BL-R8723DS1 SPECIFICATION IEEE 802.11b/g/n (1T1R) SDIO WIFI and BT Module INTERFACE, and HS-UART MIXED INTERFACE Version: 1.0 Customer Date Model Name BL-R8723DS1 Part NO. Blink Approve Field ENGINEER QC SALES Customer Approve Field ENGINEER QC 联系电话：0086-13798358430 传真:0755-28029002 MANUFACTORY PURCHASING 联络人: 夏先生 邮箱: Xia@b-link.net.cn 网址:www.b-link.net.cn 公司地址: 深圳市光明新区观光路华强创意园A1栋10-11层 Shenzhen Bilian Electronic Co.
B-LINK ELECTRONIC CO., LTD in shenzhen Road ,Guangming District, Shenzhen, 518107,PRC Homepage: www.b-link.net.cn Contents 1. General Description.............................................................................................................................. 2 2. The range of applying ........................................................................................................................... 2 3. Product Specification..............................................................
B-LINK ELECTRONIC CO., LTD in shenzhen 1. General Description BL-R8723DS1 is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module height of 1.6mm. It can beeasily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides GSPI/SDIO interface for WiFi to connect with host processor and high speed UART interface for BT.
B-LINK ELECTRONIC CO., LTD in shenzhen 3.2 Electrical and Performance Specification Item Description Product Name Major Chipset BL-R8723DS1 RTL8723DS Host Interface SDIO 1.1/ 2.0/ 3.0 Standard WiFi: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i BT: V2.1+EDR/BT V3.0/BT V3.0+HS/BT V4.0/V4.
B-LINK ELECTRONIC CO., LTD in shenzhen Storage temperature -40°C to +85°C 3.3Power Supply DC Characteristics Terms Contents Specification : IEEE802.11b Mode DSSS / CCK Frequency 2412 – 2484MHz Data rate 1, 2, 5.5, 11Mbps min Typ. max. unit TX mode 245 285 307 mA Rx mode 64 64 65 mA 63 64 65 mA DC Characteristics Sleep mode Specification : IEEE802.11g Mode OFDM Frequency 2412 - 2484MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps min Typ. max.
B-LINK ELECTRONIC CO., LTD in shenzhen 3.4 Product Photo TOP Bottom 3.5 Mechanical Specification Tolerance: +-0.
B-LINK ELECTRONIC CO., LTD in shenzhen 3.
B-LINK ELECTRONIC CO., LTD in shenzhen 4,5 NC NC 6 BT_WAKE HOST wake-up Bluetooth device 7 BT_HOST_WAKE Bluetooth device to wake-up HOST 8 NC NC 9 VABT 3.3V 10,11 NC NC Shared with GPIO9 This Pin Can Ex ternally Shutdown the RTL8723DS WLAN function when BT_DISn is Pulled Low. When 12 this pin deasserted, WL_DSI# SDIO interface will be disabled. This pin can also support the WLAN Ra dio-off function with host interface remaining connected.
B-LINK ELECTRONIC CO., LTD in shenzhen 42 UART_OUT HOST Data output 43 UART_IN HOST Data input 44 UART_CTS HOST_CTS 4. Supported platform Operating System CPU Framework Driver WIN2000/XP/VISTA/WIN7 X86 Platform Enable LINUX2.4/2.6 ARM, MIPSII Enable WINCE5.0/6.0 ARM ,MIPSII Enable 5. Peripheral Schematic Reference Design 6.
B-LINK ELECTRONIC CO., LTD in shenzhen 7. Typical Solder Reflow Profile 8. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3.Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Antenna information The IEEE 802.11b/g/n (1T1R) SDIO WIFI and BT Module has been designed to pass certification with the antenna listed below. The required antenna impedance is 50 ohms. Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
ISED Statement ‐ English: This device complies with Industry Canada license‐exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, a nd (2) This device must accept any interference, including interference that may cause undesired operation of the device. The digital apparatus complies with Canadian CAN ICES‐3 (B)/NMB‐3(B). ‐ French: Le présentappareilestconforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
separate Canada authorization. Note Importante: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l' IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
