EH-MC30 Low Energy Module Data Sheet EH-20170218-DS Rev1.1 Ehong Technology Co.,Ltd • Bluetooth® Radio - Fully embedded Bluetooth® v4.2 single mode - TX power+1.
VERSION HISTORY Version Comment V1.0 Current consumption added V1.1 Certification information updated. Confidential and Proprietary – Ehong Technology Co.,Ltd NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: DCC@ehlink.com.cn. Restricted Distribution: Not to be distributed to anyone who is not an employee of either Ehong Technology Co.,Ltd or its affiliated companies without the express approval of Ehong Configuration Management.
EH-MC30 1. Contents 1. Description .........................................................................................................................................................5 2. Applications .......................................................................................................................................................5 3. EH-MC30 Product numbering ......................................................................................................................
2. Table of Tables TABLE 1: RECOMMENDED OPERATION CONDITION ......................................................................................................5 TABLE 2: ABSOLUTE MAXIMUM RATING........................................................................................................................6 TABLE 3: ESD PROTECTION .........................................................................................................................................6 TABLE 4: CURRENT CONSUMPTION ..
EH-MC30 1. Description EH-MC30 Bluetooth® low energy single mode module is a single mode device targeted for low power sensors and accessories. The module offers all Bluetooth® low energy features V4.2: radio, stack, profiles and application space for customer applications, internal integration Cortex-M0 CPU so no external processor is needed. The module also provides flexible hardware interfaces to connect sensors, simple user interfaces or even displays directly to the module.
4.2 Absolute Maximum Rating Min Max Unit Storage Temperature -40 +125 °C Battery (VBAT) operation* -0.3 3.9 V I/O supply voltage -0.3 +VDD+0.3V V Vss-0.4 VBAT+0.4 V Rating Other Terminal Voltages except RF Table 2：Absolute Maximum Rating * Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V.
EH-MC30 5. Pinout and Terminal Description 5.1 Pin Configuration Figure 1： Pinout of EH-MC30 Symbol Pin PAD Type Description GND 1 Ground Ground GND 2 Ground Ground GND 3 Ground Ground GND 4 Ground Ground GND 5 Ground Ground GND 6 Ground Ground GND 7 Ground Ground VBAT 8 Power supply SWDCLK 9 Digital input Hardware debug and flash programming I/O. Power supply 3.3V SWDIO 10 Digital IO System reset (active low). Hardware debug and flash programming I/O. P0.
P0.22 12 Digital IO General purpose I/O pin P0.23 13 Digital IO General purpose I/O pin. P0.24 14 Digital IO General purpose I/O pin P0.25 15 Digital IO General purpose I/O pin P0.29 16 Digital IO General purpose I/O pin VBAT 17 Power supply GND 18 Ground Ground P0.30 19 Digital IO General purpose I/O pin P0.00 (AREF0) 20 Digital IO Analog input General purpose I/O pin ADC/LPCOMP reference input 0 P0.
EH-MC30 - Figure 2： Power Supply PCB Design 6.2. PIO The general purpose I/O is organized as one port with up to 19 I/Os (dependent on package) enabling access and control of up to 19 pins through one port.
Parameter Baud Rate Possible Values 1200 baud (≤2%Error) Minimum 9600 baud (≤1%Error) 2M baud (≤1%Error) Maximum Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Byte 8 Table 6: Possible UART Settings Figure 3： Connection To Host device 6.6. I2C Master/ Slave The module has 1 I²C master/slave general interface for communication with external peripherals and sensors. Symbol Description Note I2W100K Run current for TWI at 100 kbps. I2W400K Run current for TWI at 400 kbps.
EH-MC30 Figure 5： SCL/SDA timing Standard Symbol Min. fSCL SCL clock frequency. Max. Min. Max. 100 tHD_STA Hold time for START and repeated START condition. tSU_DAT Data setup time before positive edge on SCL tHD_DAT Data hold time after negative edge on SCL. tSU_STO Setup time from SCL goes high to STOP condition. tBUF Fast Description Bus free time between STOP and START conditions.
Figure 8：SPI timing diagram, one byte transmission, SPI mode Units Test level 10 ns 1 10 ns 1 ns 1 40 ns 1 SCK high time. 40 ns 1 fSCK SCK frequency. 0.125 MHz 1 t R, t F SCK rise and fall time. ns 1 Symbol Description tDC Data to SCK setup. tDH SCK to data hold. tCD SCK to data valid. tCL SCK low time. tCH Note Min. Typ. Max. 972 CLOAD = 10 pF Figure 9： SPI timing parameters 6.8.
EH-MC30 7. Reference Design Figure 10： Reference Design 8. Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 3. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND via as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines.
9. Mechanical and PCB Footprint Characteristics Figure 12：Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.02mm) 10. EH-MEVK-MC30 10.1.
EH-MC30 A. B. C. EH-MEVK-MC30 has two power supplies: LDO_3V3 and cell battery. USB RS232 interface, connect to module UART. SWD PIN, Button and LED interface. D. Any more information, please document of EH-MEVK-MC30 using guide. 10.2.
11. Packing Figure 15： EH-MC30 Packaging（Pallet） Remark: Packing for the pallet，one packaging quantity is 80 PCS。 12. Soldering Recommendations EH-MC30 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.
EH-MC30 13. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Website：http://www.ehlink.com.cn Phone: +86 21 64769993 Fax: +86 21 64765833 Street address: Rom505, Blk 1st ,No.
FCC/IC Statements (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band).
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal.
