lane 5, 2145 Jinshajiang Road, Putuo District, Shanghai Zip code: 200333 Email: sales@mxchip.com Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
TB1206 Product specification 10.1 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g.
TB1206 Product specification 10.3 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc.
TB1206 Product specification 10.6 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.
