EH-MC17 Low Energy Module User Manual 08 Sep 2018 Version1.
QUICK VIEW • Bluetooth® Radio Fully embedded Bluetooth® v5.
VERSION HISTORY Version Comment V1.0 first edition V1.1 Replace the chip with RTL8762CKF, 25/26/27 Pin definition changes V1.2 Update module power consumption Contact information Sales sales@ehlink.com.cn Technical support support@ehlink.com.cn Website http://www.ehonglink.com Phone +86 21 64769993 Fax +86 21 64765833 Address Rm1505,1st,No.
Contents Contact information .................................................................................................................................................3澳 1. Description .........................................................................................................................................................6 2. Applications ..................................................................................................................................................
1. Tables TABLE 1: RECOMMENDED OPERATION CONDITIONS ..................................................................................................6澳 TABLE 2：ABSOLUTE MAXIMUM RATING......................................................................................................................7澳 TABLE 3: POWER CONSUMPTION ................................................................................................................................7澳 TABLE 4: DIGITAL I/O CHARACTERISTICS ............
1. Description EH-MC17 Bluetooth® low energy single mode module is a single mode device targeted for low power sensors and accessories. The module offers all Bluetooth® low energy features v5.0: radio, stack, profiles and application space for customer applications, so no external processor is needed. The module also provides flexible hardware interfaces to connect sensors, simple user interfaces or even displays directly to the module.
4.2 Absolute Maximum Rating Rating Min Max Unit Storage Temperature -40 +85 & Battery (VBAT) operation* 0 +3.6 V I/O supply voltage 0 +3.6 V Table 2：Absolute Maximum Rating * Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. 4.3 Power consumption Condition: VBAT=3V,VDDIO=3V,ambient temperature:25°C Current Consumption(Typical) Unit Active RX mode 7.
Input Voltage Levels Min Typical Max Unit AIO 0 - VDD_AUX V Table 5: AIO Characteristics Condition Class Max Rating Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 1C 2000V (all pins) Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 C1 500V (all pins) Table 6: ESD Protection 5. Pinout and Terminal Description 5.
P4_1 IO IO 8 P4_0 IO IO 9 P0_6 IO IO 10 GND 11 P0_4 IO IO 12 P0_3 IO IO 13 P0_2 IO IO P0_1 IO IO 15 P0_0 IO IO 16 P1_0 IO IO 17 P1_1 IO IO 18 P3_2 IO IO 19 P3_3 IO IO 20 P2_2 IO IO 21 P2_3 IO IO 22 P2_4 IO IO 23 P2_5 IO IO 24 VBAT General input/output;8mA drive capability.Wake up function.Internal strong/weak pull-up and pulldown. LOG_UART TX.
27 MBIAS 28 GND IO IO Bias of microphone When microphone bias is not used, pin sharing is GPIO Table 7：PIN Terminal Description 6. Physical Interfaces 6.1Power Supply ¾ ¾ ¾ ¾ The module power supply 3v coin cell batteries or DC 3.3v Power supply pin connection capacitor to chip and pin as far as possible close Capacitor decouples power to the chip Capacitor prevents noise coupling back to power plane. 6.2 UART The MC17 embeds UART to implement full-duplex transmission and reception.
6.4 I2C Master/ Slave The MC17 embeds I2C hardware module, which could act as Master mode or Slave mode. I2C is POPULAR inter-IC interface requiring only 2 bus lines, a serial data line (SDA) and a serial clonk (SCL). M030 I2C module supports standard mode (100kbps), Fast-mode (400kbps), Fast-mode plus (1Mbps) and High-speed mode (3.4Mbps) with restriction that system clock must be by at least 10x of data rate. I2C module of the M030 acts as Slave mode by default.
.2 Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 6. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines.
. Packaging Remark：packaging for the pallet,one packaging quantity is 100 PCS。 EH-MC17 Datasheet Figure 7： EH-MC17 Packaging (Pallet）
Regulatory Module Integration Instructions 2.2 List of applicable FCC rules This device complies with part 15.247 of the FCC Rules. 2.3 Summarize the specific operational use conditions This module can be applied in HID, sports and fitness sensors , health sensors, mobile accessories as well as smart home. The input voltage to the module should be nominally 1.8-3.6 V DC ，typical value 3V DC and the ambient temperature of the module should not exceed 85℃.
limits or band edge limits (e.g.，where a different antenna may be causing additional emissions). b)The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters， digital circuitry， or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration.
When testing for emissions from the unintentional radiator， the transmitter shall be placed in the receive mode or idle mode， if possible. If receive mode only is not possible then， the radio shall be passive (preferred) and/or active scanning. In these cases ， this would need to enable activity on the communication BUS (i.e.， PCIe， SDIO， USB) to ensure the unintentional radiator circuitry is enabled.
