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Table Of Contents

CC2541

www.ti.com

SWRS110D –JANUARY 2012–REVISED JUNE 2013

2.4-GHz Bluetooth™ low energy and Proprietary System-on-Chip

Check for Samples: CC2541

FEATURES

• RF

– High-Performance and Low-Power 8051

Microcontroller Core With Code Prefetch

– 2.4-GHz Bluetooth low energy Compliant

and Proprietary RF System-on-Chip – In-System-Programmable Flash, 128- or

256-KB

– Supports 250-kbps, 500-kbps, 1-Mbps, 2-

Mbps Data Rates – 8-KB RAM With Retention in All Power

Modes

– Excellent Link Budget, Enabling Long-

Range Applications Without External Front – Hardware Debug Support

End

– Extensive Baseband Automation, Including

– Programmable Output Power up to 0 dBm Auto-Acknowledgment and Address

Decoding

– Excellent Receiver Sensitivity (–94 dBm at

1 Mbps), Selectivity, and Blocking – Retention of All Relevant Registers in All

Performance Power Modes

– Suitable for Systems Targeting Compliance • Peripherals

With Worldwide Radio Frequency

– Powerful Five-Channel DMA

Regulations: ETSI EN 300 328 and EN 300

– General-Purpose Timers (One 16-Bit, Two

440 Class 2 (Europe), FCC CFR47 Part 15

8-Bit)

(US), and ARIB STD-T66 (Japan)

– IR Generation Circuitry

• Layout

– 32-kHz Sleep Timer With Capture

– Few External Components

– Accurate Digital RSSI Support

– Reference Design Provided

– Battery Monitor and Temperature Sensor

– 6-mm × 6-mm QFN-40 Package

– 12-Bit ADC With Eight Channels and

– Pin-Compatible With CC2540 (When Not

Configurable Resolution

Using USB or I

– AES Security Coprocessor

• Low Power

– Two Powerful USARTs With Support for

– Active-Mode RX Down to: 17.9 mA

Several Serial Protocols

– Active-Mode TX (0 dBm): 18.2 mA

– 23 General-Purpose I/O Pins

– Power Mode 1 (4-µs Wake-Up): 270 µA

(21 × 4 mA, 2 × 20 mA)

– Power Mode 2 (Sleep Timer On): 1 µA

– I

C interface

– Power Mode 3 (External Interrupts): 0.5 µA

– 2 I/O Pins Have LED Driving Capabilities

– Wide Supply-Voltage Range (2 V–3.6 V)

– Watchdog Timer

• TPS62730 Compatible Low Power in Active

– Integrated High-Performance Comparator

Mode

• Development Tools

– RX Down to: 14.7 mA (3-V supply)

– CC2541 Evaluation Module Kit

– TX (0 dBm): 14.3 mA (3-V supply)

(CC2541EMK)

White space

– CC2541 Mini Development Kit (CC2541DK-

White space

MINI)

White space

– SmartRF™ Software

White space

– IAR Embedded Workbench™ Available

White space

• Microcontroller

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2Bluetooth is a trademark of Bluetooth SIG, Inc..

3ZigBee is a registered trademark of ZigBee Alliance.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (34 pages)

PAGE 1
CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 2.4-GHz Bluetooth™ low energy and Proprietary System-on-Chip Check for Samples: CC2541 FEATURES 1 • 23 • • • • RF – 2.
PAGE 2
CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com SOFTWARE FEATURES CC2541 WITH TPS62730 • • Bluetooth v4.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN Supply voltage MAX UNIT –0.3 3.9 V –0.3 VDD + 0.3 ≤ 3.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 GENERAL CHARACTERISTICS Measured on Texas Instruments CC2541 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKE-UP AND TIMING Power mode 1 → Active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC 4 μs Power mode 2 or 3 → Active Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com RF RECEIVE SECTION (continued) Measured on Texas Instruments CC2541 EM reference design with TA = 25°C, VDD = 3 V, fc = 2440 MHz PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 1 Mbps, GFSK, 250-kHz Deviation, Bluetooth low energy Mode, 0.1% BER Receiver sensitivity (3) (4) Saturation (4) Co-channel rejection High-gain mode –94 Standard mode –88 BER < 0.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 RF RECEIVE SECTION (continued) Measured on Texas Instruments CC2541 EM reference design with TA = 25°C, VDD = 3 V, fc = 2440 MHz PARAMETER TEST CONDITIONS MIN TYP MAX UNIT –98 dBm 0 dBm dB 250 kbps, GFSK, 160 kHz Deviation, 0.1% BER Receiver sensitivity (8) Saturation BER < 0.1% Co-channel rejection Wanted signal -67 dBm –3 ±1-MHz offset, 0.1% BER, wanted signal –67 dBm 23 ±2-MHz offset, 0.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 32.768-kHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2541 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Crystal frequency TYP MAX UNIT 40 ppm 32.768 Crystal frequency accuracy requirement (1) –40 kHz ESR Equivalent series resistance 40 130 kΩ C0 Crystal shunt capacitance 0.9 2 pF CL Crystal load capacitance 12 16 pF Start-up time 0.
PAGE 10
CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com RSSI CHARACTERISTICS Measured on Texas Instruments CC2541 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 2 Mbps, GFSK, 320-kHz Deviation, 0.1% BER and 2 Mbps, GFSK, 500-kHz Deviation, 0.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 ADC CHARACTERISTICS TA = 25°C and VDD = 3 V PARAMETER ENOB (1) TEST CONDITIONS MIN VDD is voltage on AVDD5 pin 0 VDD V VDD is voltage on AVDD5 pin 0 VDD V External reference voltage differential VDD is voltage on AVDD5 pin 0 VDD Simulated using 4-MHz clock speed 197 kΩ Full-scale signal (1) Peak-to-peak, defines 0 dBFS 2.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com ADC CHARACTERISTICS (continued) TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP Power consumption MAX UNIT 1.2 Internal reference VDD coefficient mA 4 Internal reference temperature coefficient Internal reference voltage mV/V 0.4 mV/10°C 1.24 V CONTROL INPUT AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 SPI AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com SCK t2 t3 SSN t8 D0 MISO X t10 MOSI t9 t11 D0 X D1 X T0479-01 Figure 4. SPI Slave AC Characteristics DEBUG INTERFACE AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 Time DEBUG_ CLK P2_2 RESET_N t3 t4 t5 T0437-01 Figure 6. Debug Enable Timing Time DEBUG_ CLK P2_2 DEBUG_DATA (to CC2541) P2_1 DEBUG_DATA (from CC2541) P2_1 t6 t8 t7 Figure 7. Data Setup and Hold Timing TIMER INPUTS AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.6 V PARAMETER Input capture pulse duration TEST CONDITIONS Synchronizers determine the shortest input pulse that can be recognized.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com DC CHARACTERISTICS TA = 25°C, VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP MAX Logic-0 input voltage Logic-1 input voltage UNIT 0.5 V 2.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 PIN DESCRIPTIONS PIN NAME PIN PIN TYPE DESCRIPTION AVDD1 28 Power (analog) 2-V–3.6-V analog power-supply connection AVDD2 27 Power (analog) 2-V–3.6-V analog power-supply connection AVDD3 24 Power (analog) 2-V–3.6-V analog power-supply connection AVDD4 29 Power (analog) 2-V–3.6-V analog power-supply connection AVDD5 21 Power (analog) 2-V–3.6-V analog power-supply connection AVDD6 31 Power (analog) 2-V–3.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com BLOCK DIAGRAM A block diagram of the CC2541 is shown in Figure 9. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules. In the following subsections, a short description of each module is given. RESET XOSC_Q2 WATCHDOG TIMER XOSC_Q1 CLOCK MUX and CALIBRATION 32.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 BLOCK DESCRIPTIONS A block diagram of the CC2541 is shown in Figure 9. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules. In the following subsections, a short description of each module is given. CPU and Memory The 8051 CPU core is a single-cycle 8051-compatible core.
PAGE 20
CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 TYPICAL CHARACTERISTICS RX CURRENT vs TEMPERATURE TX CURRENT vs TEMPERATURE 19 19.5 19 Current (mA) 18.5 Current (mA) TX Power Setting = 0 dBm VCC = 3 V 1 Mbps GFSK 250 kHz Standard Gain Setting Input = −70 dBm VCC = 3 V 18 17.5 17 −20 0 20 40 Temperature (°C) 60 17 −40 80 0 20 40 Temperature (°C) Figure 10. Figure 11. RX SENSITIVITY vs TEMPERATURE TX POWER vs TEMPERATURE 60 80 G002 4.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) RX SENSITIVITY vs SUPPLY VOLTAGE TX POWER vs SUPPLY VOLTAGE −84 4 2 Level (dBm) −86 Level (dBm) TX Power Setting = 0 dBm TA = 25°C 1 Mbps GFSK 250 kHz Standard Gain Setting TA = 25°C −88 −90 −92 −2 2 2.2 2.4 2.6 2.8 3 Voltage (V) 3.2 3.4 −4 3.6 2 G007 2.2 2.4 2.6 2.8 3 Voltage (V) Figure 16. Figure 17. RX SENSITIVITY vs FREQUENCY TX POWER vs FREQUENCY −84 3.2 3.4 3.
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CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 Table 2. Output Power and Current Consumption Typical Output Power (dBm) Typical Current Consumption (mA) (1) Typical Current Consumption With TPS62730 (mA) (2) 0 18.2 14.3 –20 16.8 13.1 (1) (2) Measured on Texas Instruments CC2541 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz. See SWRU191 for recommended register settings.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com APPLICATION INFORMATION Few external components are required for the operation of the CC2541. A typical application circuit is shown in Figure 22. 32-kHz Crystal (1) C331 2-V to 3.
PAGE 25
CC2541 www.ti.com SWRS110D – JANUARY 2012 – REVISED JUNE 2013 Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See 32-MHz CRYSTAL OSCILLATOR for details. The load capacitance seen by the 32-MHz crystal is given by: 1 CL = + Cparasitic 1 1 + C221 C231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.
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CC2541 SWRS110D – JANUARY 2012 – REVISED JUNE 2013 www.ti.com Texas Instruments Low-Power RF Web Site • • • Forums, videos, and blogs RF design help E2E interaction Join us today at www.ti.com/lprf-forum. Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2022 TRAY Chamfer on Tray corner indicates Pin 1 orientation of packed units. *All dimensions are nominal Device Package Name Package Type Pins SPQ Unit array Max L (mm) W matrix temperature (mm) (°C) CC2541F128RHAR RHA VQFN 40 2500 35 X 14 150 315 CC2541F128RHAR RHA VQFN 40 2500 35 X 14 150 315 K0 (µm) P1 (mm) CL (mm) CW (mm) 135.9 7620 8.8 7.9 8.15 135.9 7620 8.8 7.9 8.
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GENERIC PACKAGE VIEW RHA 40 VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 6 x 6, 0.5 mm pitch This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4225870/A www.ti.
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PACKAGE OUTLINE RHA0040H VQFN - 1 mm max height SCALE 2.200 PLASTIC QUAD FLATPACK - NO LEAD 6.1 5.9 A B 0.5 0.3 0.3 0.2 PIN 1 INDEX AREA DETAIL OPTIONAL TERMINAL TYPICAL 6.1 5.9 (0.1) SIDE WALL DETAIL OPTIONAL METAL THICKNESS C 1 MAX SEATING PLANE 0.05 0.00 0.08 C (0.2) TYP 2X 4.5 11 EXPOSED THERMAL PAD 20 36X 0.5 10 21 SEE SIDE WALL DETAIL 2X 4.5 41 SYMM 4.5 0.1 SEE TERMINAL DETAIL 1 30 40 PIN 1 ID (OPTIONAL) 31 SYMM 40X 0.5 0.3 40X 0.3 0.2 0.1 0.
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EXAMPLE BOARD LAYOUT RHA0040H VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 4.5) SYMM 31 40 40X (0.6) 1 30 40X (0.25) 4X (1.27) ( 0.2) TYP VIA (0.73) TYP 41 SYMM (5.8) 4X (1.46) 36X (0.5) 10 21 (R0.05) TYP 11 (0.73) TYP 20 4X (1.46) 4X (1.27) (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:12X 0.07 MIN ALL AROUND 0.
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EXAMPLE STENCIL DESIGN RHA0040H VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD (1.46) TYP 9X ( 1.26) (R0.05) TYP 40 31 40X (0.6) 1 30 40X (0.25) 41 (1.46) TYP SYMM (5.8) 36X (0.5) 21 10 METAL TYP 11 20 SYMM (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 41: 70% PRINTED SOLDER COVERAGE BY AREA SCALE:15X 4219055/B 08/22/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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