Preliminary Datasheet SEQUANS Communications 15-55 Boulevard Charles de Gaulle 92700 Colombes, France Phone. +33.1.70.72.16.00 Fax. +33.1.70.72.16.09 www.sequans.com contact@sequans.
Product Summary 1 1.1 General Description The Monarch 2 GM02S is an LTE Cat M1/NB1/NB2 module based on Sequans' second generation Monarch 2 chip platform. GM02S is a total module solution, including a complete, Single-SKU™ RF front end for deployment in any band worldwide, and an integrated EAL5+ Secure Element (SE) enabling the integration of the SIM inside the module with zero compromise on security while lowering cost and reducing complexity.
PRODUCT SUMMARY APPLICATIONS 1.3 Applications GM02S is ideal for adding LTE-M and/or NB-IoT LTE connectivity to narrowband, low data rate M2M and IoT devices, including utility meters, industrial sensors, health and fitness bands, asset trackers, and numerous additional devices for smart home, smart city, and wearable applications. GM02S can be used by applications as slim modem controlled by an external MCU via UART. Alternatively, applications may run on GM02S' integrated MCU. 1.
PRODUCT SUMMARY GENERAL FEATURES LTE Features 3GPP LTE Release 13/14 Cat M1/NB1/NB2 compliant. LTE Cat M1: 1.1 Mbps / 0.3 Mbps UL/DL throughput LTE Cat NB1: 62.5 kbps / 27.2 kbps UL/DL throughput LTE Cat NB2: 160 kbps / 120.7 kbps UL/DL throughput Note: Cat NB1/NB2 will be supported in future module versions via software upgrade.
PRODUCT SUMMARY GENERAL FEATURES Table 1-1: Orderable Part Numbers Orderable Part Number Hardware Version UE Version (ATI1) PTCRB Model Name/Model SVN Orderable Status GM02RB6QRZ Engineering Sample. HW Rev1 Engineering software release. Please consult your Sequans’ representative UE8.0.0.0 N/A 0 End-of-Life GM02RB6QRA Engineering Sample. HW Rev2 Engineering software release. Please consult your Sequans’ representative UE8.0.0.0 N/A 0 Available GM02RB6QRB Engineering Sample.
Interfaces 2 2.
INTERFACES ANTENNA 2.2 Antenna Table 2-1: Antenna Pad Details Pad # Pad Name Direction 90 LTE_ANT In/Out 2.3 Power 2.3.1 Power Details Note: Comments Main Antenna, for Rx and Tx Pad 1V8 is the reference voltage for IOs. It can be used to provide power small devices (100 mA maximum usage). This voltage is not available when the modem is in Deep Sleep. When the modem is in standby the voltage drops to 1.62V as per Table 2-2.
INTERFACES POWER Figure 2-2: Timing Diagram for Power-Up Sequence Figure 2-3: Timing Diagram for Reset Sequence Note on Figure 2-3: Since EXT_RST_N is pulled-up internally, EXT_RST_N does not need to be maintained low after VBAT is established. This is shown by Figure 2-3. There is no timing condition between EXT_RST_N and VBAT.
INTERFACES POWER 2.3.2 Power States Figure 2-4 represents the electrical states of the module and their transitions. WŽǁĞƌ KĨĨ sďĂƚƚ KE WŽǁĞƌ KŶ Z ^ d ZĞůĞĂƐĞĚ Z ^ d ƐƐĞƌƚĞĚ ĐƚŝǀĞ ^ƚĂŶĚďLJ ^ůĞĞƉ ŽŵŵĂŶĚ t < ^ŽƵƌĐĞ ^ůĞĞƉ ĞĞƉ ^ůĞĞƉ Figure 2-4: Electrical States and Transitions The various power modes are described in Table 2-4 and illustrated on Figure 2-4.
INTERFACES POWER 2.3.3 Detailed Behavior of IO Pads of BIDIR Type • Behavior in Sleep, Standby or Active Modes Figure 2-5 shows a simplified diagram of the Digital bi-directional IOs in Sleep, Standby or Active modes. Figure 2-5: Digital Bi-Directional IOs in Sleep, Standby or Active Modes • Behavior in Deep Sleep Mode In Deep Sleep Mode the Digital bi-directional IOs are completly powered Off. In Deep Sleep Mode the Digital bi-directional IOs can be seen as high-impedance from the outside.
INTERFACES POWER 2.3.4 Detailed Behavior of IO Pads of BIDIR_WAKE Type • Behavior in Sleep, Standby or Active Modes PMU bi-directional wake IOs are used as general purposed IO buffers in Sleep, Standby or Active modes. Figure 2-6 shows a simplified diagram of the PMU bi-directional wake IOs in those modes. Note: The PMU bi-directional wake IOs output buffer requires the 3.0V power supply to be ON.
INTERFACES POWER • Behavior in Deep Sleep Mode. Note: The PMU bi-directional wake IOs output buffer is disabled in Deep Sleep Mode. Figure 2-7 shows a simplified diagram of the PMU bi-directional wake IOs in Deep Sleep Mode. Figure 2-7: PMU Wake IOs in Deep Sleep Mode Mode In Deep Sleep Mode, all PMU bi-directional wake IOs are high impedance with ultra low leakage current. This corresponds to a minimum impedance of 180 MOhm at the maximum input supply voltage of 3.6 V.
INTERFACES POWER Table 2-6 shows the values of the measured leakage current (measurements taken on silicon) for the PMU wake IOs. Table 2-6: Measured Leakage Current for the PMU Wake IOs. Minimum 3 nA Typical 4 nA Maximum 12 nA Table 2-7 shows values of the external pull-up/pull-down resistor to be used on the PMU wake IOs pads. Table 2-7: External Pull-up/Pull-down Resistor to Be Used on the PMU Wake IOs Pads.
INTERFACES UART 2.4 UART GM02S, when used as a slim modem, has three UARTs available. While the function of the UARTs can be configured, the default function for each UART is as follows: • UART0: data and control from external MCU via AT commands • UART1: debug and upgrade • UART2: modem console In addition, a fourth UART (UART3) may be used when running applications on GM02S. Note: See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode.
INTERFACES UART 30 RXD1 RXD1 State @reset Pad type2 Direction Alternate Function1 Pad Name Primary Function Pad # Power Group Table 2-9: UART Signals (Continued) N/A PVDD_1V8 Out BIDIR Out-1, 2mA N/A PVDD_1V8 Out BIDIR Out-1, 2mA N/A PMU_5V In IN HighZ In/Out BIDIR HighZ, 2mA In/Out BIDIR Out-1, 2mA UART1 31 CTS1 CTS1 UART1 29 RTS1 RTS1 Wake signal enabled by default.
INTERFACES UART GPIO21 PVDD_1V8 In/Out BIDIR Out-1, 2mA RTS3 PVDD_1V8 In/Out BIDIR Out-1, 2mA State @reset Pad type2 CTS3 Alternate Function1 Pad Name GPIO21/CTS3 Direction 21 Primary Function Pad # Power Group Table 2-9: UART Signals (Continued) UART3 23 GPIO22/RTS3 GPIO22 UART3 1. Alternate functions will be available in future versions via SW upgrade. 2.UART pad types’s electrical characteristics are detailed in Table 2-19.
INTERFACES USIM INTERFACES 2.5 USIM Interfaces 2.5.1 SIM0 Interface This is the main external SIM interface. It can be used with removable or non-removable SIM cards or with soldered SIM chips. The power supply of the SIM is managed by the modem to ensure lowest power consumption of the SIM. Note: See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode.
INTERFACES USIM INTERFACES 2.5.2 SIM1 Interface This interface can be used as a second SIM interface for GM02S, typically used for soldered SIM chips (since it lacks SIM detect and SIM VCC). If design only has one SIM, it is preferred then to use the main SIM interface (see Section SIM0 Interface above). Note: See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode.
INTERFACES I2C 2.6 I2C Note: See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. State @reset Pad type2 Direction Power Group Pad Name Alternate Function1 Pad # Primary Function Table 2-12: I2C Pad Details 95 GPIO23/ I2C_SDA GPIO23 I2C_SDA PVDD_1V8 In/Out BIDIR HiZ 97 GPIO24/ I2C_SCL GPIO24 I2C_SCL PVDD_1V8 In/Out BIDIR HiZ 1. Alternate functions will be available in future versions via SW upgrade. 2.
INTERFACES PCM 2.7 PCM Note: See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode. Primary Function Alternate Function1 Power Group Direction Pad type2 State @reset Table 2-13: PCM Pad Details 96 GPIO4/ PCM_CLK GPIO4 PCM_CLK PVDD_1V8 In/Out BIDIR HighZ 98 GPIO3/ PCM_RXD GPIO3 PCM_RXD PVDD_1V8 In/Out BIDIR HighZ 99 GPIO5/ PCM_FS GPIO5 PCM_FS PVDD_1V8 In/Out BIDIR HighZ 100 GPIO6/ PCM_TXD GPIO6 PCM_TXD PVDD_1V8 In/Out BIDIR HighZ Pad # Pad Name 1.
INTERFACES SPI 2.8 SPI Note: See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode.
INTERFACES GPIO 2.9 GPIO There is a total of 33 GPIOs available on GM02S: 28 named GPIO1 to GPIO28 and 5 named GPIO31 to GPIO35. The GPIOs listed in Table 2-15 are not enabled by default. Changing their state can be done by software. Table 2-15: GPIOs Disabled by Default GPIO Range Enable State by Default GPIO3 to GPIO11 Disabled GPIO17 to GPIO28 Disabled GPIO31 to GPIO32 Disabled The GPIOs are documented throughout this datasheet based on their shared or assigned function.
INTERFACES OTHER SIGNALS 2.10 Other Signals Table 2-16: GND and DNC Pads Pads Type Pads Number GND 1, 6, 37, 38, 50, 51, 52, 54, 56, 58, 59, 61, 64, 65, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 91, 92, 93 DNC (Reserved) 15, 17, 53, 71, 74, 75, 76, 77, 94 Note: See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode.
INTERFACES OTHER SIGNALS TX_IND GPIO33 PVDD_1V8 In/Out BIDIR State @reset Pad Type2 GPIO33/ TX_IND Alternate Function1 Name Direction 9 Primary Function Pad # Power Group Table 2-17: Other Signals (No Interface) (Continued) HighZ, 2mA Primary Function: Transmission indicator (TX_IND, OUT). Active high.
INTERFACES OTHER SIGNALS 47 WAKE1 N/A PMU_5V State @reset Pad Type2 Direction Name WAKE1 Alternate Function1 Primary Function Pad # Power Group Table 2-17: Other Signals (No Interface) (Continued) In IN HighZ In IN HighZ In IN HighZ In IN HighZ Wake #1 input line (WAKE1, IN), disabled by default. 49 WAKE2 WAKE2 N/A PMU_5V Wake #2 input line (WAKE2, IN), disabled by default. 55 WAKE3 WAKE3 N/A PMU_5V Wake #3 input line (WAKE3, IN), disabled by default.
INTERFACES JTAG 2.11 JTAG Note: See Section 2.3 Power on page 6 for behavior of IOs in Deep Sleep mode.
INTERFACES DIGITAL IO CHARACTERISTICS 2.12 Digital IO Characteristics The voltage and current characteristics of the various IO pads of the GM02S versus IO bank supply voltage are illustrated in the tables below. Caution: The PCB designer must ensure that the voltage on these pads never exceeds Vih of the power group to which they belong. See Table 2-19 for digital IO characteristics of the different IO pads.
INTERFACES DIGITAL IO CHARACTERISTICS Table 2-19: DC Characteristics for Digital IOs, Voltage 1.
Mechanical Characteristics 3 3.1 Package Description The package size with tolerance is: (16.3 ± 0.15) mm x (17.0 ± 0.15) mm x (1.85 max) mm The weight of the GM02S is 0.85 g.
MECHANICAL CHARACTERISTICS PACKAGE DESCRIPTION Figure 3-2: GM02S PCB View Note: Gxx pads should be grounded to a large ground plane on customer's PCB layer 1. It is also recommended to have the Gxx pads area in the PCB through ground vias to improve thermal dissipation efficiency. Table 3-1: GM02S Dimensions (mm) Dimension GM02S DATASHEET (PRELIMINARY) Value (mm) L 16.3 ± 0.15 W 17.0 ± 0.15 T 1.85 max T0 0.426 max L1 0.5 ± 0.1 W1 0.7 ± 0.1 L2 0.8 ± 0.1 W2 0.8 ± 0.1 a1 2.25 ± 0.
MECHANICAL CHARACTERISTICS PACKAGE DESCRIPTION Table 3-1: GM02S Dimensions (mm) (Continued) Dimension 30 Value (mm) a3 1.45 ± 0.1 a4 2.45 ± 0.1 a5 6.5 ± 0.1 b1 2.0 ± 0.1 b2 3.0 ± 0.1 b3 3.1 ± 0.1 b4 5.5 ± 0.1 b5 5.95 ± 0.1 P1 0.3 ± 0.1 P2 0.3 ± 0.1 P3 0.4 ± 0.1 P4 0.4 ± 0.
MECHANICAL CHARACTERISTICS PACKAGE DESCRIPTION Figure 3-3: GM02S Laser Marking (Preliminary) Notes on Figure 3-3: 1. The triangle in the low-right corner provides pin#1 location. 2. FCC ID: 2AAGMGM02SA 3. IC: 12732A-GM02SA 4. IMEI:XXXXXXXXXXXXXXX 5. ICCID:XXXXXXXXXXXXXXX (for future support) 6.
MECHANICAL CHARACTERISTICS ENVIRONMENTAL CONDITIONS 3.
MECHANICAL CHARACTERISTICS PACKING 3.3 Packing The GM02S is delivered in Tape-and-Reel. Details are provided in the figures below.
MECHANICAL CHARACTERISTICS STORAGE AND MOUNTING 3.4 Storage and Mounting The GM02S module is Moisture Level 3 rated as per JEDEC industrial standard: http://www.ipc.org/TOC/J-STD-033D-TOC.pdf. The GM02S can support up to 3 reflows with 250°C maximum. Table 3-2: Reflow Profile Profile Feature Solder Paste Alloy Sn96.5/Ag3.0/Cu0.
4 GM02S DATASHEET (PRELIMINARY) Regulatory Approval • RED regulatory approval details will be provided in a future revision of this document. • TELEC regulatory approval details will be provided in a future revision of this document.
REGULATORY APPROVAL FCC REGULATORY APPROVAL 4.1 FCC Regulatory Approval FCC-ID: 2AAGMGM02SA (single modular approval) This above identified LTE radio module is not intended to be provided to end-users but is for installation by OEM integrators only.
REGULATORY APPROVAL FCC REGULATORY APPROVAL Compliance with Unwanted Emission Limits for Digital Device If the OEM host integration fully complies with the above described reference design and can completely inherit and rest on compliance of the existing modular approval the OEM remains still responsible to show compliance of the overall end-product with the FCC limits for unwanted conducted and radiated emissions from the digital device (unintentional radio) portion of such end-product (commonly addressed
REGULATORY APPROVAL FCC REGULATORY APPROVAL • Digital Device - Unwanted Emissions Notice If the end-product is or contains a digital device (unintentional radio portions) and is not exempted by its use case (like vehicular use) the following part 15.105 (b) user notice shall be provided at prominent location of the product literature: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules.
REGULATORY APPROVAL ISED REGULATORY APPROVAL 4.2 ISED Regulatory Approval This device complies with ISED’s licence exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence.
REGULATORY APPROVAL ISED REGULATORY APPROVAL IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
A Acronyms Acronym Definition ADC Analog to Digital Converter CPU Central Processing Unit DL Downlink ESD Electro-static discharge ETSI European Telecommunications Standard Institute GND Ground GPIO General Purpose Input Output I/O Input/Output I2C Inter-Integrated Circuit interface IMEI International Mobile Equipment Identity IP Internet Protocol JTAG Joint Test Action Group LGA Large Grid Array LTE Long Term Evolution, or 4G. Standard is developed by the 3GPP www.3gpp.org.
Acronym Definition RED European Radio Equipment Directive RF Radio Frequency RoHS Restriction of Hazardous Substances Rx Reception S/N or SN: Serial Number SIM Subscriber Identification Module SMS Short Message Service SPI Serial Peripheral Interface Tx Transmission UART Universal Asynchronous Receiver Transmitter UE User Equipment UL Uplink USB Universal Serial Bus 42 PROPRIETARY SEQUANS Communications GM02S DATASHEET (PRELIMINARY)
About this Datasheet Purpose and Scope The GM02S is a complete LTE Cat M1/NB1/NB2 module including base-band, RF and memory, for the design of narrowband low data rate M2M and IoT devices for wide deployment. This document provides technical information about GM02S LGA module. GM02S is based on Sequans' Monarch 2 platform. Who Should Read this Document This document is intended for engineers who are developing User Equipment (UE) for LTE systems.
Table of Contents Chapter 1 Product Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 Frequency Bands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table of Contents 4.1 FCC Regulatory Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 4.2 ISED Regulatory Approval. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Appendix A Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 About this Datasheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Purpose and Scope . . . . . . . . . . . . . . . . . . .