EH-ES101 Low Energy SIP Module Data Sheet EH-2018090-DS Rev1.1 Ehong Technology Co.,Ltd • Bluetooth® Radio - Fully embedded Bluetooth® V4.
EH-ES101 VERSION HISTORY Version Comment V1.1 Change the Pin GPIO to DIO in the schematic diagram Confidential and Proprietary – Ehong Technology Co.,Ltd NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: DCC@ehlink.com.cn Restricted Distribution: Not to be distributed to anyone who is not an employee of either Ehong Technology Co.,Ltd or its affiliated companies without the express approval of Ehong Configuration Management.
EH-ES101 1. Contents 1. Description .........................................................................................................................................................4 2. Applications .......................................................................................................................................................4 3. EH-ES101 Product numbering ....................................................................................................................
EH-ES101 1. Description EH-ES101 series is a powerful, highly flexible, ultra-low power Bluetooth smart SIP module base on BlueNRG-1 SoC from ST. Embedded 2.4GHz transceiver; the EH-ES101module provides a complete RF solution allowing faster time-to-market with reduced development costs. The module offers all Bluetooth® low energy features: radio, stack, profiles and application space for customer application, so no external control processor is needed.
EH-ES101 4. Pinout and Terminal Description 4.1.
EH-ES101 RF 16 GND 17 Use an internal antenna or connect to an external antenna.
EH-ES101 5. Physical Interfaces 5.1. GPIO 14 IOs are provided. Every IO can program for other function. All theGP IOs are in high impedance under reset. All the IOs are in high impedance in low power modes (sleep and standby). If pre-programmed as wake up sources, pins IO9, IO10 and IO11 are in input pull up. All the GIOs can programed for an interrupt source. Edge detection or level detection, and falling/rising or both. GIO0~GIO8 and GIO14 can program input pull down.
EH-ES101 5.3. PWM 2 PWMs can be driven by internal PWM module. 5.4. UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the TTL protocol. When using low-power mode, TXD needs to pull up resistance, and the reference value is 4.7k. Main features are: Programmable baud rate can reach up to 921600bps. me of 5, 6, 7 or 8 bits of data. -parity bit generation and detection. 5.5.
EH-ES101 Table 5: Recommended Operation Conditions Rating Min Max Unit Storage Temperature -40 +85 °C Battery (VBAT) operation* 1.8 3.6 V I/O supply voltage -0.4 +3.6 V Vss-0.4 VBAT+0.4 V Other Terminal Voltages except RF Table 6: Absolute Maximum Rating *In the absence of damage, the maximum 10% of product life is allowed for short term operation, but the output regulation and other specifications will not be guaranteed in excess of 4.2V.* 6.2.
EH-ES101 Pattern describe Total typical current at 3.3V (average) Standby All functions are shut down. GPIO preprogramming is required to wake up. <700nA Sleep 32kHz on and 24KB RAM retain <2.1uA Model at full speed Open all functions 2.5mA-3.6mA RF TX active VDD=3.3V ~8.3mA peak RF RX active VDD=3.3V ~7.7mA peak Table 9: Current Consumption (2)The power consumption is as follows when the DC-DC converter is not used: pattern Discribe Total typical current at 3.
EH-ES101 Figure 2： Reference Design important Note: A. DC-DC transverter select; (1) When the DC-DC converter is not used, a 0 - o resistor is welded to the welding plate 1-3, otherwise it cannot work; (2) When the dc-dc converter is activated, a 10uH inductance is welded to the welding disc 1-2.This method can reduce peak power consumption, and the peak current can be reduced by about 45%. B. Pin23 BOOT pin can’t connect to VCC, or else will always goto boot mode; C. Pin9 VDD1V2 need connect a test pad.
EH-ES101 9. Tape and reel information EH-ES101 modules are supplied on the tape and reels. For tape and reel packing and labeling, see IC packing and labeling specification. 9.1. Tapa orientation Figure 5 shows the EH-ES101 module LGA packing tape orientation. User Direction of Feed Figure 5: EH-ES101 module tape orientation 9.2. Tape dimensions Figure 6 shows and Table10 lists the dimensions of the tape for the EH-ES101 module. Figure 6 ：EH-ES101 tape dimensions ITEM DIM(mm) W 16.0 A0 7.
EH-ES101 9.3. Reel information Figure 7 ：EH-ES101 reel dimensions Item Unit:mm A 330 B 16.4 D 100 E 2.0 F 21.5 G 13.2 H 2.6 I 10.75 Table 11: EH-ES101 module reel dimensions 10. The tray information Figure 8 is the size of EH-ES101 pallet, and the number of chips in the tray is 26*10=260PCS.
EH-ES101 Figure 8: EH-ES101 pallet size. 11. Soldering Recommendations EH-ES101 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. SMT stencil making requirements If Bluetooth module PIN pitch ≥ 0.25mm and other component PIN pitch ≥ 0.
