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BMD-300-Series-DS V1.7 Page 1 of 34

Rigado LLC

3950 Fairview Industrial Dr.

Salem, Oregon 97302

866-6-RIGADO  modules@rigado.com

www.rigado.com/modules

BMD-300 Series Module for Bluetooth 4.2 LE

The BMD-300 Series from Rigado is a line of powerful, highly flexible, ultra-low power

Bluetooth Smart modules based on the nRF52832 SoC from Nordic Semiconductor.

With an ARM® Cortex™ M4F CPU, embedded 2.4GHz transceiver, and integrated

antenna, they provide a complete RF solution with no additional RF design, allowing

faster time to market. Providing full use of the nRF52832’s capabilities and peripherals,

the BMD-300 Series can power the most demanding applications, all while simplifying

designs and reducing BOM costs. With an internal DC-DC converter and intelligent

power control, the BMD-300 Series provide class-leading power efficiency, enabling

ultra-low power sensitive applications. Regulatory pre-approvals reduce the burden

to enter the market, and the included BMD Software Suite provides access to great

features like a secure BLE & UART bootloader, iOS & Android Bluetooth libraries, and

more. Available in three variants: internal antenna (BMD-300), U.FL connector (BMD-

301), and ultra-miniature (BMD-350).

1. Features

 Based on the Nordic nRF52832 SoC

 Complete RF solution with integrated antenna

(BMD-300 & BMD-350) or U.FL connector (BMD-

301)

 Integrated DC-DC converter

 No external components required

 ARM® Cortex™-M4F 32-bit processor

 Serial Wire Debug (SWD)

 Nordic SoftDevice ready

 Over-the-Air (OTA) firmware updates

 512kB embedded flash memory

 64kB RAM

 32 General Purpose I/O Pins

 12-bit/200KSPS ADC

 -40C to +85 Temperature Range

 BMD Software Suite included

 FCC: 2AA9B04 (BMD-300/BMD-301) 2AA9B05

(BMD-350)

 Three SPI Master/Slave (8 Mbps)

 Low power comparator

 Temperature sensor

 Random Number Generator

 Two 2-wire Master/Slave (I2C compatible)

 I2S audio interface

 UART (w/ CTS/RTS and DMA)

 20 channel CPU independent Programmable

Peripheral Interconnect (PPI)

 Quadrature Demodulator (QDEC)

 128-bit AES HW encryption

 5 x 32bit, 3 x 24bit Real Timer Counters (RTC)

 NFC-A tag interface for OOB pairing

 BMD-300/301 Dimensions: 14 x 9.8 x 1.9mm

 BMD-350 Dimensions: 8.7 x 6.4 x 1.5mm

 IC: 12208A-04 (BMD-300/BMD-301) 12208A-05

(BMD-350)

 Japan: 210-106799 (BMD-300) 210-107153 (BMD-301)

2. Applications

 App-cessories

 Beacons – iBeacon™, AltBeacon, Eddystone, etc.

 Low-Power Sensors

 Lighting Products

 Fitness devices

 Wearables

Summary of content (34 pages)

PAGE 1
Rigado LLC 3950 Fairview Industrial Dr. Salem, Oregon 97302 866-6-RIGADO  modules@rigado.com www.rigado.com/modules BMD-300 Series Module for Bluetooth 4.2 LE The BMD-300 Series from Rigado is a line of powerful, highly flexible, ultra-low power Bluetooth Smart modules based on the nRF52832 SoC from Nordic Semiconductor. With an ARM® Cortex™ M4F CPU, embedded 2.4GHz transceiver, and integrated antenna, they provide a complete RF solution with no additional RF design, allowing faster time to market.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 3. Ordering Information Email modules@rigado.com for quotes and ordering or visit www.rigado.
PAGE 3
BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 Table of Contents 1. FEATURES...............................................................................................................................................................................1 2. APPLICATIONS ........................................................................................................................................................................1 3. ORDERING INFORMATION..............................
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 16.1 MOISTURE SENSITIVITY LEVEL ............................................................................................................................................................. 31 17. PACKAGING AND LABELING.................................................................................................................................................. 31 17.1 CARRIER TAPE DIMENSIONS ...............................................
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 5. Quick Specifications Bluetooth Version 4.2 (Bluetooth Smart) Concurrent Central & Peripheral (S132) Security AES-128 LE connections Up to 8 as Central, 1 as Peripheral, Observer, Broadcaster (S132) Radio Frequency 2.360GHz to 2.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 6. Pin Descriptions 6.1 BMD-300 / BMD-301 Figure 2 – BMD-300/301 Pin out (Top View) Pin 6 7 8 9 10 11 12 13 14 15 19 20 21 22 23 24 25 26 27 28 31 32 33 BMD-300-Series-DS V1.7 Name P0.25 P0.26 P0.27 P0.28 P0.29 P0.30 P0.31 P0.00 P0.01 P0.02 P0.03 P0.04 P0.05 P0.06 P0.07 P0.08 P0.09 P0.10 P0.11 P0.12 P0.13 P0.14 P0.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 Pin 34 35 36 37 38 39 40 41 42 43 44 17 1, 2, 3, 4, 5, 16, 18, 29, 30, 45, 46, 47 Name P0.16 P0.17 P0.18 P0.19 P0.20 P0.21 P0.22 P0.23 P0.24 SWCLK SWDIO VCC Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In In/Out Power Description GPIO/TRACEDATA[1] GPIO GPIO/TRACEDATA[0]/SWO GPIO GPIO/TRACECLK ̅̅̅̅̅̅̅̅ GPIO/RESET 2 GPIO GPIO2 GPIO2 SWD Clock SWD IO +1.7V to +3.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 Pin 8 9 10 11 12 13 14 16 17 18 19 20 21 22 23 24 27 28 29 30 31 32 33 34 35 36 41 42 44 45 25 1, 2, 3, 15, 26, 37, 38, 39, 40, 43, 46, 47 Name P0.18 P0.16 P0.17 P0.15 P0.13 P0.12 P0.14 P0.09 P0.10 P0.11 P0.06 P0.08 P0.05 P0.07 P0.01 P0.00 P0.04 P0.02 P0.30 P0.31 P0.29 P0.27 P0.25 P0.26 P0.23 P0.24 P0.22 P0.19 P0.03 P0.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 6.3 RigDFU Pin Functions Rigado RigDFU is programmed on the BMD-300 Series at the factory. Two GPIO pins are configured as UART pins for transferring new firmware images to the BMD-300. Pins are configured only when bootloader is running, and are fully available to the application firmware. RigDFU can be removed from the BMD-300 by performing a fullchip erase. BMD-300/1 Pin BMD-350 Name Pin Direction RigDFU Functions 22 19 P0.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 7. Electrical Specifications 7.1 Absolute Maximum Ratings Symbol Parameter Min. Max. Unit VCC_MAX Voltage on supply pin -0.3 3.9 V VIO_MAX Voltage on GPIO pins (VCC > 3.6V) -0.3 3.9 V VIO_MAX Voltage on GPIO pins (VCC ≤ 3.6V) -0.3 VCC + 0.3V V Storage Temperature Range -40 125 °C TS Table 7 – Absolute Maximum Ratings 7.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 7.5 Debug & Programming The BMD-300 Series supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support. The BMD-300 also supports ETM and ITM trace. Trace data from the ETM and the ITM is sent to an external debugger via a 4-bit wide parallel trace port.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 32.768 kHz Oscillator Comparison Symbol Parameter Min. Typ. Max. Unit ILFXO Current for 32.768kHz Crystal Oscillator - 0.25 - µA ILFRC Current for 32.768kHz RC Oscillator - 0.6 1 µA ILFSYNT Current for 32.768kHz Synthesized Oscillator Frequency Tolerance, 32.768kHz Crystal Oscillator (BLE Stack)1 Frequency Tolerance, 32.768kHz Crystal Oscillator (ANT Stack)1 Frequency Tolerance, 32.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 8. Firmware 8.1 Factory Image All modules are shipped with factory programmed firmware. The factory programmed firmware version is indicated on the label. 8.1.1 Firmware Version ‘AA’ Factory firmware version ‘AA’ contains the Rigado RigDFU OTA and Serial bootloader v3.2.0 (42), Nordic S132 SoftDevice v2.0.0, and Rigado BMDware v3.1.0 (50).
PAGE 14
BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 8.2 SoftDevices Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled, pre-linked binary files. SoftDevices can be programmed in nRF52 series SoCs and are downloadable from the Nordic website. The BMD-300 with the nRF52832 SoC supports the S132 (BLE Central & Peripheral), S212 (ANT) and S312 (ANT and BLE) SoftDevices. 8.2.
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BMD-300 Series Module Datasheet Bluetooth 4.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 9. Mechanical Data 9.1 Mechanical Dimensions 9.1.1 BMD-300 Dimensions Figure 6 – BMD-300 Module Dimensions (All dimensions are in mm) 9.1.2 BMD-301 Dimensions Figure 7 – BMD-301 Module Dimensions (All dimensions are in mm) BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 9.1.3 BMD-350 Dimensions Figure 8 – BMD-350 Module Dimensions (All dimensions are in mm) 9.2 Recommended PCB Land Pads 9.2.1 BMD-300/301 The BMD-300 and BMD-301 have identical PCB layout footprints. Note: RF keep-out not required when using the BMD-301. Figure 9 – BMD-300/301 Dimensions (Top View) (All dimensions are in mm) BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 9.2.2 BMD-350 Figure 10 – BMD-350 Dimensions (Top View) (All dimensions are in mm) 10. Module Marking 10.1 BMD-300 Module Marking Figure 11 – BMD-300 Module Marking – Rev A BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 10.2 BMD-301 Module Marking Figure 12 – BMD-301 Module Marking – Rev A 10.3 BMD-350 Module Marking Figure 13 – BMD-350 Module Marking – Rev A BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11. RF Design Notes 11.1 Recommended RF Layout & Ground Plane 11.1.1 BMD-300 For the BMD-300, the integrated antenna requires a suitable ground plane to radiate effectively. The area under and extending out from the antenna portion of the module should be kept clear of copper and other metal. The module should be placed at the edge of the PCB with the antenna edge facing out.
PAGE 21
BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 Figure 15 – BMD-350 Recommended RF Layout 11.2 Mechanical Enclosure For the BMD-300 and BMD-350, care should be taken when designing and placing the module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance. The module is designed and tuned for the antenna and RF components to be in free air.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11.3 Antenna Patterns 11.3.1 BMD-300 Antenna patterns are based off of the BMD-300 Evaluation Kit Version A with a ground plane size of 82mm x 56mm. X-Y-Z orientation is shown in Figure 16: Figure 16 – X-Y-Z Antenna Orientation 11.3.1.1 X-Y Plane X Y Figure 17 – X-Y Plane Antenna Pattern BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11.3.1.2 Y-Z Plane Y Z Figure 18 – Y-Z Plane Antenna Pattern 11.3.1.3 Z-X Plane Z X Figure 19 – Z-X Plane Antenna Pattern BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11.3.2 BMD-350 11.3.2.1 X-Y Plane Figure 20 – X-Y Plane Antenna Pattern 11.3.2.2 Y-Z Plane Figure 21 – Y-Z Plane Antenna Pattern BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11.3.2.3 Z-X Plane Figure 22 – Z-X Plane Antenna Pattern 12. Evaluation Boards Rigado has developed full featured evaluation boards that provide a complete I/O pin out to headers, onboard programming and debug, 32.768 kHz crystal, power & virtual COM port over USB, 4 user LEDs, and 4 user buttons.
PAGE 26
BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 14. Bluetooth Qualification The BMD-300 Series modules are qualified as a Bluetooth Component (tested) for RF-PHY. This allows customers to use different SoftDevices that have been qualified by Nordic without the need to complete additional RF-PHY testing. To achieve Bluetooth End Product qualification, the Rigado RF-PHY QDID can be combined with Nordic QDIDs for the SoftDevice used when filing on the Bluetooth SIG website.
PAGE 27
BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 (2) Co-location Warning: This device and its antenna(s) must not be co-located or operating in conjunction with any other transmitter antenna. (3) OEM integration instructions： This device is intended only for OEM integrators under the following conditions: The antenna and transmitter must not be co-located with any other transmitter or antenna.
PAGE 28
BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 15.3 IC Statement: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 15.5 CE Regulatory The BMD-300 Series modules are tested and compliant against the following standards. OEM integrators should consult with qualified test house to verify all regulatory requirements have been met for their complete device. From Directive 2006/95/EC:  EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 (pending) From R&TTE Directive 1999/5/EC:  ETSI EN 300 328 V 1.9.1 From Directive 2004/108/EC:  ETSI EN 301 489-1 V1.9.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 15.7 Australia / New Zealand The BMD-300 Series modules have been tested to comply with the AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices – Limits and methods of measurement. The report may be downloaded from www.rigado.com, and may be used as evidence in obtaining permission to use the RCM.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 16. Solder Reflow Temperature-Time Profile Figure 23 – Reflow Profile for Lead Free Solder 16.1 Moisture Sensitivity Level The BMD-300 Series is rated for MSL 3, 168-hour floor life after opening. 17. Packaging and Labeling 17.1 Carrier Tape Dimensions 17.1.1 BMD-300 & BMD-301 Figure 24 – Carrier Tape Dimensions BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 17.1.2 BMD-350 17.2 Reel Packaging Modules come on 330mm reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and humidity card and placed in a 340x350x65mm box. On the outside of the bag an antistatic warning and reel label are adhered. Figure 25 – Reel Cartons BMD-300-Series-DS V1.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 17.3 Packaging Label Figure 26 – Packaging Label 18. Cautions 1) The guidelines of this document should be followed in order to assure proper performance of the module. 2) This product is for use in office, business, and residential applications, but not medical devices. 3) This module may short-circuit. If a short circuit can result in serious damage or injury then failsafe precautions should be used.
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BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 20. Document History Revision Date Changes / Notes 0.8 11/06/2015 0.8.1 11/10/2015 0.8.2 11/11/2015 Initial preliminary release Updated Table 5, Figure 5, Section 7.5 Corrected antenna references Updated Figure 1 0.8.3 11/20/2015 Updated current ratings from nRF52832 OPC v0.6.3 Corrected Table 3 0.9 0.9.4 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.