EH-MC16 Low Energy Module User manual 08 Sep 2018 Version1.
QUICK VIEW • Bluetooth® Radio - Fully embedded Bluetooth® v4.2 single mode - ARM Cortex-M4, 160KB SRAM - +7.
VERSION HISTORY Version Comment V1.0 Original publication of this document. V1.1 Update contact list Contact information Sales sales@ehlink.com.cn Technical support support@ehlink.com.cn Website http://www.ehonglink.com Phone +86 21 64769993 Fax +86 21 64765833 Address Rm1505,1st,No.833 South Hongmei Rd, Shanghai, China ©Ehong Technology Co.,Ltd 2014-2019.
Contents Contact information .................................................................................................................................................3 1. Description .........................................................................................................................................................6 2. Applications ...................................................................................................................................................
1. Tables TABLE 1: RECOMMENDED OPERATION CONDITIONS ...................................................................................................6 TABLE 2: ABSOLUTE MAXIMUM RATING........................................................................................................................7 TABLE 3: DIGITAL I/O CHARACTERISTICS .....................................................................................................................7 TABLE 4: AIO CHARACTERISTICS ....................
1. Description EH-MC16 Bluetooth® low energy single mode module is a single mode device targeted for low power sensors and accessories. The module offers all Bluetooth® low energy features v4.2: radio, stack, profiles and application space for customer applications, so no external processor is needed. The module also provides flexible hardware interfaces to connect sensors, simple user interfaces or even displays directly to the module.
4.2 Absolute Maximum Rating Rating Min Max Unit Storage Temperature -40 +85 °C Battery (VBAT) operation* 0 +3.6 V I/O supply voltage 0 +3.6 V Table 2：Absolute Maximum Rating * Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. 4.
5. Pinout and Terminal Description 5.1 Pin Configuration Pin Pin I/O Description Remark 1 GND 2 UART_TX UART TX 3 UART_RX UART RX 4 SWDIO AIO/DIO Programmable IO 5 SWDCLK AIO/DIO Programmable IO 6 ADC2 AIO/DIO Programmable IO GPIO 7 LOG UART RX Power on trap: Pull-up for normal operation Pulldown to bypass executing program code in flash (PAD internal pull-up by default).
VCC for LDO and Buck 1. Supply, 1.8 V ~ 3.6 V 2. A set of ADC can be used for battery voltage detection 3. Test point for MP calibration shall be reserved VCC 16 GND 17 PWM1 AIO Programmable IO 18 PWM2 AIO Programmable IO 19 PWM3 20 PWM4 21 PWM5 22 ADC1 AIO/DIO Programmable IO GPIO 23 GPIO1 DIO Programmable IO GPIO 24 GPIO2 DIO Programmable IO GPIO GPIO3 TPx Programmable IO BLE Test mode GPIO2 TPx Programmable IO 1. The MPTOOL crystal trim 2.
6.2 PWMs BT Module has 5 PWM. PWM1: Cold light LED; PWM2: Warm light LED; PWM3: RED LED; PWM4: Green LED; PWM5: Blue LED. The PWM1, PWM2 is default high level. Prevent the light from turning on after power on. Need MOS to logic transformation. 6.3 UART Figure 3： Connection To Host Device Note：The maximum baud rate is 2400 baud during deep sleep. 6.4 I2C Master/ Slave The MC16 embeds I2C hardware module, which could act as Master mode or Slave mode.
6.6 Audio 3.3V 330R 100KR PWM1 1MR 3.3V 330R 100KR BT MODULE PWM2 1MR ©Ehong Technology Co.,Ltd 2014-2019.
8. Layout and Soldering Considerations 8.1 Soldering Recommendations EH-MC16 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.
9. Mechanical and PCB Footprint Characteristics 10. Packaging Figure 8： EH-MC16 Packaging (Pallet） Remark：packaging for the pallet，one packaging quantity is 100 PCS。 ©Ehong Technology Co.,Ltd 2014-2019. Page 13 of 14 EH-MC16 Data Sheet Figure 7：Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.
11. Certification EH-MC16 is compliant to following specifications. 11.1. Bluetooth EH-MC16 Bluetooth audio module is Bluetooth qualified and listed as a controller subsystem and it is Bluetooth compliant to the following profiles of the core spec version V4.2. The QDID is D044285. 11.2. SRRC EH-MC16 has type certification in China with certification number CMIIT ID: 2019DP0081. FCC Statement： This device complies with part 15 of the FCC Rules.
Regulatory Module Integration Instructions 2.2 List of applicable FCC rules This device complies with part 15.247 of the FCC Rules. 2.3 Summarize the specific operational use conditions This module can be applied in HID, sports and fitness sensors , health sensors, mobile accessories as well as smart home. The input voltage to the module should be nominally 1.8-3.6 V DC ，typical value 3V DC and the ambient temperature of the module should not exceed 85℃.
limits or band edge limits (e.g.，where a different antenna may be causing additional emissions). b)The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters， digital circuitry， or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration.
When testing for emissions from the unintentional radiator， the transmitter shall be placed in the receive mode or idle mode， if possible. If receive mode only is not possible then， the radio shall be passive (preferred) and/or active scanning. In these cases ， this would need to enable activity on the communication BUS (i.e.， PCIe， SDIO， USB) to ensure the unintentional radiator circuitry is enabled.
