MC55/56 Siemens Cellular Engine Version: DocID: 02.06 MC55/56_hd_v02.06 MC55/56_hd_v02.06 Page 1 of 105 s Hardware Interface Description MC55/56 Hardware Interface Description Confidential / Released 29.10.
MC55/56 Hardware Interface Description Confidential / Released s Document Name: MC55/56 Hardware Interface Description Version: 02.06 Date: October 29, 2004 DocId: MC55/56_hd_v02.06 Status: Confidential / Released General Notes Product is deemed accepted by recipient and is provided without interface to recipient’s products. The documentation and/or product are provided for testing, evaluation, integration and information purposes.
MC55/56 Hardware Interface Description Confidential / Released s Contents 0 Document history..........................................................................................................7 1 Introduction ...................................................................................................................9 1.1 Related documents................................................................................................9 1.2 Terms and abbreviations ............................
MC55/56 Hardware Interface Description Confidential / Released s 3.10.1 Microphone circuit..................................................................................55 3.10.2 Speech processing ................................................................................56 3.10.3 DAI timing ..............................................................................................56 3.11 SIM interface..............................................................................................
MC55/56 Hardware Interface Description Confidential / Released s Figures Figure 1: MC55/56 block diagram .......................................................................................... 21 Figure 2: Power supply limits during transmit burst................................................................ 26 Figure 3: Power-on by ignition signal ..................................................................................... 28 Figure 4: Timing of power-on process if VDDLP is not used........
MC55/56 Hardware Interface Description Confidential / Released s Tables Table 1: MC55/56 key features .............................................................................................. 18 Table 2: Coding schemes and maximum net data rates over air interface ............................ 20 Table 3: Overview of operating modes................................................................................... 23 Table 4: Power supply pins of board-to-board connector...............................
MC55/56 Hardware Interface Description Confidential / Released 0 s Document history Preceding document: "MC55/56 Hardware Interface Description" Version 01.95 New document: "MC55/56 Hardware Interface Description" Version 02.06 Chapter What is new 5.5.3 Table 29: Sidetone gain at default settings for audio mode 5 and 6 set to -∞ dB 9 Added new Siemens ordering numbers Preceding document: "MC55/56 Hardware Interface Description" Version 01.
MC55/56 Hardware Interface Description Confidential / Released s Chapter Page What is new 4.1.2 70 Rated frequency changed from 3 to 6 GHz 5.3 75ff Table 26 - /EMERGOFF pin and output pins of serial interface: To keep output pins from floating when in high impedance state use additional resistors. 5.4 80 Added test conditions for TALK and DATA GPRS: 50 Ω 5.4.1 81 Revised introduction. 5.5.2 87 Improved Figure 38: Audio programming model 6.1 94 New drawing in Figure 41.
MC55/56 Hardware Interface Description Confidential / Released 1 s Introduction This document describes the hardware interface of the Siemens MC55/56 module that connects to the cellular device application and the air interface. As MC55/56 is intended to integrate with a wide range of application platforms, all functional components are described in great detail. This guide therefore covers all information needed to design and set up cellular applications incorporating the MC55/56 module.
MC55/56 Hardware Interface Description Confidential / Released 1.2 s Terms and abbreviations Abbreviation Description ADC Analog-to-Digital Converter AFC Automatic Frequency Control AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0 / ASC1 Asynchronous Controller.
MC55/56 Hardware Interface Description Confidential / Released s Abbreviation Description EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.
MC55/56 Hardware Interface Description Confidential / Released Abbreviation Description PPP Point-to-point protocol PSU Power Supply Unit R&TTE Radio and Telecommunication Terminal Equipment RAM Random Access Memory RF Radio Frequency RMS Root Mean Square (value) ROM Read-only Memory RTC Real Time Clock Rx Receive Direction SAR Specific Absorption Rate SELV Safety Extra Low Voltage SIM Subscriber Identification Module SMS Short Message Service SRAM Static Random Access Memory T
MC55/56 Hardware Interface Description Confidential / Released 1.3 s Type approval MC55/56 has been approved to comply with the directives and standards listed below and is labeled with the CE conformity mark.
MC55/56 Hardware Interface Description Confidential / Released s Requirements of quality IEC 60068 DIN EN 60529 Environmental testing IP codes Compliance with international rules and regulations Manufacturers of mobile or fixed devices incorporating MC55/56 modules are advised to have their completed product tested and approved for compliance with all applicable national and international regulations.
MC55/56 Hardware Interface Description Confidential / Released 1.4 s Safety precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating MC55/56. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
MC55/56 Hardware Interface Description Confidential / Released SOS s IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
MC55/56 Hardware Interface Description Confidential / Released 2 s Product concept Designed for use on any GSM network in the world, Siemens MC55 is a tri-band GSM/GPRS engine that works on the three frequencies GSM 900 MHz, GSM 1800 MHz and GSM 1900 MHz. MC56 is a tri-band GSM/GPRS engine that works on the three frequencies GSM 850MHz, GSM 1800 MHz and GSM 1900 MHz. MC55/56 features GPRS multislot class 10 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4.
s MC55/56 Hardware Interface Description Confidential / Released 2.1 MC55/56 key features at a glance Table 1: MC55/56 key features Feature Implementation Power supply Single supply voltage 3.3V – 4.
s MC55/56 Hardware Interface Description Confidential / Released Feature Implementation External antenna Connected via 50 Ohm antenna connector or antenna pad Audio interfaces Two analog audio interfaces, one digital audio interface (DAI) Audio features Speech codec modes: • Half Rate (ETS 06.20) • Full Rate (ETS 06.10) • Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) • Adaptive Multi Rate (AMR) Handsfree operation • Echo cancellation • Noise reduction Two serial interfaces: ASC0, ASC1 • 2.
s MC55/56 Hardware Interface Description Confidential / Released Table 2: Coding schemes and maximum net data rates over air interface Coding scheme 1 Timeslot 2 Timeslots 4 Timeslots CS-1: 9.05 kbps 18.1 kbps 36.2 kbps CS-2: 13.4 kbps 26.8 kbps 53.6 kbps CS-3: 15.6 kbps 31.2 kbps 62.4 kbps CS-4: 21.4 kbps 42.8 kbps 85.
s MC55/56 Hardware Interface Description Confidential / Released 2.
MC55/56 Hardware Interface Description Confidential / Released 3 s Application Interface MC55/56 is equipped with a 50-pin 0.5mm pitch board-to-board connector that connects to the cellular application platform. The host interface incorporates several sub-interfaces described in the following chapters: • Power supply and charging control (see Chapters 3.2 and 3.3) • Dual serial interface (see Chapter 3.9) • Two analog audio interfaces and a digital audio interface (see Chapter 3.
s MC55/56 Hardware Interface Description Confidential / Released 3.1 Operating modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 3: Overview of operating modes Mode Function Normal operation GSM / GPRS SLEEP Various powersave command. modes set with AT+CFUN Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too.
MC55/56 Hardware Interface Description Confidential / Released Mode s Function Charge-only mode Limited operation for battery powered applications. Enables charging while module is detached from GSM network. Limited number of AT commands is accessible. There are several ways to launch Charge-only mode: • From POWER DOWN mode: Connect charger to the charger input pin of the external charging circuit and the module’s POWER pin when MC55/56 was powered down by AT^SMSO.
s MC55/56 Hardware Interface Description Confidential / Released 3.2 Power supply The power supply of MC55/56 has to be a single voltage source of VBATT+= 3.3V...4.8V. It must be able to provide sufficient current in a transmit burst which typically rises to 2A. Beyond that, the power supply must be able to account for increased current consumption if the module is exposed to inappropriate conditions, for example antenna mismatch. For further details see Chapters 3.2.2 and 5.4.1.
s MC55/56 Hardware Interface Description Confidential / Released 3.2.2 Minimizing power losses When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.3V on the MC55/56 board, not even in a transmit burst where current consumption can rise to typical peaks of 1.6A. It should be noted that MC55/56 switches off when exceeding these limits.
MC55/56 Hardware Interface Description Confidential / Released 3.3 s Power up / down scenarios In general, be sure not to turn on MC55/56 while it is out of the operating range of voltage and temperature stated in Chapters 5.2 and 5.3. MC55/56 would immediately switch off after having started and detected these inappropriate conditions. 3.3.
s MC55/56 Hardware Interface Description Confidential / Released 3.3.1.1 Turn on MC55/56 using the ignition line /IGT (Power on) To switch on MC55/56 the /IGT (Ignition) signal needs to be driven to ground level for at least 100ms and not earlier than 10ms after the last falling edge of VDD. This can be accomplished using an open drain/collector driver in order to avoid current flowing into this pin. BATT+ min. 10ms HiZ min. 100ms HiZ /IGT ca.
s MC55/56 Hardware Interface Description Confidential / Released 3.3.1.2 Timing of the ignition process When designing your application platform take into account that powering up MC55/56 requires the following steps. • The ignition line cannot be operated until VBATT+ passes the level of 3.0V. • The ignition line shall not be operated earlier than 10ms after the last falling edge of VDD. • 10ms after VBATT+ has reached 3.0V the ignition line can be switched low.
MC55/56 Hardware Interface Description Confidential / Released 3.3.1.3 s Turn on MC55/56 using the POWER signal As detailed in Chapter 3.5.3, the charging adapter can be connected regardless of the module’s operating mode. If the charger is connected to the charger input of the external charging circuit and the module’s POWER pin while MC55/56 is off, processor controlled fast charging starts (see Chapter 3.5.2).
MC55/56 Hardware Interface Description Confidential / Released s If the charger is connected to the POWER line when MC55/56 is in ALARM mode charging will start, while MC55/56 stays in ALARM mode. See also Chapter 3.7 which summarizes the various options of changing the mode of operation. If your host application uses the SYNC pin to control a status LED as described in Chapter 3.12.2.2, please note that the LED is off while the GSM engine is in Alarm mode. MC55/56_hd_v02.06 Page 31 of 105 29.10.
MC55/56 Hardware Interface Description Confidential / Released 3.3.2 s Turn off MC55/56 To switch the module off the following procedures may be used: • • • Normal shutdown procedure: Software controlled by sending the AT^SMSO command over the serial application interface. See Chapter 3.3.2.1.
s MC55/56 Hardware Interface Description Confidential / Released 3.3.2.2 Emergency shutdown using /EMERGOFF pin Caution: Use the /EMERGOFF pin only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the /EMERGOFF pin causes the loss of all information stored in the volatile memory since power is cut off immediately. Therefore, this procedure is intended only for use in case of emergency, e.g. if MC55/56 fails to shut down properly.
MC55/56 Hardware Interface Description Confidential / Released 3.3.3 s Automatic shutdown Automatic shutdown takes effect if • the MC55/56 board is exceeding the critical limits of overtemperature undertemperature • the battery is exceeding the critical limits of overtemperature or undertemperature • undervoltage is detected or The automatic shutdown procedure is equivalent to the power-down initiated with the AT^SMSO command, i.e.
MC55/56 Hardware Interface Description Confidential / Released s Table 6: Temperature dependent behaviour Sending temperature alert (15 s after start-up, otherwise only if URC presentation enabled) ^SCTM_A: 1 Caution: Tamb of battery close to over temperature limit. ^SCTM_B: 1 Caution: Tamb of board close to over temperature limit. ^SCTM_A: -1 Caution: Tamb of battery close to under temperature limit. ^SCTM_B: -1 Caution: Tamb of board close to under temperature limit.
MC55/56 Hardware Interface Description Confidential / Released 3.3.3.4 s Undervoltage shutdown if no battery NTC is present The undervoltage protection is also effective in applications, where no NTC connects to the BATT_TEMP terminal. Thus, you can take advantage of this feature even though the application handles the charging process or MC55/56 is fed by a fixed supply voltage. All you need to do is executing the write command AT^SBC= which automatically enables the presentation of URCs.
MC55/56 Hardware Interface Description Confidential / Released 3.4 s Automatic GPRS Multislot Class change Temperature control is also effective for operation in GPRS Multislot Class 10. If the board temperature increases to the limit specified for restricted operation1) while data are transmitted over GPRS, the module automatically reverts from GPRS Multislot Class 10 (2 Tx) to Class 8 (1Tx). This reduces the power consumption and, consequently, causes the board’s temperature to decrease.
s MC55/56 Hardware Interface Description Confidential / Released 3.5 Charging control MC55/56 integrates a charging management for Li-Ion batteries. You can skip this chapter if charging is not your concern, or if you are not using the implemented charging algorithm. MC55/56 has no on-board charging circuit. To benefit from the implemented charging management you are required to install a charging circuit within your application. In this case, MC55/56 needs to be powered from a Li-Ion battery pack, e.g.
s MC55/56 Hardware Interface Description Confidential / Released 3.5.1 Battery pack characteristics The charging algorithm has been optimised for a Li-Ion battery pack that meets the characteristics listed below and in Table 8. It is recommended that the battery pack you want to integrate into your MC55/56 application is compliant with these specifications.
MC55/56 Hardware Interface Description Confidential / Released s Table 8: Specifications of recommended battery pack Battery type Li-Ion, 3.6V Nominal voltage 3.6V Capacity 800mAh NTC 10kΩ ± 5% @ 25°C, B (25/85)=3435K ± 3% Overcharge detection voltage 4.325 ± 0.025V Overcharge release voltage 4.075 ± 0.025V Overdischarge detection voltage 2.5 ± 0.05V Overdischarge release voltage 2.9 ± 0.5V Overcurrent detection 3 ± 0.5A Nominal working current <5µA Current of low voltage detection 0.
MC55/56 Hardware Interface Description Confidential / Released 3.5.2 s Implemented charging technique If the external charging circuit follows the recommendation of Figure 7, the charging process consists of trickle charging and processor controlled fast charging. For this solution, the fast charging current provided by the charger or any other external source must be limited to 500mA.
s MC55/56 Hardware Interface Description Confidential / Released What to do if software controlled charging does not start up? If trickle charging fails to raise the battery voltage to 3.2V within 60 minutes +10%, processor controlled charging does not begin. To start fast charging you can do one of the following: • Once the voltage has risen above its minimum of 3V, you can try to start software controlled charging by pulling the /IGT line to ground.
MC55/56 Hardware Interface Description Confidential / Released s Features of Charge-only mode Once the GSM engine enters the Charge-only mode, the AT command interface presents an Unsolicited Result Code (URC) which reads: ^SYSSTART CHARGE-ONLY MODE Note that this URC will not appear when autobauding was activated (due to the missing synchronization between DTE and DCE upon start-up). Therefore, it is recommended to select a fixed baudrate before using the Charge-only mode.
MC55/56 Hardware Interface Description Confidential / Released 3.6 s Power saving SLEEP mode reduces the functionality of the MC55/56 module to a minimum and, thus, minimizes the current consumption to the lowest level. Settings can be made using the AT+CFUN command. For details see below and [1]. SLEEP mode falls into two categories: • NON-CYCLIC SLEEP mode AT+CFUN=0 • CYCLIC SLEEP modes, selectable with AT+CFUN=5, 6, 7, 8 or 9.
MC55/56 Hardware Interface Description Confidential / Released s The CYCLIC SLEEP modes give you greater flexibility regarding the wake-up procedures: For example, in all CYCLIC SLEEP modes, you can enter AT+CFUN=1 to permanently wake up the module. In modes CFUN=7 and 8, MC55/56 automatically resumes power saving, after you have sent or received a short message or made a call. CFUN=5 and 6 do not offer this feature, and therefore, are only supported for compatibility with earlier releases.
s MC55/56 Hardware Interface Description Confidential / Released /CTS will also be activated if any character is to be sent. After the last character was sent or received the interface will remain active for • another 2 seconds, if AT+CFUN=5 or 7, • another 10 minutes, if AT+CFUN=6 or 8, • or for an individual time defined with AT^SCFG, if AT+CFUN=9. Assertion of RTS has the same effect.
s MC55/56 Hardware Interface Description Confidential / Released 3.6.6 Wake up MC55/56 from SLEEP mode A wake-up event is any event that causes the module to draw current. Depending on the selected mode the wake-up event either switches SLEEP mode off and takes MC55/56 back to AT+CFUN=1, or activates MC55/56 temporarily without leaving the current SLEEP mode. Definitions of the state transitions described in Table 11: Quit = MC55/56 exits SLEEP mode and returns to AT+CFUN=1.
MC55/56 Hardware Interface Description Confidential / Released 2) s Recommendation: In NON-CYCLIC SLEEP mode, you can set an RTC alarm to wake up MC55/56 and return to full functionality. This is a useful approach because, in this mode, the AT interface is not accessible. MC55/56_hd_v02.06 Page 48 of 105 29.10.
s MC55/56 Hardware Interface Description Confidential / Released 3.7 Summary of state transitions (except SLEEP mode) Table 12: State transitions of MC55/56 (except SLEEP mode) The table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes) Normal mode**) Charge-only mode*) Charging in normal mode*)**) Alarm mode POWER DOWN --mode without charger /IGT >100 ms at low level Connect charger to input of ext.
s MC55/56 Hardware Interface Description Confidential / Released 3.8 RTC backup The internal Real Time Clock of MC55/56 is supplied from a separate voltage regulator in the power supply ASIC which is also active when MC55/56 is in POWER DOWN status. An alarm function is provided that allows to wake up MC55/56 without logging on to the GSM network.
s MC55/56 Hardware Interface Description Confidential / Released 3.9 Serial interfaces MC55/56 offers two unbalanced, asynchronous serial interfaces conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or ON condition) and 2.65V (for high data bit or OFF condition). For electrical characteristics please refer to Table 26. The GSM engine is designed for use as a DCE.
s MC55/56 Hardware Interface Description Confidential / Released 3.9.1 Features supported on first and second serial interface ASC0 • 8-wire serial interface • Includes the data lines /TXD0 and /RXD0, the status lines /RTS0 and /CTS0 and, in addition, the modem control lines /DTR0, /DSR0, /DCD0 and /RING0. • It is primarily designed for voice calls, CSD calls, fax calls and GPRS services and for controlling the GSM engine with AT commands.
s MC55/56 Hardware Interface Description Confidential / Released Table 14: DCE-DTE wiring of 2nd serial interface V.24 circuit DCE DTE Pin function Signal direction Pin function Signal direction 103 /TXD1 Input /TXD Output 104 /RXD1 Output /RXD Input 105 /RTS1 Input /RTS Output 106 /CTS1 Output /CTS Input MC55/56_hd_v02.06 Page 53 of 105 29.10.
s MC55/56 Hardware Interface Description Confidential / Released 3.10 Audio interfaces MC55/56 comprises three audio interfaces available on the board-to-board connector: • Two analog audio interfaces, each with a balanced analog microphone input and a balanced analog earpiece output. The second analog interface provides a supply circuit to feed an active microphone. • Serial digital audio interface (DAI) using PCM (Pulse Code Modulation) to encode analog voice signals into digital bit streams.
s MC55/56 Hardware Interface Description Confidential / Released When shipped from factory, all audio parameters of MC55/56 are set to interface 1 and audio mode 1. This is the default configuration optimised for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Siemens reference configuration. Audio mode 1 has fix parameters which cannot be modified. To adjust the settings of the Votronic handset simply change to another audio mode.
MC55/56 Hardware Interface Description Confidential / Released 3.10.2 s Speech processing The speech samples from the ADC or DAI are handled by the DSP of the baseband controller to calculate e.g. amplifications, sidetone, echo cancellation or noise suppression depending on the configuration of the active audio mode. These processed samples are passed to the speech encoder.
MC55/56 Hardware Interface Description Confidential / Released Note: s Before starting the data transfer the clock SCLK should be available for at least three cycles. After the transfer of the LSB0 the clock SCLK should be still available for at least three cycles.
MC55/56 Hardware Interface Description Confidential / Released 3.11 s SIM interface The baseband processor has an integrated SIM interface compatible with the ISO 7816 IC Card standard. This is wired to the host interface (board-to-board connector) in order to be connected to an external SIM card holder. Six pins on the board-to-board connector are reserved for the SIM interface. The CCIN pin serves to detect whether a tray (with SIM card) is present in the card holder.
MC55/56 Hardware Interface Description Confidential / Released 3.11.1 s Requirements for using the CCIN pin According to ISO/IEC 7816-3 the SIM interface must be immediately shut down once the SIM card is removed during operation. Therefore, the signal at the CCIN pin must go low before the SIM card contacts are mechanically detached from the SIM interface contacts. This shutdown procedure is particularly required to protect the SIM card as well as the SIM interface of MC55/56 from damage.
s MC55/56 Hardware Interface Description Confidential / Released 3.11.2 Design considerations for SIM card holder The schematic below is a sample configuration that illustrates the Molex SIM card holder located on the DSB45 Support Box (evaluation kit used for type approval of the Siemens MC55/56 reference setup, see [5]). X503 is the designation used for the SIM card holder in [5].
s MC55/56 Hardware Interface Description Confidential / Released 3.12 Control signals 3.12.1 Inputs Table 17: Input control signals of the MC55/56 module Signal Pin Pin status Function Remarks Ignition /IGT Falling edge Power up MC55/56 Left open or HiZ No operation Active low ≥ 100ms (Open drain/collector driver to GND required in cellular device application). Note: If a charger and a battery is connected to the customer application the /IGT signal must be 1s minimum.
MC55/56 Hardware Interface Description Confidential / Released 3.12.2 Outputs 3.12.2.1 Synchronization signal s The synchronization signal serves to indicate growing power consumption during the transmit burst. The signal is generated by the SYNC pin. Please note that this pin can adopt two different operating modes which you can select by using the AT^SSYNC command (mode 0 and 1). For details refer to the following chapter and to [1].
MC55/56 Hardware Interface Description Confidential / Released 3.12.2.2 s Using the SYNC pin to control a status LED As an alternative to generating the synchronization signal, the SYNC pin can be used to control a status LED on your application platform. Especially in the development and test phase of an application, system integrators are advised to use the LED mode of the SYNC pin in order to evaluate their product design and identify the source of errors.
MC55/56 Hardware Interface Description Confidential / Released s To operate the LED a buffer, e.g. a transistor or gate, must be included in your application. A sample configuration can be gathered from Figure 23. Power consumption in the LED mode is the same as for the synchronization signal mode. For details see Table 26, SYNC pin. Figure 23: LED Circuit (Example) MC55/56_hd_v02.06 Page 64 of 105 29.10.
s MC55/56 Hardware Interface Description Confidential / Released 3.12.2.3 Behavior of the /RING0 line (ASC0 interface only) The /RING0 line is available on the first serial interface (ASC0). The signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). Although not mandatory for use in a host application, it is strongly suggested that you connect the /RING0 line to an interrupt line of your application.
MC55/56 Hardware Interface Description Confidential / Released s Table 19: MC55/56 ring signal Function Pin Status Description Ring indication /RING0 0 Indicates an incoming call or URC. If in NON-CYCLIC SLEEP mode CFUN=0 or CYCLIC SLEEP mode CFUN=5 or 6, the module is caused to wake up to full functionality. If CFUN=7 or 8, power saving is resumed after URC transmission or end of call. 1 No operation MC55/56_hd_v02.06 Page 66 of 105 29.10.
s MC55/56 Hardware Interface Description Confidential / Released 4 Antenna interface The RF interface has an impedance of 50Ω. MC55/56 is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption and harmonic suppression.
s MC55/56 Hardware Interface Description Confidential / Released The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Siemens reference equipment submitted to type approve MC55/56. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the Siemens type approval you are advised to give priority to the connector, rather than using the antenna pad. IMPORTANT: Both solutions can only be applied alternatively.
MC55/56 Hardware Interface Description Confidential / Released 4.1.1 s Antenna pad The antenna can be soldered to the pad, or attached via contact springs. To help you ground the antenna, MC55/56 comes with a grounding plane located close to the antenna pad. The positions of both pads can be seen from Figure 40. When you decide to use the antenna pad take into account that the pad has not been intended as antenna reference point (ARP) for the Siemens MC55/56 type approval.
s MC55/56 Hardware Interface Description Confidential / Released 4.1.2 Hirose antenna connector MC55/56 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The product name is: U.FL-R-SMT The position of the antenna connector on the MC55/56 board can be seen in Figure 41. Figure 31: Mechanical dimensions of U.FL-R-SMT connector Table 21: Product specifications of U.
s MC55/56 Hardware Interface Description Confidential / Released Table 22: Material and finish of U.FL-R-SMT connector and recommended plugs Part Material Finish Shell Phosphor bronze Silver plating Male centre contact Brass Gold plating Female centre contact Phosphor bronze Gold plating Insulator Plug: Receptacle: PBT LCP Black Beige Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown below and listed in Table 23.
MC55/56 Hardware Interface Description Confidential / Released s In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as an extremely space saving solution. This plug is intended for use with extra fine cable (up to ∅ 0.81 mm) and minimizes the mating height to 2 mm. See Figure 34 which shows the Hirose datasheet. Figure 34: Specifications of U.FL-LP-(V)-040(01) plug MC55/56_hd_v02.06 Page 72 of 105 29.10.
s MC55/56 Hardware Interface Description Confidential / Released Table 23: Ordering information for Hirose U.FL Series Item Part number HRS number Connector on MC55/56 U.FL-R-SMT CL331-0471-0-10 Right-angle plug shell for ∅ 0.81 mm cable U.FL-LP-040 CL331-0451-2 Right-angle plug for ∅ 0.81 mm cable U.FL-LP(V)-040 (01) CL331-053-8-01 Right-angle plug for ∅ 1.13 mm cable U.FL-LP-066 CL331-0452-5 Right-angle plug for ∅ 1.32 mm cable U.FL-LP-066 CL331-0452-5 Extraction jig E.
s MC55/56 Hardware Interface Description Confidential / Released 5 Electrical, reliability and radio characteristics 5.1 Absolute maximum ratings Absolute maximum ratings for supply voltage and voltages on digital and analog pins of MC55/56 are listed in Table 24. Exceeding these values will cause permanent damage to MC55/56. Table 24: Absolute maximum ratings Parameter Min Max Unit Voltage BATT+ -0.3 4.8 V Voltage at digital pins -0.3 3.3 V Voltage at analog pins -0.3 3.
s MC55/56 Hardware Interface Description Confidential / Released 5.3 Electrical specifications of the application interface Please note that the reference voltages listed in Table 26 are the values measured directly on the MC55/56 module. They do not apply to the accessories connected. If an input pin is specified for Vi,h,max = 3.3V, be sure never to exceed the stated voltage. The value 3.3V is an absolute maximum rating.
MC55/56 Hardware Interface Description Confidential / Released s Table 26: Electrical description of application interface Function Signal name IO Signal form and level Comments Power supply BATT+ I VI = 3.3V to 4.8V VInorm = 4.2V Inorm ≈ 1.6A during Tx burst 1 Tx, peak current 577µs every 4.616ms 2 Tx, peak current 1154µs every 4.616ms Power supply input. 5 BATT+ pins to be connected in parallel. 5 GND pins to be connected in parallel.
MC55/56 Hardware Interface Description Confidential / Released s Function Signal name IO Signal form and level Comments Ignition /IGT I RI ≈ 100kΩ, CI ≈ 1nF VILmax = 0.5V at Imax = -20µA VOpenmax = 2.3V Input to switch the mobile ON. The line must be driven low by an Open Drain or Open Collector driver. ON Emergency shutdown (Watchdog) /EMERGOFF I/O ~~~ |____|~~~ Active Low ≥ 100ms RI ≈22kΩ VILmax = 0.5V at Imax = -100µA VOpenmax = 2.73V Signal ~~~ |______|~~~ Active Low ≥ 3.
MC55/56 Hardware Interface Description Confidential / Released Function Signal name s IO Signal form and level Comments I RI ≈ 100kΩ VILmax = 0.5V VIHmin = 2.15V at I = 20µA, VIHmax=3.3V at I = 30µA CCIN = high, SIM card holder closed (no card recognition) CCRST O RO ≈47Ω VOLmax = 0.25V at I = 1mA VOHmin = 2.3V at I = -1mA VOHmax = 2.73V CCIO I/O RI ≈10kΩ VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V Maximum cable length 200mm to SIM card holder.
MC55/56 Hardware Interface Description Confidential / Released Function Signal name IO Signal form and level Comments O VOmax = 3.7Vpp See also Table 30. The audio output is balanced and can directly operate an earpiece. If unused keep pins open. VOmax = 3.7Vpp See also Table 30. Balanced audio output. Can be used to directly operate an earpiece. If unused keep pins open. RI ≈ 50kΩ differential VImax = 1.03Vpp See also Table 31. Balanced microphone input.
s MC55/56 Hardware Interface Description Confidential / Released 5.4 Power supply ratings Table 27: Power supply ratings Parameter Description Conditions Min BATT+ Supply voltage Reference points on MC55/56: TP BATT+ and TP GND (see Figure 40). Voltage must stay within the min/max values, including voltage drop, ripple, spikes. Voltage drop during transmit burst Normal condition, power control level for Pout max Voltage ripple Normal condition, power control level for Pout max 3.3 Typ Max 4.
s MC55/56 Hardware Interface Description Confidential / Released 5.4.1 Current consumption during transmit burst The diagrams provided in Figure 36 and Figure 37 illustrate the typical current consumption of the application caused during a transmit burst. The typical peak current is shown vs. the power control level for 900 MHz, 1800 MHz and 1900 MHz and vs. the return loss of the antenna. Test conditions: All measurements have been performed at Tamb= 25°C, VBATT+ nom = 4.1V.
s MC55/56 Hardware Interface Description Confidential / Released Average Current DCS1800 (VBATT+=4.1V) 0.3 0.25 0.26 1 TX - Average Current 2 TX - Average Current Current (Amps) 0.2 0.19 0.18 0.15 0.16 0.14 0.13 0.13 0.1 0.12 0.10 0.10 0.05 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Power Control Level Average Current PCS1900 (VBATT+=4.1V) 0.3 0.29 0.25 1 TX - Average Current 2 TX - Average Current Current (Amps) 0.2 0.15 0.21 0.17 0.17 0.14 0.13 0.13 0.12 0.1 0.
s MC55/56 Hardware Interface Description Confidential / Released Burst Current GSM900 (VBATT+=4.1V) 1.8 1.6 1.6 1.4 1 TX - Peak current 1.2 Current (Amps) 1.24 1 0.8 0.6 0.68 0.4 0.4 0.3 0.2 0.28 0 5 7 9 11 13 15 17 19 Power Control Level Burst Current DCS1800 (VBATT+=4.1V) 1 0.9 0.8 1 TX - Peak current 0.84 Current (Amps) 0.7 0.6 0.5 0.52 0.4 0.38 0.3 0.27 0.2 0.24 0.1 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Power Control Level MC55/56_hd_v02.
s MC55/56 Hardware Interface Description Confidential / Released Burst Current PCS1900 (VBATT+=4.1V) 1 0.92 0.9 0.8 1 TX - Peak current Current (Amps) 0.7 0.6 0.6 0.5 0.4 0.42 0.3 0.3 0.24 0.2 0.1 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Power Control Level Test conditions: Tamb= 25°C, VBATT+ nom = 4.1V Figure 36: Typical current consumption vs. power control level MC55/56_hd_v02.06 Page 84 of 105 29.10.
s MC55/56 Hardware Interface Description Confidential / Released 1600 Service mode GSM900 ch.124 Variations in current with 0.4dB return loss (all phases) 1400 1200 Current (mA) 1000 ch.124 PCL5 800 600 400 200 0 Burst (max) Burst (min) Average Current (Max) Average Current (Min) 1000 Service mode PCS1900 ch.661 Variations in current with 0.6dB return loss (all phases) 900 800 700 Current (mA) 600 ch.
s MC55/56 Hardware Interface Description Confidential / Released 5.5 Electrical characteristics of the voiceband part 5.5.1 Setting audio parameters by AT commands The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters. Table 28: Audio parameters adjustable by AT command Parameter Influence to Range Gain range Calculation inBbcGain MICP/MICN analog amplifier gain of baseband controller before ADC 0...7 0...
s MC55/56 Hardware Interface Description Confidential / Released 5.5.2 Audio programming model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The model is the same for all three interfaces, except for the parameters and which cannot be modified if the digital audio interface is being used, since in this case the DAC is switched off. The parameters inBbcGain and inCalibrate can be set with AT^SNFI.
s MC55/56 Hardware Interface Description Confidential / Released 5.5.3 Characteristics of audio modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. Table 29: Voiceband characteristics (typical) Audio mode no.
s MC55/56 Hardware Interface Description Confidential / Released Note: With regard to acoustic shock, the cellular application must be designed to avoid sending false AT commands that might increase amplification, e.g. for a high sensitive earpiece. A protection circuit should be implemented in the cellular application. 5.5.4 Voiceband receive path Test conditions: • The values specified below were tested to 1kHz and 0dB gain stage, unless otherwise stated.
s MC55/56 Hardware Interface Description Confidential / Released 5.5.5 Voiceband transmit path Test conditions: • The values specified below were tested to 1kHz and 0dB gain stage, unless otherwise stated. • Parameter setup: Audio mode = 5 for MICP1 to MICN1 and 6 for MICP2 to MICN2, inBbcGain= 0, inCalibrate = 32767, outBbcGain = 0, OutCalibrate = 16384, sideTone = 0 Table 31: Voiceband transmit path Parameter Min Typ Input voltage (peak to peak) Max Unit 1.
s MC55/56 Hardware Interface Description Confidential / Released 5.6 Air interface Test conditions: All measurements have been performed at Tamb= 25°C, VBATT+ nom = 4.1V. The reference points used on MC55/56 are the BATT+ and GND contacts (test points are shown in Figure 40).
s MC55/56 Hardware Interface Description Confidential / Released 5.7 Electrostatic discharge The GSM engine is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a MC55/56 module.
MC55/56 Hardware Interface Description Confidential / Released 5.8 s Reliability characteristics The test conditions stated below are an extract of the complete test specifications. Table 34: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20 Hz; acceleration: 3.
MC55/56 Hardware Interface Description Confidential / Released 6 s Mechanics The following chapters describe the mechanical dimensions of MC55/56 and give recommendations for integrating MC55/56 into the host application. 6.1 Mechanical dimensions of MC55/56 Figure 39 shows the top view on MC55/56 and provides an overview of the mechanical dimensions of the board. For further details see Figure 41. Size: Weight: 35±0.15 x 32.5±0.15 x 3.1±0.3 mm (including application connector) 35±0.15 x 32.5±0.
s MC55/56 Hardware Interface Description Confidential / Released 32.5 ± 0.15 4.6 Identification label 3.2 Ground 1.1 0.85 + 0.1 3.2 1) 1.6 2.4 5.3 3.8 9.5 Antenna pad 1.1 2.0 +0.1 7.7 ± 0.15 2.3 TP Ground 6.6 1.5 2.6 TP BATT+ Board-to-board connector 1.9 0.5 3.10 ± 0.3 2) 12.3 2.0 6.3 5.8 16.3 35.0 14.6 1.4 2.95 ± 0.2 6.1 Position 2D Barcode R1.0 ø 2.05 +0.01 -0.04 30.5 1) max. ø 3 mm mounting area 2) max. ø 3.
MC55/56 Hardware Interface Description Confidential / Released 6.2 s Mounting MC55/56 onto the application platform There are many ways to properly install MC55/56 in the host device. An efficient approach is to mount the MC55/56 PCB to a frame, plate, rack or chassis. Fasteners can be M1.6 or M1.8 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. Screws must be inserted with the screw head on the bottom of the MC55/56 PCB.
s MC55/56 Hardware Interface Description Confidential / Released 6.3 Board-to-board connector This chapter provides specifications for the 50-pin board-to-board connector which serves as physical interface to the host application. The receptacle assembled on the MC55/56 PCB is type Hirose DF12C. Mating headers from Hirose are available in different stacking heights.
MC55/56 Hardware Interface Description Confidential / Released 6.3.1 s Mechanical dimensions of the Hirose DF12 connector Figure 45: Mechanical dimensions of Hirose DF12 connector 6.3.2 Adapter cabling The board-to-board connection is primarily intended for direct contact between both connectors.
s MC55/56 Hardware Interface Description Confidential / Released 7 Reference Approval 7.1 Reference Equipment for Type Approval The Siemens reference setup submitted to type approve MC55/56 consists of the following components: • Siemens MC55/56 cellular engine • Development Support Box (DSB45) • Flex cable (160 mm) from Hirose DF12C receptacle on MC55/56 to Hirose DF12 connector on DSB45. Please note that this cable is not included in the scope of delivery of DSB45.
MC55/56 Hardware Interface Description Confidential / Released 7.2 s Compliance with FCC Rules and Regulations (MC55 only) The FCC Equipment Authorization Certification for the MC55 reference application described in Chapter 7.1 is listed under the FCC identifier QIPMC55 IC: 267W-MC55 granted to Siemens AG. The MC55 reference application registered under the above identifier is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC).
MC55/56 Hardware Interface Description Confidential / Released 7.3 s Compliance with FCC Rules and Regulations (MC56 only) The FCC Equipment Authorization Certification for the MC56 reference application described in Chapter 7.1 is listed under the FCC identifier QIPMC56 IC: 267W-MC56 granted to Siemens AG. The MC56 reference application registered under the above identifier is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC).
MC55/56 Hardware Interface Description Confidential / Released s 8 Design example Figure 47 shows a sample application that incorporates an MC55/56 module and an external µController. This solution is typical of devices designed for audio and GSM capability, such as mobile phones, PDAs, Tablet PCs etc. The audio part is made of internal transducers (earpiece and microphone) and integrates an additional interface for connecting an external headset.
s MC55/56 Hardware Interface Description Confidential / Released LDO 33pF 2.2µF 1SS355 GSM antenna BATT+ 3V Li-Ion battery pack 2.2uF 100R 4V3 CRS04 5.5V - 8V 500mA SI3441DV 33pF 3k3 NTC TP1 TP2 µC Keypad Oscillator RESET RESET Headset plug in Push to talk GPI GPI INT RING0 GPI VDD GND 47k 3V 100k BC 847 GSM M o du le BC847 TP3 BC 847 100nF 100nF CCVCC Note: CCCLK CCIO RXD0, CTS0, DSR0, CCRST DCD0, RING0 CCIN CCGND can float if module is in POWER DOWN state.
s MC55/56 Hardware Interface Description Confidential / Released 9 List of parts and accessories Table 37: List of parts and accessories Description Supplier Ordering information Siemens Siemens ordering number: Standard module: MC55 L36880-N8362-A100 Customer IMEI SIM Lock mode: L36880-N8363-A100 Standard module: MC56 L36880-N8367-A100 Customer IMEI SIM Lock mode: L36880-N8368-A100 Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117 DSB45 Support Box Siemens Siem
MC55/56 Hardware Interface Description Confidential / Released s Table 38: Molex sales contacts (subject to change) Molex Molex Deutschland GmbH American Headquarters For further information please click: Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Lisle, Illinois 60532 U.S.A. http://www.molex.com/ Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Email: mxgermany@molex.com Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R.
