EC25 Hardware Design LTE Module Series Rev. EC25_Hardware_Design_V1.5 Date: 2018-04-20 Status: Released www.quectel.
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LTE Module Series EC25 Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1. 2. 1.1 2016-09-22 Lyndon LIU/ Frank WANG Updated EC25 series frequency bands in Table 1. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13.
LTE Module Series EC25 Hardware Design 3. 4. 5. 6. 7. 8. 1. 2. 3. 4. 5. 6. 7. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 1.5 2018-04-20 Kinsey ZHANG 1. 2. 3. 4. EC25_Hardware_Design Added BT interface in Chapter 3.18.2. Updated GNSS performance in Table 24. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. Updated current consumption of EC25-E module in Table 33.
LTE Module Series EC25 Hardware Design 5. EC25_Hardware_Design Added EC25-AF conducted RF receiving sensitivity in Table 50.
LTE Module Series EC25 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 5 Table Index .............................................................................................................................................
LTE Module Series EC25 Hardware Design 3.15. Network Status Indication ..................................................................................................... 61 3.16. STATUS ................................................................................................................................ 62 3.17. Behaviors of RI ..................................................................................................................... 63 3.18. SGMII Interface .........................
LTE Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 114 12 Appendix D EDGE Modulationand Coding Schemes .................................................................
LTE Module Series EC25 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 18 TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 19 TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 26 TABLE 4: PIN DESCRIPTION .....................................
LTE Module Series EC25 Hardware Design TABLE 42: RF OUTPUT POWER ..................................................................................................................... 94 TABLE 43: EC25-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 95 TABLE 44: EC25-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 95 TABLE 45: EC25-V CONDUCTED RF RECEIVING SENSITIVITY .............................
LTE Module Series EC25 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 23 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 25 FIGURE 3: SLEEP MODE APPLICATION VIA UART ......................................................................................
LTE Module Series EC25 Hardware Design FIGURE 38: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 79 FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 79 FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 80 FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE)...............
LTE Module Series EC25 Hardware Design 1 Introduction This document defines the EC25 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. Associated with application note and user guide, customers can use EC25 module to design and set up mobile applications easily.
LTE Module Series EC25 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE Module Series EC25 Hardware Design FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
LTE Module Series EC25 Hardware Design For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations.
LTE Module Series EC25 Hardware Design this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
LTE Module Series EC25 Hardware Design to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: “Contains IC: 10224A-2019EC25AFX” or “where: 10224A-2019EC25AFX is the module’s certification number”. Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.
LTE Module Series EC25 Hardware Design 2 Product Concept 2.1. General Description EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’ specific application. EC25 contains seven variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU, EC25-AUT, EC25-AF and EC25-AUTL.
LTE Module Series EC25 Hardware Design NOTES 1. 2. 3. 4. 1) 2) GNSS function is optional. EC25 series module (EC25-E/EC25-A/EC25-V/EC25-J/EC25-AU/EC25-AUT/EC25-AF/ EC25-AUTL) contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3) B2 band on EC25-AU module does not support Rx-diversity. Y = Supported. N = Not supported. With a compact profile of 29.0mm × 32.0mm × 2.
LTE Module Series EC25 Hardware Design LTE-TDD: Max 130Mbps (DL)/30Mbps (UL) UMTS Features Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/384Kbps (UL) GPRS: Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/85.
LTE Module Series EC25 Hardware Design UART Interface Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x Main UART: Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART: Used for Linux console and log output 115200bps baud rate SD Card Interface Support SD 3.
LTE Module Series EC25 Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EC25 and illustrates the major functional parts.
LTE Module Series EC25 Hardware Design ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch Duplex LNA SAW VBAT_RF PA APT PRx DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC Control Control PWRKEY Baseband RESET_N ADCs 19.2M XO STATUS VDD_EXT USB USIM PCM I2C UARTs SGMII WLAN BT* GPIOs SD Figure 1: Functional Diagram NOTE “*” means under development. 2.4.
LTE Module Series EC25 Hardware Design 3 Application Interfaces 3.1. General Description EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform.
LTE Module Series EC25 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module. Figure 2: Pin Assignment (Top View) NOTES 1. 2. 1) 3. 4. 3) 5. 2) means that these pins cannot be pulled up before startup. PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. means these interface functions are only supported on Telematics version.
LTE Module Series EC25 Hardware Design 6. 7. 8. 9. Pads 24~27 are multiplexing pins used for audio design on the EC25 module and BT function on the BT module. Keep all RESERVED pins and unused pins unconnected. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84 should not be designed in schematic and PCB decal, and these pins should be served as a keep out area. “*” means under development. 3.3.
LTE Module Series EC25 Hardware Design VBAT_RF 57, 58 VDD_EXT 7 GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 PI Power supply for module’s RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA It must be able to provide sufficient current up to 1.8A in a burst transmission. Power supply for external GPIO’s pull-up circuits. Ground Turn on/off Pin Name Description DC Characteristics Comment Turn on/off the module VIHmax=2.1V VIHmin=1.
LTE Module Series EC25 Hardware Design USB_DP USB_DM 69 70 USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open. IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open. I/O Description DC Characteristics Comment VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open.
LTE Module Series EC25 Hardware Design USIM_RST 17 DO Reset signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI 62 DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Clear to send VOLmax=0.45V VOHmin=1.35V 1.
LTE Module Series EC25 Hardware Design VILmax=0.6V VIHmin=1.2V VIHmax=2.0V If unused, keep it open. ADC Interface Pin Name ADC0 ADC1 Pin No. I/O Description DC Characteristics Comment AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. 44 AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. Pin No. I/O Description DC Characteristics Comment PCM data input VILmin=-0.3V VILmax=0.
LTE Module Series EC25 Hardware Design I2C_SDA 42 OD I2C serial dataUsed for external codec. I/O Description External pull-up resistor is required. 1.8V only. If unused, keep it open. SD Card Interface Pin Name SDC2_ DATA3 SDC2_ DATA2 SDC2_ DATA1 Pin No. 28 29 30 EC25_Hardware_Design IO IO IO SD card SDIO bus DATA3 SD card SDIO bus DATA2 SD card SDIO bus DATA1 DC Characteristics 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.
LTE Module Series EC25 Hardware Design VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SDC2_ DATA0 SDC2_CLK SDC2_CMD 31 32 33 IO DO IO SD card SDIO bus DATA0 SD card SDIO bus clock SD card SDIO bus command 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling: VOLmax=0.45V VOHmin=1.4V 3.
LTE Module Series EC25 Hardware Design VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SD_INS_ DET VDD_SDIO 23 34 DI SD card insertion detect VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PO SD card SDIO bus pull-up power IOmax=50mA 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. I/O Description DC Characteristics Comment SGMII Interface Pin Name Pin No.
LTE Module Series EC25 Hardware Design USIM2_VDD 128 SGMII_TX_M 123 SGMII_TX_P 124 SGMII_RX_P 125 SGMII_RX_M 126 PO AO AO AI AI SGMII MDIO pull-up power source Configurable power source. 1.8V/2.85V power domain. External pull-up for SGMII MDIO pins. If unused, keep it open. SGMII transmission - minus Connect with a 0.1uF capacitor, close to the PHY side. If unused, keep it open. SGMII transmission - plus Connect with a 0.1uF capacitor, close to the PHY side. If unused, keep it open.
LTE Module Series EC25 Hardware Design SDC1_ DATA1 SDC1_ DATA0 SDC1_CLK SDC1_CMD 131 132 133 134 PM_ENABLE 127 WAKE_ON_ WIRELESS WLAN_EN 135 136 COEX_UART 137 _RX WLAN SDIO data bus D1 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. IO WLAN SDIO data bus D0 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. DO WLAN SDIO bus clock VOLmax=0.
LTE Module Series EC25 Hardware Design BT_RTS* BT_TXD* BT_RXD* BT_CTS* BT_EN* 37 38 39 DI BT UART request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V DO BT UART transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. BT UART receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. DI 1.8V power domain. If unused, keep it open. DO BT UART clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain.
LTE Module Series EC25 Hardware Design VIHmax=2.0V AP_READY 2 module can enter into airplane mode. If unused, keep it open. DI Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. I/O Description DC Characteristics Comment DI Force the module to enter into emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup.
LTE Module Series EC25 Hardware Design 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate.
LTE Module Series EC25 Hardware Design The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready"* command for details.
LTE Module Series EC25 Hardware Design The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EC25 through USB will wake up the module. When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3.
LTE Module Series EC25 Hardware Design Sending data to EC25 through USB will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS.
LTE Module Series EC25 Hardware Design Hardware: The W_DISABLE# pin is pulled up by default; driving it to low level will let the module enter into airplane mode. Software: AT+CFUN command provides the choice of the functionality level through setting into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1.
LTE Module Series EC25 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.
LTE Module Series EC25 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.
LTE Module Series EC25 Hardware Design Table 7: Pin Definition of PWRKEY Pin Name PWRKEY Pin No. 21 I/O Description Comment DI Turn on/off the module The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY.
LTE Module Series EC25 Hardware Design The turn on scenario is illustrated in the following figure. Figure 12: Timing of Turning on Module NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them should be no no less than 30ms. 3.7.2. Turn off Module The following procedures can be used to turn off the module: Normal power down procedure: Turn off the module using the PWRKEY pin. Normal power down procedure: Turn off the module using AT+QPOWD command. 3.7.
LTE Module Series EC25 Hardware Design Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. NOTES 1. Inorder to avoid damaging internal flash, please do not switch off the power supply when the module works normally.
LTE Module Series EC25 Hardware Design The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated inthe following figure.
LTE Module Series EC25 Hardware Design NOTES 1. 2. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The(U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. Table 9: Pin Definition of the (U)SIM Interface Pin Name Pin No. I/O Description Comment Either 1.8V or 3.0V is supported by the module automatically.
LTE Module Series EC25 Hardware Design The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. Figure 17: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
LTE Module Series EC25 Hardware Design Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.
LTE Module Series EC25 Hardware Design The USB interface is recommended to be reserved for firmware upgrade in customers’ designs. The following figure shows a reference circuit of USB interface. Figure 19: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission.
LTE Module Series EC25 Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication. The debug UART interface supports 115200bps baud rate.
LTE Module Series EC25 Hardware Design The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8V UART interface. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design.
LTE Module Series EC25 Hardware Design Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12.
LTE Module Series EC25 Hardware Design Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.
LTE Module Series EC25 Hardware Design PCM_OUT 25 DO PCM data output 1.8V power domain PCM_SYNC 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK 27 IO PCM data bit clock 1.8V power domain I2C_SCL 41 OD I2C serial clock Require external pull-up to 1.8V I2C_SDA 42 OD I2C serial data Require external pull-up to 1.
LTE Module Series EC25 Hardware Design 3.13. SD Card Interface EC25 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name SDC2_DATA3 SDC2_DATA2 SDC2_DATA1 SDC2_DATA0 Pin No. 28 29 30 31 I/O IO IO IO IO Description Comment SD card SDIO bus DATA3 SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details.
LTE Module Series EC25 Hardware Design card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. VDD_SDIO 34 PO SD card SDIO bus pull up power 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. SD_INS_DET 23 DI SD card insertion detection 1.8V power domain. If unused, keep it open. The following figure shows a reference design of SD card.
LTE Module Series EC25 Hardware Design Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50Ω (±10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15pF.
LTE Module Series EC25 Hardware Design NOTES 1. 2. 3. ADC input voltage must not exceed VBAT_BB. It is prohibited to supply any voltage to ADC pins when VBAT is removed. It is recommended to use a resistor divider circuit for ADC application. 3.15. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS.
LTE Module Series EC25 Hardware Design A reference circuit is shown in the following figure. Figure 26: Reference Circuit of the Network Indicator 3.16. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state.
LTE Module Series EC25 Hardware Design Figure 27: Reference Circuits of STATUS 3.17. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port URC is presented, URC will trigger the behavior of RI pin. NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly.
LTE Module Series EC25 Hardware Design 3.18. SGMII Interface EC25 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces, key features of the SGMII interface are shown below: IEEE802.
LTE Module Series EC25 Hardware Design The following figure shows the simplified block diagram for Ethernet application. Figure 28: Simplified Block Diagram for Ethernet Application The following figure shows a reference design of SGMII interface with PHY AR8033 application.
LTE Module Series EC25 Hardware Design 3.19. Wireless Connectivity Interfaces EC25 supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT. The following table shows the pin definition of wireless connectivity interfaces. Table 23: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment SDC1_DATA3 129 IO WLAN SDIO data bus D3 1.8V power domain SDC1_DATA2 130 IO WLAN SDIO data bus D2 1.
LTE Module Series EC25 Hardware Design BT_RXD* 39 DI BT UART receive data 1.8V power domain BT_CTS* 40 DO BT UART clear to send 1.8V power domain. Cannot be pulled up before startup. PCM_IN1) 24 DI PCM data input 1.8V power domain PCM_OUT1) 25 DO PCM data output 1.8V power domain PCM_SYNC1) 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK1) 27 IO PCM data bit clock 1.8V power domain BT_EN* 139 DO BT function control via BT module. 1.
LTE Module Series EC25 Hardware Design 4. 5. “*” means under development. 1) Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on BT module. 3.19.1. WLAN Interface EC25 provides a low power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports the SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.
LTE Module Series EC25 Hardware Design 3.20. USB_BOOT Interface EC25 provides a USB_BOOT pin. Developers can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter into emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 24: Pin Definition of USB_BOOT Interface Pin Name USB_BOOT Pin No. I/O 115 DI Description Comment Force the module enter into emergency download mode 1.8V power domain. Active high.
LTE Module Series EC25 Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command.
LTE Module Series EC25 Hardware Design Hot start @open sky Accuracy (GNSS) CEP-50 Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky <1.5 m NOTES 1. 2. 3. Tracking sensitivity: the lowest GNSSsignal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.
LTE Module Series EC25 Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The impedance of the antenna port is 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversityantenna interfaces is shown below.
LTE Module Series EC25 Hardware Design WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B6 830~840 875~885 MHz WCDMA B8 880~915 925~960 MHz WCDMA B19 830~845 875~890 MHz LTE FDD B1 1920~1980 2110~2170 MHz LTE FDD B2 1850~1910 1930~1990 MHz LTE FDD B3 1710~1785 1805~1880 MHz LTE FDD B4 1710~1755 2110~2155 MHz LTE FDD B5 824~849 869~894 MHz LTE FDD B7 2500~2570 2620~2690 MHz LTE FDD B8 880~915 925~960 MHz
LTE Module Series EC25 Hardware Design 5.1.3. Reference Design of RF Antenna Interface Areference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 32: Reference Circuit of RF Antenna Interface NOTES 1. 2. 3. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. ANT_DIV function is enabled by default.
LTE Module Series EC25 Hardware Design .
LTE Module Series EC25 Hardware Design Figure 36: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and they should be fully connected to ground.
LTE Module Series EC25 Hardware Design Table 29: GNSS Frequency Type Frequency Unit GPS/Galileo/QZSS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz BeiDou 1561.098±2.046 MHz A reference design of GNSS antenna is shown as below. Figure 37: Reference Circuit of GNSS Antenna NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed.
LTE Module Series EC25 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements GNSS1) Frequency range: 1561MHz~1615MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.
LTE Module Series EC25 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 39: Mechanicals of U.
LTE Module Series EC25 Hardware Design The following figure describes the space factor of mated connector. Figure 40: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.
LTE Module Series EC25 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
LTE Module Series EC25 Hardware Design 6.2. Power Supply Ratings Table 32: The Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.0 A USB_VBUS USB detection 5.
LTE Module Series EC25 Hardware Design returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 uA AT+CFUN=0 (USB disconnected) 1.16 mA GSM DRX=2 (USB disconnected) 2.74 mA GSM DRX=9 (USB disconnected) 2.0 mA WCDMA PF=64 (USB disconnected) 2.
LTE Module Series EC25 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA datatransfer (GNSS OFF) LTE datatransfer (GNSS OFF) EC25_Hardware_Design LTE-TDD PF=64 (USB connected) 32.0 mA EGSM900 4DL/1UL @33.22dBm 271.0 mA EGSM900 3DL/2UL @33.0dBm 464.0 mA EGSM900 2DL/3UL @30.86dBm 524.0 mA EGSM900 1DL/4UL @29.58dBm 600 mA DCS1800 4DL/1UL @29.92dBm 192.0 mA DCS1800 3DL/2UL @29.84dBm 311.0 mA DCS1800 2DL/3UL @29.67dBm 424.0 mA DCS1800 1DL/4UL @29.
LTE Module Series EC25 Hardware Design LTE datatransfer (GNSS OFF) GSM voice call WCDMA voice call LTE-FDD B5 @22.83dBm 762.0 mA LTE-FDD B7 @23.37dBm 842.0 mA LTE-FDD B8 @23.48dBm 720.0 mA LTE-FDD B20 @22.75dBm 714.0 mA LTE-TDD B38 @23.05dBm 481.0 mA LTE-TDD B40 @23.17dBm 431.8 mA LTE-TDD B41 @23.02dBm 480.0 mA EGSM900 PCL=5 @33.08dBm 264.0 mA DCS1800 PCL=0 @29.75dBm 190.0 mA WCDMA B1 @23.22dBm 680.0 mA WCDMA B5 @23.18dBm 677.0 mA WCDMA B8 @23.54dBm 618.
LTE Module Series EC25 Hardware Design WCDMA datatransfer (GNSS OFF) LTE datatransfer (GNSS OFF) WCDMA voice call WCDMA B2 HSDPA @21.9dBm 591.0 mA WCDMA B2 HSUPA @21.62dBm 606.0 mA WCDMA B4 HSDPA @22.02dBm 524.0 mA WCDMA B4 HSUPA @21.67dBm 540.0 mA WCDMA B5 HSDPA @22.71dBm 490.0 mA WCDMA B5 HSUPA @22.58dBm 520.0 mA LTE-FDD B2 @22.93dBm 715.0 mA LTE-FDD B4 @22.96dBm 738.0 mA LTE-FDD B12 @23.35dBm 663.0 mA WCDMA B2 @22.93dBm 646.0 mA WCDMA B4 @23dBm 572.0 mA WCDMA B5 @23.
LTE Module Series EC25 Hardware Design LTE datatransfer (GNSS OFF) WCDMA B5 HSUPA @22.58dBm 520.0 mA LTE-FDD B4 @23.14dBm 770.0 mA LTE-FDD B13 @23.48dBm 531.0 mA Table 37: EC25-J Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 10 uA AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF=64 (USB disconnected) 1.9 mA WCDMA PF=128 (USB disconnected) 1.5 mA LTE-FDD PF=64 (USB disconnected) 2.5 mA LTE-FDD PF=128 (USB disconnected) 1.
LTE Module Series EC25 Hardware Design LTE datatransfer (GNSS OFF) WCDMA voice call WCDMA B19 HSUPA @22.33dBm 522.0 mA LTE-FDD B1 @23.16dBm 685.0 mA LTE-FDD B3 @23.22dBm 766.0 mA LTE-FDD B8 @23.22dBm 641.0 mA LTE-FDD B18 @23.35dBm 661.0 mA LTE-FDD B19 @23.16dBm 677.0 mA LTE-FDD B26 @22.87dBm 690.0 mA LTE-TDD B41 @22.42dBm 439.0 mA WCDMA B1 @22.33dBm 605.0 mA WCDMA B6 @23.28dBm 549.0 mA WCDMA B19 @23.28dBm 549.
LTE Module Series EC25 Hardware Design LTE-TDD PF=64 (USB disconnected) 2.3 mA LTE-TDD PF=128 (USB disconnected) 1.6 mA EGSM900 DRX=5 (USB disconnected) 22.0 mA EGSM900 DRX=5 (USB connected) 34.0 mA WCDMA PF=64 (USB disconnected) 22.0 mA WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 24.0 mA LTE-FDD PF=64 (USB connected) 35.0 mA LTE-TDD PF=64 (USB disconnected) 24.0 Ma LTE-TDD PF=64 (USB connected) 35.0 mA GSM850 1UL/4DL @32.53dBm 232.
LTE Module Series EC25 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data (GNSS OFF) EC25_Hardware_Design PCS1900 1UL/4DL @29.19dBm 465.0 mA GSM850 1UL/4DL @27.09dBm 154.0 mA GSM850 2UL/3DL @26.94dBm 245.0 mA GSM850 3UL/2DL @26.64dBm 328.0 mA GSM850 4UL/1DL @26.53dBm 416.0 mA EGSM900 1UL/4DL @26.64dBm 157.0 mA EGSM900 2UL/3DL @26.95dBm 251.0 mA EGSM900 3UL/2DL @26.57dBm 340.0 mA EGSM900 4UL/1DL @26.39dBm 431.0 mA DCS18001 UL/4DL @26.03dBm 152.0 mA DCS1800 2UL/3DL @25.
LTE Module Series EC25 Hardware Design LTE datatransfer (GNSS OFF) GSM voice call WCDMA voice call LTE-FDD B1 @23.28dBm 817.0 mA LTE-FDD B2 @23.34dBm 803.0 mA LTE-FDD B3 @23.2dBm 785.0 mA LTE-FDD B4 @22.9dBm 774.0 mA LTE-FDD B5 @23.45dBm 687.0 mA LTE-FDD B7 @22.84dBm 843.0 mA LTE-FDD B8 @22.92dBm 689.0 mA LTE-FDD B28 @23.23dBm 804.0 mA LTE-TDD B40 @23.3dBm 429.0 mA GSM850 PCL5 @32.66dBm 228.0 mA EGSM900 PCL5 @32.59dBm 235.0 mA DCS1800 PCL0 @29.72dBm 178.
LTE Module Series EC25 Hardware Design WCDMA PF=64 (USB disconnected) 23.0 mA WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 17.0 mA LTE-FDD PF=64 (USB connected) 29.0 mA LTE-TDD PF=64 (USB disconnected) 21.0 mA LTE-TDD PF=64 (USB connected) 32.0 mA WCDMA B1 HSDPA @22.24dBm 500.0 mA WCDMA B1 HSUPA @22.05dBm 499.0 mA WCDMA B5 HSDPA @22.39dBm 418.0 mA WCDMA B5 HSUPA @22dBm 486.0 mA LTE-FDD B1 @23.28dBm 707.0 mA LTE-FDD B3 @23.36dBm 782.
LTE Module Series EC25 Hardware Design LTE-FDD PF=64 (USB disconnected) 2.2 mA LTE-FDD PF=128 (USB disconnected) 1.8 mA WCDMA PF=64 (USB disconnected) 23.3 mA WCDMA PF=64 (USB connected) 33.4 mA LTE-FDD PF=64 (USB disconnected) 17.6 mA LTE-FDD PF=64 (USB connected) 29.4 mA WCDMA B2 HSDPA @22.36dBm 509.0 mA WCDMA B2 HSUPA @22.27dBm 511.0 mA WCDMA B4 HSDPA @22.22dBm 521.0 mA WCDMA B4 HSUPA @22.31dBm 518.0 mA WCDMA B5 HSDPA @22.39dBm 496.0 mA WCDMA B5 HSUPA @22dBm 502.
LTE Module Series EC25 Hardware Design Table 41: GNSS Current Consumption of EC25 Series Module Parameter Description Searching (AT+CFUN=0) IVBAT (GNSS) Tracking (AT+CFUN=0) Conditions Typ. Unit Cold start @Passive Antenna 54.0 mA Lost state @Passive Antenna 53.9 mA Instrument Environment 30.5 mA Open Sky @Passive Antenna 33.2 mA Open Sky @Active Antenna 40.8 mA 6.5. RF Output Power The following table shows the RF output power of EC25 module.
LTE Module Series EC25 Hardware Design 6.6. RF Receiving Sensitivity The following tables show conducted RF receiving sensitivity of EC25 series module. Table 43: EC25-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm WCDMA B8 -110.5dBm / / -103.7dBm LTE-FDD B1 (10M) -98.0dBm -98.0dBm -101.5dBm -96.
LTE Module Series EC25 Hardware Design LTE-FDD B2 (10M) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B12 (10M) -96.5dBm -98.0dBm -101.0dBm -93.3dBm Table 45: EC25-V Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B13 (10M) -95.0dBm -97.0dBm -100.0dBm -93.
LTE Module Series EC25 Hardware Design Table 47: EC25-AU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 -109.0dBm / / -102.0dBm EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dBm PCS1900 -109.0dBm / / -102.0dBm WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B5 -111.0dBm / / -104.7dBm WCDMA B8 -111.0dBm / / -103.7dBm LTE-FDD B1 (10M) -97.2dBm -97.5dBm -100.2dBm -96.
LTE Module Series EC25 Hardware Design LTE-FDD B3 (10M) -98.0dBm -96.0dBm -100.0dBm -93.3dBm LTE-FDD B5 (10M) -98.0dBm -99.0dBm -102.5dBm -94.3dBm LTE-FDD B7 (10M) -97.0dBm -95.0dBm -98.5dBm -94.3dBm LTE-FDD B28 (10M) -97.0dBm -99.0dBm -102.0dBm -94.8dBm Table 49: EC25-AUTL Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B3 (10M) -98.0dBm -96.0dBm -100.0dBm -93.3dBm LTE-FDD B7 (10M) -97.0dBm -95.0dBm -98.5dBm -94.
LTE Module Series EC25 Hardware Design NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components.
LTE Module Series EC25 Hardware Design According to customers’ application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB.
LTE Module Series EC25 Hardware Design NOTE The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115°C.
LTE Module Series EC25 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 7.1. Mechanical Dimensions of the the Module 2.4±0.2 29.0±0.15 32.0±0.15 0.
LTE Module Series EC25 Hardware Design Figure 44: Module Bottom Dimensions (Bottom View) EC25_Hardware_Design 103 / 112
LTE Module Series EC25 Hardware Design 7.2. Recommended Footprint Figure 45: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of the module, please keep about 3mm between the module and other components in thehost PCB.
LTE Module Series EC25 Hardware Design 7.3. Design Effect Drawings of the Module Figure 46: Top View of the Module Figure 47: Bottom View of the Module NOTE These are design effect drawings of EC25 module. For more accurate pictures, please refer to the module that you get from Quectel.
LTE Module Series EC25 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: Mounted within 168 hours at the factory environment of ≤30ºC/60%RH. Stored at <10% RH. 3.
LTE Module Series EC25 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, thethickness of stencil for the module is recommended to be 0.20mm. For more details, please refer to document [4].
LTE Module Series EC25 Hardware Design 8.3. Packaging .1 ±0 0 5 1. 30.3± 0.15 0.35± 0.05 29.3± 0.15 44.00± 0.3 20.20± 0.15 44.00± 0.1 2.00± 0.1 4.00± 0.1 30.3± 0.15 1.75± 0.1 EC25 is packaged in tap andreel carriers. One reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm. 4.2± 0.15 3.1± 0.15 32.5± 0.15 33.5± 0.15 32.5± 0.15 33.5± 0.15 e p a t r e v o C 48.5 13 100 d e e f f o n o i t c e r i D 44.5+0.20 -0.
LTE Module Series EC25 Hardware Design 9 Appendix A References Table 52: Related Documents SN Document Name Remark [1] Quectel_EC2x&EG9x&EM05_Power_Management_ Application_Note Power management application notefor EC25, EC21, EC20 R2.0, EC20 R2.
LTE Module Series EC25 Hardware Design DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Pa
LTE Module Series EC25 Hardware Design PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SIM Subscriber Identification Module SIMO Single Input Multiple Output SMS Short Message Service TDD Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchron
LTE Module Series EC25 Hardware Design VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wirele
LTE Module Series EC25 Hardware Design 10 Appendix B GPRS Coding Schemes Table 54: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
LTE Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
LTE Module Series EC25 Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EC25_Hardware_Design 115 / 112
LTE Module Sires EC25Hardware Design 12 Appendix D EDGE Modulationand Coding Schemes Table 56: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.8kbps MCS-3 GMSK A 14.
LTE Module Sires EC25Hardware Design FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
LTE Module Sires EC25Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8.
LTE Module Sires EC25Hardware Design (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational.
LTE Module Sires EC25Hardware Design L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la même signification, comme suit: "Contient IC: 10224A-2019EC25AF
