page 1/24 Direction des Recherches et des Développements Etablissement de VELIZY VELIZY R&D Center NOTE D'ETUDE / TECHNICAL DOCUMENT REFERENCE ETUDE / PROJECT URDx – OTL 5635.1– 007 / NOM DE L’ETUDE Code 70 230 C TA1 HiLo Module TITRE / TITLE : HiLo Application note Edition Approbations /Approvals N° Rédacteur(s) Chef de projet # Author(s) Nom Name M. Ammari Date jj/mm/aaaa 03 Chef Unité Project design manager Responsable d’entité / Product design manager T. Fu M. Boutboul E.
page 2/24 Direction des Recherches et des Développements Etablissement de VELIZY VELIZY R&D Center NOTE D'ETUDE / TECHNICAL DOCUMENT FICHE RECAPITULATIVE / SUMMARY SHEET Ed Date Date 1 05/12/2007 2 08/02/2008 Référence Reference URDx– OTL 5635.1– 007 / 70 230 URDx– 2– 007 / 70 Rédacteur(s) 18/03/2008 4 16/05/2008 5 24/06/2008 URDx– OTL 5635.1– 007 / 70 230 URDx– OTL 5635.1– 007 / 70 230 URDx– OTL 5635.
page 3/24 Direction des Recherches et des Développements VELIZY R&D Center Etablissement de VELIZY SOMMAIRE / CONTENTS Direction des Recherches et des Développements Etablissement de VELIZY ...............................................................1 NOTE D'ETUDE / TECHNICAL DOCUMENT ................................................................................................................1 Direction des Recherches et des Développements Etablissement de VELIZY ....................................
page 4/24 RECOMMENDATIONS ON LAYOUT OF MMI BOARD .......................................................................................22 8.1 GENERAL RECOMMENDATIONS ON LAYOUT.........................................................................................22 8.2 EXAMPLE OF LAYOUT FOR MMI BOARD ..................................................................................................23 9. LABEL ..................................................................................................
page 5/24 1. OVERVIEW 1.1 OBJECT OF THE DOCUMENT The aim of this document is to describe some examples of hardware solutions for developing some products around the SAGEM HiLo GPRS Module. Most part of these solutions is not mandatory. Use them as suggestions of what should be done to have a working product and what should be avoided thanks to our experiences.
page 6/24 2. BLOCK DIAGRAM Antenna Port: POWER SUPPLY: VBATT (4) RF_IN VBACKUP POWER CONTROL: POWER ON POK_IN TRACE: TRACE PORT 5 GPIOs GND (4) UART: SPI_CLK SPI_IRQ SPI_OUT SPI_IN SPI_SEL GENERAL IO: TXD RXD CTS RTS DCD DSR DTR RI FULL UART PORT VBAT PWM: GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 VBAT PWM0 (LED1) PWM1 (LED2) ADC: EXTERNAL ANALOG INPUT DC 2.8V VGPIO VBAT AUX_ADC0 PWM2 (Buzzer) SIM: AUDIO: INTMIC_P SIM 3V & 1.
page 7/24 3.1 HOW TO CONNECT TO A SIM CARD Preliminary notes: Figure 2: SIM Card signals HiLo module provides the SIM signals on the board to board connector. A SIM card holder with 6 pins needs to be adopted to use the SIM function. In this case, decoupling capacitors have to be added on SIM_CLK, SIM_RST, VSIM and SIM_DATA signals as close as possible to the SIM card connector to avoid EMC issues.
page 8/24 connected to the module. The bias supply to microphone is implemented in the module. The speaker connected to the module should be 32 ohms. HSET_OUT_P HiLo Filter and ESD protection HSET_OUT_N 32ohms speaker INTMIC_P MIC Figure 4: Audio connection If the design is ESD or EMC sensitive we strongly recommend to read the notes below. The weakness can either come from the PCB routing and placement or from the chosen components (or both). 3.2.1.
page 9/24 ESD protection 18pF Ferrite Bead HiLo HSET_OUT_P speaker HSET_OUT_N Ferrite Bead 18pF ESD protection Figure 6: Filter and ESD protection of 32 ohms speaker The impedance of audio chain (filter + speaker) must be lower than 32 Ohm. 3.2.2 Characteristics communications of the microphone and speaker recommended by Sagem 3.2.2.
page 10/24 Distortion 3.3 5% max at 1K Hz, nominal input power PWM 3.3.1 PWM for LED The HiLo module can manage two PWM outputs to drive for example two LEDs. These LEDs can be used to interact with the network activity. If more than Two LEDs are required, any GPIO can be used to drive a LED. A maximum of 5 GPIOs are available on the HiLo Module.
page 11/24 Figure 8: GSM/GPRS Burst A 47uF capacitor is highly recommended for VBAT and close to the module. Note d’étude / Technical document : URDx– OTL 5635.1– 007 / 70 230 Edition 03 Document Sagem Communications Reproduction et divulgation interdites Sagem Communications document.
page 12/24 3.5 EXAMPLE OF POWER SUPPLY 3.5.1 Example 1 It the following application note from Linear Technology LTC3440, this schematic is an example of a DC/DC power supply able to power 3.6V under 2.1A. This can be use with a AC/DC 5V unit or an USB or PCMCIA bus as input power source. Figure 9: Example of power supply based on a DC/DC step down converter 3.5.
page 13/24 3.6 V24 The HiLo module features a V24 interface to communicate with the Host through AT commands or for easy firmware upgrading purpose. Pull-up resistors () must be connected to DCD, DTR, DSR and RI signals. 3.6.1 Complete V24 – connection HiLo - host A V24 interface is provided on the main connector of the HiLo module with the following signals: RTS/CTS, RXD/TXD, DSR, DTR, DCD, RI. It is recommended to manage an external access to the V24 interface, in order to allow easy software upgrade.
page 14/24 Figure 12: connection to a data cable 3.6.3 Partial V24 (RX-TX-RTS-CTS) – connection HiLo - host When using only RX/TX/RTS/CTS instead of the complete V24 link, we recommend following schematic: As we need DTR active (low electrical level), a loop DSR on DTR is sufficient because DSR is active (low electrical level) once the HiLo is switched on. DCD and RI can stay not connected and floating.
page 15/24 We need DTR active (low electrical level), a loop DSR on DTR is sufficient because DSR is active (low electrical level) once the HiLo is switched on. We also need RTS active (low electrical level), a loop RTS on CTS is sufficient because CTS is active (low electrical level) once the HiLo is switched on. DCD and RI can stay not connected and floating.
page 16/24 If there is no backup battery, VBACKUP input of the module has to be connected to VBAT signal. Without external VBACKUP (VBACKUP input connected to VBAT) - If VBAT > 1.5V, internal RTC is supplied by VBAT. - If VBAT < 1.5V, internal RTC is not supplied. Pin Name VBACKUP Min +1.5V Max +3.18V Remarks Protection 3.9.2 Current consumption on the backup battery When the power supply is removed, the internal RTC will be supplied by backup battery. 3.9.
page 17/24 • The over-discharge problem: most of the Lithium Ion rechargeable batteries are not able to recover their charge when their voltage reaches a low-level voltage. To avoid this, it is necessary to add a safety component to disconnect the backup battery in case of over–discharge condition. In such a case, this implementation is too complicated (too much components for that function).
page 18/24 3.13 SLEEP MODE MANAGEMENT AT command “AT+KSLEEP” allows the module to enter sleep mode. Note d’étude / Technical document : URDx– OTL 5635.1– 007 / 70 230 Edition 03 Document Sagem Communications Reproduction et divulgation interdites Sagem Communications document.
page 19/24 4. MANDATORY POINTS FOR THE FINAL TESTS AND TUNING The design of the main board (which the module is connected to) must provide an access to following signals when the final product will be completely integrated. To upgrade the module software, Sagem communications recommends providing a direct access to the module serial link through an external connector or any mechanism allowing the upgrade of the module without opening the whole product.
page 20/24 5.2 • Put capacitor 100nF on battery (not on charger), or better put varistor or ESD diode in parallel on battery and charger wires and on all wires on bottom connector • Uncouple microphone and speaker by putting capacitor or varistor in parallel of each wire of these devices ESD FEATURES The HiLo module can hold 2KV on each pin and on RF connector. 6. RADIO INTEGRATION 6.
page 21/24 6.2 GROUND LINK AREA Warning: Sagem communications emphasizes the fact that a good ground contact is needed between the module shielding and the MMI board to have the best radio performances (spurious, sensitivity…) Solder the three pads of the shielding on the ground pads of MMI board, then the HiLo module will have a good ground contact with the MMI board.
page 22/24 7. AUDIO INTEGRATION Audio mandatory tests for FTA are in handset mode only so a particular care must be brought to the design of audio (mechanical integration, gasket, electronic) in this mode. The audio norms which describe the audio tests are 3GPP TS 26.131 & 3GPP TS 26.132. 7.
page 23/24 • • • Lines crossing shall be perpendicular Suitable other signals track width, thickness. Data bus must be protected by upper and lower ground plans Radio • Provide a 50 Ohm microstrip line for antenna connection Audio (see also § 10.2) • Differential signals have to be routed together, parallel (for example HSET_OUT_P/HSET_OUT_N). • Audio signals have to be isolated, by pair, from all the other signals (ground all around each pair).
page 24/24 label can use wording such as the following: “Contains Transmitter module FCC ID: VW3HILOC” or “Contains FCC ID: VW3HILOC”. -oEND OF DOCUMENT o- Note d’étude / Technical document : URDx– OTL 5635.1– 007 / 70 230 Edition 03 Document Sagem Communications Reproduction et divulgation interdites Sagem Communications document.