Datasheet

Chip NTC Thermistor
RND is a trademark of Distrelec
Item
Test Methods and Remarks
Standard
Requirements
Solderability
IEC 60068-2-58
• Solder temperature: 245 ± 5℃
• Duration: 10 ± 1s
• Solder: Sn/3.0Ag/0.5Cu
• Flux: 25% resin and 75% ethanol in weight
1. No visible damage
2. Wetting shall exceed 95%
coverage
Resistance to
Soldering Heat
IEC 60068-2-58
• Solder temperature: 245 ± 5℃
• Duration: 10±1s
• Solder: Sn/3.0Ag/0.5Cu
• Flux: 25% resin and 75% ethanol in weight
• The chip shall be stabilized at normal condition for
1~2 hours before measuring
1. No visible damage
2. ∣
∆R25/R25∣
≤5%
3.
∣
∆B/B∣
≤2%
Temperature
Cycling
IEC 60068-2-14
Step
2
3
125 ± 2 ℃
25 ± 2 ℃
1
-40 ± 5℃
30 ± 3min
5 ± 3min
30 ± 3min
5 cycles of following sequence without loading
4
Temperature
Time
25±2℃
5 ± 3min
1. No visible damage
2. ∣∆R25/R25∣≤3%
3.
∣
∆B/B∣
≤2%
Resistance to
Dry Heat
IEC 60068-2-2
1. 125 ± 5℃ in air, for 1000 ± 24 hours without loading
2. The chip shall be stabilized at normal condition for
1~2 hours before measuring
Resistance to
Cold
IEC 60068-2-1
1. -40 ± 3℃ in air, for 1000 ± 24 hours without loading
2. The chip shall be stabilized at normal condition for
1~2 hours before measuring
1. No visible damage
2. ∣
∆R25/R25∣
≤5%
3.
∣
∆B/B∣
≤2%
Resistance to
Damp Heat
IEC 60068-2-78
1. No visible damage
2. ∣∆R25/R25∣≤3%
3.
∣
∆B/B∣
≤2%
1. 40 ± 2℃, 90~95%RH in air, for 1000 ±2 4 hours
without loading
2. The chip shall be stabilized at normal condition for
1~2 hours before measuring
Resistance to
high
temperature
load
IEC 60539-1
5.25.4
1. No visible damage
2. ∣
∆R25/R25∣
≤5%
3.
∣
∆B/B∣
≤2%
1. 85 ± 2℃in air with permissive operating current
for 1000 ± 48
hours
2. The chip shall be stabilized at normal condition for
1~2 hours before measuring
Storage
Storage Conditions
• Storage Temperature: -10℃～40℃
• Relative Humidity: ≦ 75%RH
• Keep away from corrosive atmosphere and sunlight
• Period of Storage: 6 Months after delivery
1. No visible damage
2. ∣
∆R25/R25∣
≤5%
3.
∣
∆B/B∣
≤2%