RN52m DataSheet v1.2.1-en Copyright © 2021 RiseNet.
RN52m Datasheet Contents 1. Revision History .................................................................................................... 3 2. Overview ................................................................................................................. 4 2.1. Features ........................................................................................................ 6 2.2. Application ................................................................................................
RN52m Datasheet 1. Revision History Date 2020/01 2021/08 2021/11 2022/04 Version 1.0.0 1.1.0 1.2.0 1.2.
RN52m Datasheet 2. Overview The RN52m module (based nRF52832 SoC) is a powerful, highly flexible ultra-low power multiprotocol SoC ideally suited for Bluetooth® low energy (previously called Bluetooth Smart), ANT and 2.4GHz ultra low-power wireless applications. The RN52m is built around a 32-bit ARM® Cortex™-M4F CPU with 512kB + 64kB RAM. The embedded 2.4GHz transceiver supports Bluetooth low energy, ANT and proprietary 2.4 GHz protocol stack.
RN52m Datasheet Processing power The RN52m incorporates a powerful Cortex-M4F processor enabling the most demanding applications with complex arithmetic requirements to be realized in a single chip solution. The IC supports DSP instructions, a Floating Point Unit (FPU), single-cycle multiply and accumulate, and hardware divide for energy-efficient process of computationally complex operations. Multiprotocol radio The 2.4GHz radio supports multiple protocols including Bluetooth low energy, ANT and 2.
RN52m Datasheet 2.1. Features • 2.4 GHz transceiver • -96 dBm sensitivity in Bluetooth® low energy mode • Supported data rates: 1 Mbps, 2 Mbps Bluetooth® low energy mode • -20 to +4 dBm TX power, configurable in 4 dB steps • On-chip balun (single-ended RF) • 5.3 mA peak current in TX (0 dBm) • 5.
RN52m Datasheet • Up to 3x SPI master/slave with EasyDMA • Up to 2x I2C compatible 2-wire master/slave • I2S with EasyDMA • UART (CTS/RTS) with EasyDMA • Programmable peripheral interconnect (PPI) • Quadrature decoder (QDEC) • AES HW encryption with EasyDMA • Autonomous peripheral operation without CPU intervention using PPI and EasyDMA • 3x real-time counter (RTC) • Single crystal operation 7
RN52m Datasheet 2.2.
RN52m Datasheet 2.3. Block Diagram The RN52m module includes a matching network for chip antenna and external 32.768k crystal.
RN52m Datasheet 3. Pin Assignments and Functions (Top View) Pin Pin Name Pin Function 1 P0.30 AIN6 Digital I/O Analog input 2 P0.02 AIN0 Digital I/O Analog input 3 4 5 6 7 8 VDD_NRF GND GND GND GND GND Power Power Power Power Power Power 9 P0.04 AIN2 Digital I/O Analog input 10 P0.05 AIN3 Digital I/O Analog input 11 12 P0.07 GND Digital I/O Power Description General purpose COMP input SAADC input General purpose COMP input SAADC input Power supply. Ground (0 V). Ground (0 V).
RN52m Datasheet 13 14 15 16 17 18 GND P0.12 P0.13 P0.16 SWDCLK SWDIO Power Digital I/O Digital I/O Digital I/O Digital Input Digital I/O 19 P0.31 AIN7 Digital I/O Analog input 20 21 22 23 24 25 26 27 28 29 30 31 P0.06 P0.09 P0.10 P0.11 P0.14 P0.17 P0.21 nRESET GND GND GND GND GND Digital Digital Digital Digital Digital Digital I/O I/O I/O I/O I/O I/O Digital I/O Power Power Power Power Power Ground (0 V).
RN52m Datasheet 4.
RN52m Datasheet The recommended metal mask sizes for the bottom pad type of the RN52m module are shown below. Pad Signal pad Corner & Center pad Pad size Mask opening 0.5 x 1.0 mm & 1.0 x 0.5 mm 1.0 x 1.5 mm 0.4 x 0.9 mm & 0.9 x 0.4 mm 0.7 x 1.0 mm The metal mask thickness : t = 0.1mm The solder volume should be same by changing the mask opening if different metal mask thickness is used.
RN52m Datasheet 5.
RN52m Datasheet 6. Module Reference The RN52m module can operate only by connecting VDD and GND.
RN52m Datasheet 7.
FCC STATEMENT This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
2.5 Trace antenna designs Not applicable. The module has its own antenna, and doesn’t need a host’s printed board microstrip trace antenna etc. 2.6 RF exposure considerations The module must be installed in the host equipment such that at least 5mm is maintained between the antenna and users’ body; and if RF exposure statement or module layout is changed, then the host product manufacturer required to take responsibility of the module through a change in FCC ID or new application.
2.8 Label and compliance information Host product manufacturers need to provide a physical or e-label stating “Contains FCC ID 2A7LK-RN52M With their finished product. 2.
