WMBT01 Datasheet June 5, 2021 V1.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t Version History Revision 1.0 1.
W M B T 0 1 D a t a s h e e t Contents 1. Module Block Diagram................................................................................................. 6 1.1. Interface Description......................................................................................... 6 2. Module Performance....................................................................................................7 3. PIN Definition.............................................................................
W M B T 0 1 Descriptions WMBT01 (-s,-sc) is Bluetooth 5.2 BR/EDR BLE Dual Mode SOC module. A highly integrated SOC for Bluetooth data stream process, WMBT01 (-s,-sc) integrates a low power MCU, RF transceiver, Baseband, Modem, USB Device, SARADC and up to 16 GPIOs in the module. WMBT01 (-s,-sc) offers low cost, low power consumption, flexible and more powerful Bluetooth application. WMBT01 (-s,-sc) operates with a widely power supply range from 1.9V to 3.
W M B T 0 1 4 sets PWM interface 4-wire SPI(master and slave) interface, up to 12MHz 8x channels DMA for peripheral interface (UART,USB,I2C,SPI) WDT/RTC/8x Timers 2x UARTs (uart0 has CTS/RTS) Various (total 16) GPIOs for various purposes Embedded SPI flash support XIP mode, Facilitate customer application development ( - s , - s c ) D a t a s h e e t Support firmware upgrade over UART/USB or Air(OTA) Applications Printer Bluetooth HID Free drive dongle TV remote controlle
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 1. Module Block Diagram Ext ANT VCC RESET filter GPIO UART BR8051A01 I2C 24M crystal SPI ADC BOOT USB Figure1 WMBT01-s, WMBT01-sc Module Block Diagram Figure2 WMBT01 Module Block Diagram 1.1. Interface Description VCC Standard 1.9 to 3.6V power supply power ripple≤50mV, 3.3V recommended.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t RESET Support hardware reset. BOOT Pull down when firmware upgrade, pull up or NC when normal working. UART The module’s UART is a standard four lines interface (RX/TX/RTS/CTS). Its baud rate can be selected via UART AT command. Support hardware flow control. Support speed of up to 4Mbit/s. Uart0 can be served by the DMA controller. I2C I2C interface supports standard mode (100kbit/s) and fast mode (400kbit/s). The I2C work as either master or slave mode.
W M B T 0 1 Working voltage Working power consumption Idle power consumption Deep sleep power consumption Operating temperature Storage temperature shield Size ( - s , - s c ) D a t a s h e e t 1.9V~3.6V 7mA 2mA -40 to +85℃ -55 to +125℃ WMBT01-s: No WMBT01(-sc): Yes 15mm*12mm*1.8mm(tolerance ±0.2mm No shield) 15mm*12mm*2.4mm(tolerance ±0.2mm With shield) 3.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t Figure 4 WMBT01 Module PIN Definition 3.1. PIN Descriptions Table 2 PIN Descriptions PIN PIN description Function 1 GND 2 VDD 3 BOOT 4 5 6 7 8 9 10 NC NC GPIO7 NC NC NC GPIO15 11 I2C_SCL 12 I2C_SDA Power ground. 1.9V to 3.6V power supply, 3.3V recommended. Need external 10uF and 0.1uF capacitor connected to this pin. Pull down when firmware upgrade, pull up or NC when normal working. No Connect No Connect Configurable GPIO, NC if not used.
W M B T 0 1 13 UART_CTS 14 CONN/DISC 15 UART_RTS 16 GPIO5 17/18 GPIO4 19 RESET 20 UART_RX 21 UART_TX 22 23 24 25/26 27 28 29 GPIO19 GPIO20 GPIO21 GPIO22 DP DM GND WMBT01-s(c):ANT WMBT01:NC 30 ( - s , - s c ) D a t a s h e e t UART flow control, input, Clear To Send, Pull up prohibited sending data, pull down to send. Pull down if not used. GPIO3 Configurable GPIO, Default DICS PIN Pull up into working mode. Pull down more than 100mS to disconnect the Bluetooth connection. NC if not used.
W M B T 0 1 UART_TX UART_RX UART_RTS UART_CTS BOOT UART0_TX UART0_RX UART0_RTS UART0_CTS BOOT Mode GPIO7 GPIO7 GPIO4 GPIO5 GPIO15 CONN/DISC I2C_SCL I2C_SDA GPIO19 GPIO20 GPIO21 GPIO22 SWD_CLK SWD_DIO GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 ( - s , - s c ) GPIO0 GPIO1 GPIO2 GPIO3 N/A CLK_EXT_32K_IN(ext clock source) GPIO4 GPIO5 UART1_TX UART1_RX I2C_SCLK I2C_SDA (BB)PCM_CLK (BB)PCM_SYNC (BB)PCM_IN (BB)PCM_OUT D a t a s h e e t TX_EN RX_EN PWM1 PWM2 N/A UART0_TX(output) UART0_RX（inp
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 4.3. RF Characteristics Table 6 RF Characteristics Parameter Frequency Range RX Sensitivity@1Mbps BLE RX Sensitivity@1Mbps BT RX Sensitivity@ EDR 2Mbps RX Sensitivity@ EDR 3Mbps Transmit Output Power Conditions PER=30.8% BER=0.1% BER=0.01% BER=0.01% BR(GFSK) EDR2(π/4-DQPSK) EDR3(8-DPSK) BLE Min 2400 -70 -70 -70 -70 -30 -30 -30 -30 Typical -94 -91.5 -92 -85 0 Max 2484 6 2 2 6 Unit MHZ dBm dBm dBm dBm dBm dBm dBm dBm 4.4.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 6. Package Table 8 Package dimensions (top view) PCB Process Module Mechanical Size Package Type WMBT01 , WMBT01-sc: Size:15mm(L)x12mm(W)x2.4mm(H) WMBT01 (±0.2mm) With shield Stamp WMBT01-s SMD holes WMBT01-s : WMBT01-sc Size:15mm(L)x12mm(W)x1.8mm(H) (±0.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 7. Recommended PCB Package Size Figure 7 PCB Package Size 8. PCB Design Notes 8.1. Schematic Design Notes Core components placement requirements: Bluetooth power decoupling capacitor should be placed close to the module, and the trace width should be over 20mil.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 8.2. PCB Layout Design Notes The module should be placed as much as close to PCB’s edge. The module internal antenna should be close to PCB’s edge as much as possible. The module antenna area’s all layers are copper prohibited. No power supply or other wiring should pass through antenna bottom. The antenna should be placed far away from interference (such as crystal) as much as possible.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 8.3. MODULE PLACEMENT EXAMPLES For a Bluetooth wireless product, the antenna placement affects the performance of the whole system. The antenna requires free space to radiate the RF signal and it cannot be surrounded by the ground plane. Seeed recommends that the areas underneath the antenna on the host PCB should not contain copper on top, inner, or bottom layer.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 9. Package Information 9.1. Net Weight Module net weight: WMBT01-s: 0.46g±0.02g； WMBT01 (-sc) 0.76g±0.02g. 9.2. Package Reel package：1500pcs/reel Tape package：100pcs/tape When less than 1 tape and less than 50% MOQ, Default tray shipment.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t Figure 12 Reels Figure 13 Taping 9.3.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t Appendix 1. Storage Requirements 1.1 Temperature: 22~28℃; 1.2 Humidity: <70 %( RH); Vacuum packed and sealed in good condition to ensure 12 months of welding. 2. Humidity Sensitive Characteristic 2.1 MSL: 3 level 2.2 Once opened, SMT within 168 hours in the condition of temperature: 22~28°C and humidity<60 %( RH). Once production line stops, modules should either be stored in the drying box or be vacuum packed.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 3.2.2 Even only part of PINs are used, it is recommended to do full pad design, symmetric pad design, or asymmetric pad design (refer to Figure 3-1). During reflow, if the pad paste melts, the module is vulnerable to non-balanced force pull. It may lead to PIN short circuit if the module deflects under the action of torque. Figure 3-1: Asymmetric Pad Design 3.3.3 Layout Requirements a. For PCB double sided layout, it is recommended to process on 2nd side. b.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 4.1 All Bluetooth modules of our company are lead free. It is suggested to use lead free process technique when SMT processing to prevent the reduction of the reliability of module welding technique which may be caused by the usage of lead production process technique. Note: the lead BGA solder ball has low melting point (183°C), the lead-free BGA solder ball has high melting point (217°C -221°C).
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 4.3 Reflow Profile 4.3.1When making the furnace temperature curve, it should add temperature measuring circuit under Bluetooth module’s BGA to measure its real time temperature.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 4.4 Reflow Soldering 4.4.1 When PCBA which is mounted with Bluetooth module and it enters reflow, please strictly ensure PCBA boards to pass through furnace via track path. Passing through furnace via the net cover of reflow oven is prohibited. Since Bluetooth contains BGA elements, the net cover vibration may lead to high rates of BGA solder welding defects. 4.4.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 4.5 Wave soldering of PCBA after module is mounted 4.5.1 If process requirements require PCBA which is mounted with modules do wave soldering, please ensure special protection to the module in order to prevent its elements from soldering shortcut or other unpredictable hidden risks which may be caused by splash or other abnormity during wave soldering. 4.5.2 Wave soldering on PCBA which is mounted with module is not recommended.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 5.4.1 Preparation before Welding： 5.4.1.1 Using irons and woven materials which are able to moisten soldering flux to remove the old soldering flux on soldering pad. 5.4.1.2 Cleaning pad & remove flux residues 5.4.1.3 Soldering flux pre-fill：Before module is installed into the board, using the appropriate way to add soldering tin on solder pads, it ensures the closeness of the height of solder paste after it melts and re-solidifies. 5.4.1.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t Appendix 1. Storage Requirements 1.1 Temperature: 22~28℃； 1.2 Humidity: <70%（RH）； Vacuum packed and sealed in good condition to ensure 12 months of welding. 2. Humidity Sensitive Characteristic 2.1 MSL: 3 level 2.2 Once opened, SMT within 168 hours in the condition of temperature: 22~28 ℃ and humidity<60%（RH）. Once production line stops, modules should either be stored in the drying box or be vacuum packed.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t symmetric pad design, or asymmetric pad design(refer to Figure 3-1). During reflow, if the pad paste melts, the module is vulnerable to non-balanced force pull. It may lead to PIN short circuit if the module deflects under the action of torque. Figure 3-1: Asymmetric Pad Design 3.3.3 Layout Requirements a. For PCB double sided layout, it is recommended to process on 2nd side. b.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t lead free process technique when SMT processing to prevent the reduction of the reliability of module welding technique which may be caused by the usage of lead production process technique.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 4.3 Reflow Profile 4.3.1When making the furnace temperature curve，it should add temperature measuring circuit under Bluetooth module’s BGA to measure its real time temperature.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 4.4 Reflow Soldering 4.4.1 When PCBA which is mounted with Bluetooth module and it enters reflow, please strictly ensure PCBA boards to pass through furnace via track path. Passing through furnace via the net cover of reflow oven is prohibited. Since Bluetooth contains BGA elements, the net cover vibration may lead to high rates of BGA solder welding defects. 4.4.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 4.5 Wave soldering of PCBA after module is mounted 4.5.1 If process requirements require PCBA which is mounted with modules do wave soldering, please ensure special protection to the module in order to prevent its elements from soldering shortcut or other unpredictable hidden risks which may be caused by splash or other abnormity during wave soldering. 4.5.2 Wave soldering on PCBA which is mounted with module is not recommended.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t 5.4.1 Preparation Before Welding： 5.4.1.1 Using irons and woven materials which are able to moisten soldering flux to remove the old soldering flux on soldering pad. 5.4.1.2 Cleaning pad & remove flux residues 5.4.1.3 Soldering flux pre-fill：Before module is installed into the board, using the appropriate way to add soldering tin on solder pads, it ensures the closeness of the height of solder paste after it melts and re-solidifies. 5.4.1.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t FCC regulatory information This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t -Reorient or relocate the receiving antenna -Increase the distance between the equipment and the receiver. -Connect the equipment to outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
W M B T 0 1 ( - s , - s c ) D a t a s h e e t two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
