EH-MC20 Bluetooth® technology low energy module • Bluetooth® radio - Fully embedded Bluetooth® v4.
Bluetooth Low Energy Module 1. Contents 1. Description ................................................................................................................................................................ 4 2. Applications .............................................................................................................................................................. 4 3. EH-MC20 Product numbering ..................................................................................
Bluetooth Low Energy Module 11. Reflow Profile ..................................................................................................................................................... 16 12. Contact Information ......................................................................................................................................... 17 2. Table of Tables TABLE 1: RECOMMENDED OPERATION C ONDITIONS .................................................................................
Bluetooth Low Energy Module 1. Description EH-MC20 Bluetooth® low energy single mode module is a single mode device targeted for low power sensors and accessories. The module offers all Bluetooth® low energy features: radio, stack, profiles and application space for customer applications, so no external processor is needed. The module also provides flexible hardware interfaces to connect s e n s o r s , s i m p l e u s e r i n t e r f a c e s o r even displays directly to the module.
Bluetooth Low Energy Module 4. Electrical Characteristics 4.1. Recommended Operation Conditions Table 1: Recommended Operation Conditions Operating Condition Min Typical Max Unit Operating Temperature Range -40 -- +85 °C Battery (VDD_BAT) operation 1.9 -- +3.6 V I/O Supply Voltage (VDD_PIO) 1.9 -- +3.6 V 0 - +1.9 V 2480 MHz AIO input Frequency range 2402 Table 2：Absolute Maximum Rating 4.2.
Bluetooth Low Energy Module 4.4. Power Consumption The current consumption are measured at the VBAT Table 5: Current Consumption Item Sym Min Typ Max Unit condition TX ITx 15 mA RX IRX 12 mA Continuous Tx Transmission 0db output power Continuous Tx reception Isusp - 10 50 uA IO wakeup Suspend Current Isusp - 12 52 uA Timer wakeup Deep sleep Current Ideep - 2 5 uA Shanghai Ehong Technologies Co.
Bluetooth Low Energy Module 5. Pinout and Terminal Description 5.1. Pin Configuration Figure 1： Pinout of EH-MC20 Symbol Pin PAD Type Description GND 1 Ground Ground PWM0/ANA_E(0) 4 Digital I/O Button cell battery or DC 1.8V to 3.6V Button cell battery or DC 1.8V to 3.6V PWM0/GPIO/ANA_E0 PWM1/ANA_E(1) 5 Digital I/O PWM1/GPIO/ANA_E1 PWM0/ANA_A(0) 6 Digital I/O PWM0/GPIO/ANA_A0 VDD_3V3 VDD_3V3 2 3 Shanghai Ehong Technologies Co.
Bluetooth Low Energy Module NC 7 NC NC NC 8 NC NC NC 9 NC NC GND 10 Ground Ground USB_DP USB_DM 11 12 Digital I/O Digital I/O 13 UART_TX Digital I/O 14 UART_RX UART_RTS UART_CTS Digital I/O 15 16 ANA_A(1) 17 PWM2/SW/AN A_B(0) 18 NC VDD_3V3 GND PWM2_N/ANA _B(1) UART_RTS UART_CTS 19 20 21 Digital I/O Digital I/O Digital I/O ANA_A1 Digital I/O PWM2/single wire slave/GPIO/ANA_B(0) NC Power Supply 24 Ground Digital I/O PWM2 inverting/GPIO/ANA_B1 Digital I/O Digital I/O 25
Bluetooth Low Energy Module 28 CK/PWM5/ANA_B( 7) Digital I/O I2C_CLK/PWM5 inverting/GPIO/ANA_B7 NC NC Ground Ground 29 NC 30 GND Table 6：PIN Terminal Description Note: A. UART_TX > PIN13 and PIN25 are the same PIN and feature. B. UART_RX>PIN14 and PIN26 are the same PIN and feature. C. UART_RTS>PIN15 and PIN23 are the same PIN and feature. D. UART_CTS>PIN16 and PIN24 are the same PIN and feature 6. Physical Interfaces 6.1. Power Supply - The module power supply 3v coin cell batteries or DC 3.
Bluetooth Low Energy Module 6.3. AIO 14 AIOs are provided. They can be connected to internal 14 bits ADC. Their functions depend on software. 6.4. PWM 6 PIOs can be driven by internal PWM module. The PWM module also works while the module is sleep. So it can be used as a LED flasher. These functions are controlled by special firmware. 6.5. UART This is a standard UART interface for communicating with other serial devices and Support UART hardware flow control.
Bluetooth Low Energy Module 6.6. USB interface USB interface compatible with USB 2.0 full speed mode, support 9 endpoints, support ISP (In-system programming) Via USB port. 6.7. I2C Master The module can act as an I2C master when configured by software. The module PIN27 and PIN28 two PIOs can be configured as I2C_SCL and I2C_SDA. . 6.8.
Bluetooth Low Energy Module 7. Reference Design Figure 4： Reference Design Note: Please keep pulling up the WAKE pin during sending data to the module. Shanghai Ehong Technologies Co.
Bluetooth Low Energy Module 8. Layout and Soldering Considerations 8.1. Soldering Recommendations EH-MC20 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.
Bluetooth Low Energy Module Figure 5: Clearance area of antenna 9. Mechanical and PCB Footprint Characteristics Shanghai Ehong Technologies Co.
Bluetooth Low Energy Module Figure 6 ：Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.02mm) 10. Packaging Shanghai Ehong Technologies Co.
Bluetooth Low Energy Module Figure 7: EH-MC20 Packaging（Pallet） packaging for the pallet，one packaging quantity is 100 PCS。 11. Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. ℃ 250 217 210 A 25 0 B 1 2 C 3 D 4 E 5 6 min Figure 8: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s.
Bluetooth Low Energy Module recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C. 12. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Phone: +86 21 64769993 Fax: +86 21 64765833 Street address: Rom1505, Blk 1st ,No.
FCC/IC Statements (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band).
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal.
