Product Info

ManualsBrandsQuectel ManualsElectronicsLTE Module

EC25 Hardware Design

LTE Standard Module Series

Rev. EC25_Hardware_Design_V2.0

Date: 2019-04-30

Status: Released

www.quectel.com

Summary of content (127 pages)

PAGE 1
EC25 Hardware Design LTE Standard Module Series Rev. EC25_Hardware_Design_V2.0 Date: 2019-04-30 Status: Released www.quectel.
PAGE 2
LTE Standard Module Series EC25 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
PAGE 3
LTE Standard Module Series EC25 Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1. 2. 1.1 2016-09-22 Lyndon LIU/ Frank WANG Updated EC25 series frequency bands in Table 1. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4.
PAGE 4
LTE Standard Module Series EC25 Hardware Design 3. 4. 5. 6. 7. 8. 1. 2. 3. 4. 5. 6. 7. 8. 9. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 1. 2. 3. 1.5 2018-04-20 Kinsey ZHANG 4. 5. EC25_Hardware_Design Added BT interface in Chapter 3.18.2. Updated GNSS performance in Table 24. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. Updated current consumption of EC25-E module in Table 33.
PAGE 5
LTE Standard Module Series EC25 Hardware Design Table 50. 2.0 2019-04-30 EC25_Hardware_Design Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5. Updated reference circuit with translator chip in Figure 20. 6.
PAGE 6
LTE Standard Module Series EC25 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 5 Table Index ....................................................................................................................................
PAGE 7
LTE Standard Module Series EC25 Hardware Design 3.15. Network Status Indication ..................................................................................................... 60 3.16. STATUS ................................................................................................................................ 61 3.17. Behaviors of RI ..................................................................................................................... 62 3.18. SGMII Interface ................
PAGE 8
LTE Standard Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 124 12 Appendix D EDGE Modulation and Coding Schemes ................................................................
PAGE 9
LTE Standard Module Series EC25 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 17 TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 18 TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 25 TABLE 4: PIN DESCRIPTION ............................
PAGE 10
LTE Standard Module Series EC25 Hardware Design TABLE 42: EC25-EC CURRENT CONSUMPTION .......................................................................................... 95 TABLE 43: EC25-EUX CURRENT CONSUMPTION ........................................................................................ 97 TABLE 44: EC25-MX CURRENT CONSUMPTION ........................................................................................ 100 TABLE 45: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE ............
PAGE 11
LTE Standard Module Series EC25 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 22 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 24 FIGURE 3: SLEEP MODE APPLICATION VIA UART ......................................................................................
PAGE 12
LTE Standard Module Series EC25 Hardware Design FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA............................................................................. 77 FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 79 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 79 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ..............................................
PAGE 13
LTE Standard Module Series EC25 Hardware Design 1 Introduction This document defines the EC25 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. To facilitate its application in different fields, relevant reference design is also provided for customers’ reference.
PAGE 14
LTE Standard Module Series EC25 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
PAGE 15
LTE Standard Module Series EC25 Hardware Design 1.2. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
PAGE 16
LTE Standard Module Series EC25 Hardware Design For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations.
PAGE 17
LTE Standard Module Series EC25 Hardware Design this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
PAGE 18
LTE Standard Module Series EC25 Hardware Design 2 Product Concept 2.1. General Description EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’ specific applications.
PAGE 19
LTE Standard Module Series EC25 Hardware Design EC25-EC FDD: B1/B3/B7/B8/B20/ B28A B1/B8 900/1800MHz Y EC25-EUX FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800MHz Y EC25-AUTL FDD: B3/B7/B28 N N Y N EC25-MX FDD: B2/B4//B5/B7/B28/ B66 B2/B4/B5 N Y N NOTES 1. 1) 2. 2) 3. 4. 5. GNSS function is optional. EC25 series module contains Telematics version and Data-only version.
PAGE 20
LTE Standard Module Series EC25 Hardware Design Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class E2 (26dBm±3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands LTE Features Support up to non-CA Cat 4 FDD and TDD Support 1.
PAGE 21
LTE Standard Module Series EC25 Hardware Design PCM Interface USB Interface UART Interfaces Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.
PAGE 22
LTE Standard Module Series EC25 Hardware Design NOTES 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances.
PAGE 23
LTE Standard Module Series EC25 Hardware Design SAW ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch Duplex LNA SAW VBAT_RF APT PA PRx DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC Control Control PWRKEY Baseband RESET_N ADCs 19.2M XO STATUS VDD_EXT USB (U)SIM PCM I2C UARTs SGMII WLAN BT* GPIOs SD Figure 1: Functional Diagram NOTE “*” means under development. 2.4.
PAGE 24
LTE Standard Module Series EC25 Hardware Design 3 Application Interfaces 3.1. General Description EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform.
PAGE 25
LTE Standard Module Series EC25 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module. Figure 2: Pin Assignment (Top View) NOTES 1. 2. 1) 3. 4. 3) 5. 2) means that these pins cannot be pulled up before startup. PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. means these interface functions are only supported on Telematics version.
PAGE 26
LTE Standard Module Series EC25 Hardware Design 6. 7. 8. 9. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on the BT module. Keep all RESERVED pins and unused pins unconnected. GND pads 85~112 should be connected to ground in the design. RESERVED pads 73~84 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area. “*” means under development. 3.3. Pin Description The following tables show the pin definition of EC25 module.
PAGE 27
LTE Standard Module Series EC25 Hardware Design Vnorm=3.8V VDD_EXT 7 PO GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA current up to 1.8A in a burst transmission. Power supply for external GPIO’s pull-up circuits. If unused, keep it open. Ground Turn on/off Pin Name Pin No. I/O Description DC Characteristics Comment DI Turn on/off the module VH=0.8V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
PAGE 28
LTE Standard Module Series EC25 Hardware Design USB_DP USB_DM 69 70 USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open. IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open. I/O Description DC Characteristics Comment VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open.
PAGE 29
LTE Standard Module Series EC25 Hardware Design VOHmin=2.55V USIM_RST 17 DO Reset signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V Main UART Interface Pin Name RI DCD CTS RTS DTR TXD RXD Pin No. 62 63 64 65 66 67 68 I/O Description DC Characteristics Comment DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain.
PAGE 30
LTE Standard Module Series EC25 Hardware Design open. DBG_RXD DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V I/O Description DC Characteristics Comment AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. 44 AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. Pin No. I/O Description DC Characteristics Comment PCM data input VILmin=-0.3V VILmax=0.6V VIHmin=1.
PAGE 31
LTE Standard Module Series EC25 Hardware Design I2C_SCL I2C_SDA 41 42 OD I2C serial clock. Used for external codec. An external pull-up resistor is required. 1.8V only. If unused, keep it open. OD I2C serial data. Used for external codec. An external pull-up resistor is required. 1.8V only. If unused, keep it open. I/O Description SD Card Interface Pin Name SDC2_ DATA3 Pin No.
PAGE 32
LTE Standard Module Series EC25 Hardware Design VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SDC2_ DATA0 SDC2_CLK SDC2_CMD 31 32 33 EC25_Hardware_Design IO DO IO SD card SDIO bus DATA0 SD card SDIO bus clock SD card SDIO bus command 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.
PAGE 33
LTE Standard Module Series EC25 Hardware Design 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SD_INS_ DET VDD_SDIO 23 34 DI SD card insertion detect VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PO SD card SDIO bus pull-up power IOmax=50mA 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. I/O Description DC Characteristics Comment SGMII Interface Pin Name Pin No.
PAGE 34
LTE Standard Module Series EC25 Hardware Design SGMII_ MCLK USIM2_VDD 122 128 SGMII_TX_M 123 SGMII_TX_P 124 SGMII_RX_P 125 SGMII_RX_M 126 DO PO AO AO AI AI SGMII MDIO (Management Data Input/Output) clock For 1.8V: VOLmax=0.45V VOHmin=1.4V For 2.85V: VOLmax=0.35V VOHmin=2.14V 1.8V/2.85V power domain. If unused, keep it open. SGMII MDIO pull-up power source Configurable power source. 1.8V/2.85V power domain. External pull-up for SGMII MDIO pins. If unused, keep it open.
PAGE 35
LTE Standard Module Series EC25 Hardware Design VIHmax=2.0V SDC1_ DATA2 SDC1_ DATA1 SDC1_ DATA0 SDC1_CLK SDC1_CMD 130 131 132 133 134 PM_ENABLE 127 WAKE_ON_ WIRELESS WLAN_EN 135 136 COEX_UART 137 _RX EC25_Hardware_Design WLAN SDIO data bus D2 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. WLAN SDIO data bus D1 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain.
PAGE 36
LTE Standard Module Series EC25 Hardware Design COEX_UART 138 _TX DO LTE/WLAN&BT coexistence signal WLAN_SLP_ 118 CLK DO WLAN sleep clock BT_RTS* BT_TXD* BT_RXD* 37 38 39 VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. DI BT UART request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. DO BT UART transmit data VOLmax=0.45V VOHmin=1.35V 1.
PAGE 37
LTE Standard Module Series EC25 Hardware Design the module. If unused, keep it open. W_DISABLE# AP_READY 4 2 1.8V power domain. Pull-up by default. At low voltage level, module can enter into airplane mode. If unused, keep it open. DI Airplane mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V DI Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open.
PAGE 38
LTE Standard Module Series EC25 Hardware Design 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate.
PAGE 39
LTE Standard Module Series EC25 Hardware Design The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART    Driving the host DTR to low level will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection).
PAGE 40
LTE Standard Module Series EC25 Hardware Design The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup   Sending data to EC25 through USB will wake up the module. When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3.
PAGE 41
LTE Standard Module Series EC25 Hardware Design   Sending data to EC25 through USB will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter into sleep mode.    Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open.
PAGE 42
LTE Standard Module Series EC25 Hardware Design Hardware: The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter into airplane mode. Software: AT+CFUN command provides the choice of the functionality level through setting into 0, 1 or 4.  AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1.
PAGE 43
LTE Standard Module Series EC25 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.
PAGE 44
LTE Standard Module Series EC25 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.
PAGE 45
LTE Standard Module Series EC25 Hardware Design 3.7. Power-on and off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name PWRKEY Pin No. 21 I/O Description Comment DI Turn on/off the module The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms.
PAGE 46
LTE Standard Module Series EC25 Hardware Design Figure 11: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. NOTE VBA T ≥500ms VH=0.8V PWRKEY VIL≤0.5V Abo ut 100ms VDD_EXT ≥100ms, afte r this time, the BOOT_CONFIG pins ca n b e set h igh level b y exter nal circuit BOO T_CONFIG & USB_BOO T PINS RESET_N ≥2.
PAGE 47
LTE Standard Module Series EC25 Hardware Design NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them should be no less than 30ms. 3.7.2. Turn off Module The following procedures can be used to turn off the module:  Normal power-off procedure: Turn off the module using the PWRKEY pin.  Normal power-off procedure: Turn off the module using AT+QPOWD command. 3.7.2.1.
PAGE 48
LTE Standard Module Series EC25 Hardware Design NOTES 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successfully turn-off. 3.8.
PAGE 49
LTE Standard Module Series EC25 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Reset Scenario of Module NOTES 1. 2. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The(U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported.
PAGE 50
LTE Standard Module Series EC25 Hardware Design Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment Either 1.8V or 3.0V is supported by the module automatically. USIM_VDD 14 PO Power supply for (U)SIM card USIM_DATA 15 IO Data signal of (U)SIM card USIM_CLK 16 DO Clock signal of (U)SIM card USIM_RST 17 DO Reset signal of (U)SIM card USIM_ PRESENCE 13 DI (U)SIM card insertion detection USIM_GND 10 1.8V power domain. If unused, keep it open.
PAGE 51
LTE Standard Module Series EC25 Hardware Design Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design:       Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces.
PAGE 52
LTE Standard Module Series EC25 Hardware Design used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 10: Pin Description of USB Interface Pin Name Pin No.
PAGE 53
LTE Standard Module Series EC25 Hardware Design The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification.     It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90Ω. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces.
PAGE 54
LTE Standard Module Series EC25 Hardware Design DTR 66 DI Data terminal ready, sleep mode control TXD 67 DO Transmit data RXD 68 DI Receive data Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description DBG_TXD 12 DO Transmit data Comment 1.8V power domain DBG_RXD 11 DI Receive data The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.
PAGE 55
LTE Standard Module Series EC25 Hardware Design VDD_EXT VCCA 120K VCCB 10K 0.1uF 0.1uF VDD_MCU OE GND RI A1 B1 RI_MCU DCD A2 B2 DCD_MCU B3 CTS_MCU Translator CTS A3 RTS A4 B4 RTS_MCU DTR A5 B5 DTR_MCU TXD A6 B6 TXD_MCU RXD A7 B7 A8 B8 51K 51K RXD_MCU Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below.
PAGE 56
LTE Standard Module Series EC25 Hardware Design 3.12. PCM and I2C Interfaces EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:   Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge.
PAGE 57
LTE Standard Module Series EC25 Hardware Design Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8V power domain PCM_OUT 25 DO PCM data output 1.8V power domain PCM_SYNC 26 IO PCM data frame synchronization signal 1.
PAGE 58
LTE Standard Module Series EC25 Hardware Design Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. 2. It is recommended to reserve an RC (R=22Ω, C=22pF) circuits on the PCM lines, especially for PCM_CLK. EC25 works as a master device pertaining to I2C interface. 3.13. SD Card Interface EC25 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No.
PAGE 59
LTE Standard Module Series EC25 Hardware Design SDC2_CMD 33 IO SD card SDIO bus command VDD_SDIO 34 PO SD card SDIO bus pull up power 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. SD_INS_DET 23 DI SD card insertion detection 1.8V power domain. If unused, keep it open. The following figure shows a reference design of SD card.
PAGE 60
LTE Standard Module Series EC25 Hardware Design    It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50Ω (±10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15pF. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 50mm.
PAGE 61
LTE Standard Module Series EC25 Hardware Design 3. It is recommended to use a resistor divider circuit for ADC application. 3.15. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. Table 18: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No.
PAGE 62
LTE Standard Module Series EC25 Hardware Design Figure 26: Reference Circuit of the Network Indicator 3.16. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 20: Pin Definition of STATUS Pin Name STATUS Pin No.
PAGE 63
LTE Standard Module Series EC25 Hardware Design 3.17. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of RI pin. NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below.
PAGE 64
LTE Standard Module Series EC25 Hardware Design Table 22: Pin Definition of SGMII Interface Pin Name Pin No. I/O Description Comment EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain SGMII_MDATA 121 IO SGMII MDIO (Management Data Input/Output) data 1.8V/2.85V power domain SGMII_MCLK DO SGMII MDIO (Management Data Input/Output) clock 1.8V/2.
PAGE 65
LTE Standard Module Series EC25 Hardware Design Figure 29: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design:     Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc.
PAGE 66
LTE Standard Module Series EC25 Hardware Design Table 23: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment SDC1_DATA3 129 IO WLAN SDIO data bus D3 1.8V power domain SDC1_DATA2 130 IO WLAN SDIO data bus D2 1.8V power domain SDC1_DATA1 131 IO WLAN SDIO data bus D1 1.8V power domain SDC1_DATA0 132 IO WLAN SDIO data bus D0 1.8V power domain SDC1_CLK 133 DO WLAN SDIO bus clock 1.8V power domain SDC1_CMD 134 IO WLAN SDIO bus command 1.
PAGE 67
LTE Standard Module Series EC25 Hardware Design PCM_IN1) 24 DI PCM data input 1.8V power domain PCM_OUT1) 25 DO PCM data output 1.8V power domain PCM_SYNC1) 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK1) 27 IO PCM data bit clock 1.8V power domain BT_EN* 139 DO BT function control via FC20 module. 1.8V power domain Active high. The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module.
PAGE 68
LTE Standard Module Series EC25 Hardware Design 3.19.1. WLAN Interface EC25 provides a low power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports the SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:      It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50Ω±10%.
PAGE 69
LTE Standard Module Series EC25 Hardware Design Table 24: Pin Definition of USB_BOOT Interface Pin Name Pin No. USB_BOOT I/O 115 DI Description Comment Force the module to enter into emergency download mode 1.8V power domain. Active high. It is recommended to reserve test point. The following figure shows a reference circuit of USB_BOOT interface. Module VDD_EXT Test point USB_BOOT 4.7K Close to test point TVS Figure 31: Reference Circuit of USB_BOOT Interface NOTE VBAT ≥500ms VH=0.
PAGE 70
LTE Standard Module Series EC25 Hardware Design NOTES 1. 2. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. When using MCU to control module to enter into the forced download mode, follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up the VBAT. Short the test points as shown in Figure 31 can manually force the module to enter into download mode.
PAGE 71
LTE Standard Module Series EC25 Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command.
PAGE 72
LTE Standard Module Series EC25 Hardware Design Hot start @open sky Accuracy (GNSS) CEP-50 Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.
PAGE 73
LTE Standard Module Series EC25 Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
PAGE 74
LTE Standard Module Series EC25 Hardware Design WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B6 830~840 875~885 MHz WCDMA B8 880~915 925~960 MHz WCDMA B19 830~845 875~890 MHz LTE FDD B1 1920~1980 2110~2170 MHz LTE FDD B2 1850~1910 1930~1990 MHz LTE FDD B3 1710~1785 1805~1880 MHz LTE FDD B4 1710~1755 2110~2155 MHz LTE FDD B5 824~849 869~894 MHz LTE FDD B7 2500~2570 2620~2690 MHz LTE FDD B8 880~915 925~9
PAGE 75
LTE Standard Module Series EC25 Hardware Design LTE FDD B71 663~698 617~652 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 33: Reference Circuit of RF Antenna Interface NOTES 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2.
PAGE 76
LTE Standard Module Series EC25 Hardware Design .
PAGE 77
LTE Standard Module Series EC25 Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:      Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
PAGE 78
LTE Standard Module Series EC25 Hardware Design Table 29: GNSS Frequency Type Frequency Unit GPS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz Galileo 1575.42±2.046 MHz BeiDou 1561.098±2.046 MHz QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below. Figure 38: Reference Circuit of GNSS Antenna NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement.
PAGE 79
LTE Standard Module Series EC25 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.
PAGE 80
LTE Standard Module Series EC25 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.
PAGE 81
LTE Standard Module Series EC25 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
PAGE 82
LTE Standard Module Series EC25 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
PAGE 83
LTE Standard Module Series EC25 Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.0 A USB_VBUS USB detection 5.
PAGE 84
LTE Standard Module Series EC25 Hardware Design returns to the normal operation temperature levels, the module will meet 3GPP specifications again. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 uA AT+CFUN=0 (USB disconnected) 1.16 mA GSM DRX=2 (USB disconnected) 2.74 mA GSM DRX=9 (USB disconnected) 2.0 mA WCDMA PF=64 (USB disconnected) 2.
PAGE 85
LTE Standard Module Series EC25 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC25_Hardware_Design LTE-TDD PF=64 (USB connected) 32.0 mA EGSM900 4DL/1UL @33.22dBm 271.0 mA EGSM900 3DL/2UL @33.0dBm 464.0 mA EGSM900 2DL/3UL @30.86dBm 524.0 mA EGSM900 1DL/4UL @29.58dBm 600 mA DCS1800 4DL/1UL @29.92dBm 192.0 mA DCS1800 3DL/2UL @29.84dBm 311.0 mA DCS1800 2DL/3UL @29.67dBm 424.
PAGE 86
LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-FDD B5 @22.83dBm 762.0 mA LTE-FDD B7 @23.37dBm 842.0 mA LTE-FDD B8 @23.48dBm 720.0 mA LTE-FDD B20 @22.75dBm 714.0 mA LTE-TDD B38 @23.05dBm 481.0 mA LTE-TDD B40 @23.17dBm 431.8 mA LTE-TDD B41 @23.02dBm 480.0 mA EGSM900 PCL=5 @33.08dBm 264.0 mA DCS1800 PCL=0 @29.75dBm 190.0 mA WCDMA B1 @23.22dBm 680.0 mA WCDMA B5 @23.18dBm 677.0 mA WCDMA B8 @23.54dBm 618.
PAGE 87
LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B2 HSDPA @21.9dBm 591.0 mA WCDMA B2 HSUPA @21.62dBm 606.0 mA WCDMA B4 HSDPA @22.02dBm 524.0 mA WCDMA B4 HSUPA @21.67dBm 540.0 mA WCDMA B5 HSDPA @22.71dBm 490.0 mA WCDMA B5 HSUPA @22.58dBm 520.0 mA LTE-FDD B2 @22.93dBm 715.0 mA LTE-FDD B4 @22.96dBm 738.0 mA LTE-FDD B12 @23.35dBm 663.0 mA WCDMA B2 @22.93dBm 646.0 mA WCDMA B4 @23dBm 572.
PAGE 88
LTE Standard Module Series EC25 Hardware Design Table 37: EC25-J Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 10 uA AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF=64 (USB disconnected) 1.9 mA WCDMA PF=128 (USB disconnected) 1.5 mA LTE-FDD PF=64 (USB disconnected) 2.5 mA LTE-FDD PF=128 (USB disconnected) 1.8 mA LTE-TDD PF=64 (USB disconnected) 2.6 mA LTE-TDD PF=128 (USB disconnected) 1.9 mA WCDMA PF=64 (USB disconnected) 21.
PAGE 89
LTE Standard Module Series EC25 Hardware Design WCDMA voice call LTE-FDD B18 @23.35dBm 661.0 mA LTE-FDD B19 @23.16dBm 677.0 mA LTE-FDD B26 @22.87dBm 690.0 mA LTE-TDD B41 @22.42dBm 439.0 mA WCDMA B1 @22.33dBm 605.0 mA WCDMA B6 @23.28dBm 549.0 mA WCDMA B19 @23.28dBm 549.0 mA Table 38: EC25-AU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 uA AT+CFUN=0 1.3 mA AT+CFUN=0 (USB disconnected) 1.46 mA GSM850 DRX=5 (USB disconnected) 1.
PAGE 90
LTE Standard Module Series EC25 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) EC25_Hardware_Design WCDMA PF=64 (USB disconnected) 22.0 mA WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 24.0 mA LTE-FDD PF=64 (USB connected) 35.0 mA GSM850 1UL/4DL @32.53dBm 232.0 mA GSM850 2UL/3DL @32.34dBm 384.0 mA GSM850 3UL/2DL @30.28dBm 441.0 mA GSM850 4UL/1DL @29.09dBm 511.0 mA EGSM900 1UL/4DL @32.34dBm 241.0 mA EGSM900 2UL/3DL @32.
PAGE 91
LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC25_Hardware_Design EGSM900 2UL/3DL @26.95dBm 251.0 mA EGSM900 3UL/2DL @26.57dBm 340.0 mA EGSM900 4UL/1DL @26.39dBm 431.0 mA DCS18001 UL/4DL @26.03dBm 152.0 mA DCS1800 2UL/3DL @25.62dBm 240.0 mA DCS1800 3UL/2DL @25.42dBm 325.0 mA DCS1800 4UL/1DL @25.21dBm 415.0 mA PCS1900 1UL/4DL @25.65dBm 148.0 mA PCS1900 1UL/4DL @25.63dBm 232.0 mA PCS1900 1UL/4DL @25.54dBm 313.
PAGE 92
LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-FDD B8 @22.92dBm 689.0 mA LTE-FDD B28 @23.23dBm 804.0 mA LTE-TDD B40 @23.3dBm 429.0 mA GSM850 PCL5 @32.66dBm 228.0 mA EGSM900 PCL5 @32.59dBm 235.0 mA DCS1800 PCL0 @29.72dBm 178.0 mA PCS1900 PCL0 @29.82dBm 170.0 mA WCDMA B1 @23.27dBm 687.0 mA WCDMA B2 @23.38dBm 668.0 mA WCDMA B5 @23.38dBm 592.0 mA WCDMA B8 @23.32dBm 595.
PAGE 93
LTE Standard Module Series EC25 Hardware Design IVBAT WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B1 HSDPA @22.24dBm 500.0 mA WCDMA B1 HSUPA @22.05dBm 499.0 mA WCDMA B5 HSDPA @22.39dBm 418.0 mA WCDMA B5 HSUPA @22dBm 486.0 mA LTE-FDD B1 @23.28dBm 707.0 mA LTE-FDD B3 @23.36dBm 782.0 mA LTE-FDD B5 @23.32dBm 588.0 mA LTE-FDD B7 @23.08dBm 692.0 mA LTE-FDD B28-A @23.37dBm 752.0 mA LTE-FDD B28-B @23.48dBm 770.0 mA WCDMA B1 @23.22dBm 546.
PAGE 94
LTE Standard Module Series EC25 Hardware Design IVBAT WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B2 HSDPA @22.63dBm 560.0 mA WCDMA B2 HSUPA @22.49dBm 564.0 mA WCDMA B4 HSDPA @22.45dBm 601.0 mA WCDMA B4 HSUPA @22.57dBm 610.0 mA WCDMA B5 HSDPA @22.49dBm 603.0 mA WCDMA B5 HSUPA @22.43dBm 617.0 mA LTE-FDD B2 @22.92dBm 698.0 mA LTE-FDD B4 @23.12dBm 710.0 mA LTE-FDD B5 @22.98dBm 650.0 mA LTE-FDD B12 @23.42dBm 648.0 mA LTE-FDD B13 @22.
PAGE 95
LTE Standard Module Series EC25 Hardware Design WCDMA PF=128 (USB disconnected) 1.67 mA LTE-FDD PF=64 (USB disconnected) 2.60 mA LTE-FDD PF=128 (USB disconnected) 1.90 mA LTE-TDD PF=64 (USB disconnected) 2.79 mA LTE-TDD PF=128 (USB disconnected) 2.00 mA GSM DRX=5 (USB disconnected) 19.5 mA GSM DRX=5 (USB connected) 29.5 mA WCDMA PF=64 (USB disconnected) 21.0 mA WCDMA PF=64 (USB connected) 31.0 mA LTE-FDD PF=64 (USB disconnected) 20.7 mA LTE-FDD PF=64 (USB connected) 30.
PAGE 96
LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call DCS1800 4DL/1UL PCL=2 @25.59dBm 136.0 mA DCS1800 3DL/2UL PCL=2 @24.54dBm 225.0 mA DCS1800 2DL/3UL PCL=2 @22.38dBm 300.0 mA DCS1800 1DL/4UL PCL=2 @21.24dBm 379.0 mA WCDMA B1 HSDPA @22.93dBm 504.0 mA WCDMA B1 HSUPA @22.62dBm 512.0 mA WCDMA B8 HSDPA @22.88dBm 562.0 mA WCDMA B8 HSUPA @22.14dBm 535.0 mA LTE-FDD B1 @23.6dBm 664.
PAGE 97
LTE Standard Module Series EC25 Hardware Design Sleep state AT+CFUN=0 (USB disconnected) 1.02 mA GSM DRX=2 (USB disconnected) 2.01 mA GSM DRX=9 (USB disconnected) 2.1 mA WCDMA PF=64 (USB disconnected) 2.02 mA WCDMA PF=128 (USB disconnected) 1.39 mA LTE-FDD PF=64 (USB disconnected) 2.20 mA LTE-FDD PF=128 (USB disconnected) 1.81 mA GSM DRX=5 (USB disconnected) 18.7 mA GSM DRX=5 (USB connected) 27.6 mA WCDMA PF=64 (USB disconnected) 21.0 mA WCDMA PF=64 (USB connected) 31.
PAGE 98
LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) DCS1800 4DL/1UL PCL=2 @25.59dBm 132.0 mA DCS1800 3DL/2UL PCL=2 @24.54dBm 205.0 mA DCS1800 2DL/3UL PCL=2 @22.38dBm 300.0 mA DCS1800 1DL/4UL PCL=2 @21.24dBm 359.0 mA WCDMA B1 HSDPA @22.43dBm 504.0 mA WCDMA B1 HSUPA @21.92dBm 497.0 mA WCDMA B8 HSDPA @22.88dBm 562.0 mA WCDMA B8 HSUPA @22.14dBm 535.0 mA LTE-FDD B1 @23.6dBm 659.0 mA LTE-FDD B3 @23.67dBm 693.
PAGE 99
LTE Standard Module Series EC25 Hardware Design WCDMA PF=64 (USB disconnected) 1.99 mA WCDMA PF=128 (USB disconnected) 1.39 mA LTE-FDD PF=64 (USB disconnected) 2.48 mA LTE-FDD PF=128 (USB disconnected) 1.81 mA LTE-TDD PF=64 (USB disconnected) 2.79 mA LTE-TDD PF=128 (USB disconnected) 2.00 mA GSM DRX=5 (USB disconnected) 19.5 mA GSM DRX=5 (USB connected) 29.5 mA WCDMA PF=64 (USB disconnected) 21.0 mA WCDMA PF=64 (USB connected) 31.0 mA LTE-FDD PF=64 (USB disconnected) 20.
PAGE 100
LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call EC25_Hardware_Design EGSM900 1DL/4UL PCL=8 @22.36dBm 348.0 mA DCS1800 4DL/1UL PCL=2 @25.59dBm 136.0 mA DCS1800 3DL/2UL PCL=2 @24.54dBm 225.0 mA DCS1800 2DL/3UL PCL=2 @22.38dBm 300.0 mA DCS1800 1DL/4UL PCL=2 @21.24dBm 379.0 mA WCDMA B1 HSDPA @22.93dBm 504.0 mA WCDMA B1 HSUPA @22.62dBm 512.0 mA WCDMA B8 HSDPA @22.88dBm 562.
PAGE 101
LTE Standard Module Series EC25 Hardware Design Table 44: EC25-MX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 19 uA AT+CFUN=0 (USB disconnected) 1.0 mA WCDMA PF=64 (USB disconnected) 2.3 mA WCDMA PF=128 (USB disconnected) 1.7 mA LTE-FDD PF=64 (USB disconnected) 2.5 mA LTE-FDD PF=128 (USB disconnected) 2.2 mA WCDMA PF=64 (USB disconnected) 12.9 mA WCDMA PF=64 (USB connected) 32 mA LTE-FDD PF=64 (USB disconnected) 13.
PAGE 102
LTE Standard Module Series EC25 Hardware Design call WCDMA B4 @23.5dBm 633.0 mA WCDMA B5 @23.5dBm 551.0 mA Table 45: GNSS Current Consumption of EC25 Series Module Parameter Description Searching (AT+CFUN=0) IVBAT (GNSS) Tracking (AT+CFUN=0) Conditions Typ. Unit Cold start @Passive Antenna 54.0 mA Lost state @Passive Antenna 53.9 mA Instrument Environment 30.5 mA Open Sky @Passive Antenna 33.2 mA Open Sky @Active Antenna 40.8 mA 6.5.
PAGE 103
LTE Standard Module Series EC25 Hardware Design NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC25 series module. Table 47: EC25-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.
PAGE 104
LTE Standard Module Series EC25 Hardware Design Table 48: EC25-A Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B2 (10M) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B12 (10M) -97.2dBm -98.0dBm -101.0dBm -93.
PAGE 105
LTE Standard Module Series EC25 Hardware Design LTE-FDD B26 (10M) -99.5dBm -99.0dBm -101.5dBm -93.8dBm LTE-TDD B41 (10M) -95.0dBm -95.7dBm -99.0dBm -94.3dBm Table 51: EC25-AU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 -109.0dBm / / -102.0dBm EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dBm PCS1900 -109.0dBm / / -102.0dBm WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B5 -111.
PAGE 106
LTE Standard Module Series EC25 Hardware Design Table 52: EC25-AUT Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B1 (10M) -98.5dBm -98.0dBm -101.0dBm -96.3dBm LTE-FDD B3 (10M) -98.0dBm -97.0dBm -100.0dBm -93.3dBm LTE-FDD B5 (10M) -98.0dBm -99.0dBm -102.5dBm -94.3dBm LTE-FDD B7 (10M) -97.0dBm -97.0dBm -98.5dBm -94.3dBm LTE-FDD B28 (10M) -97.0dBm -99.0dBm -102.
PAGE 107
LTE Standard Module Series EC25 Hardware Design LTE-FDD B13 (10M) -98.5dBm -99.5dBm -100.7dBm -93.3dBm LTE-FDD B14 (10M) -99.4dBm -99.5dBm -100.9dBm -93.3dBm LTE-FDD B66 (10M) -97.5dBm -98.5dBm -99.6dBm -95.8dBm LTE-FDD B71 (10M) -98.6dBm -99.5dBm -100dBm -93.5dBm Table 55: EC25-EU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -109.5dBm -109.5dBm / -106.
PAGE 108
LTE Standard Module Series EC25 Hardware Design WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B8 -110.5dBm / / -103.7dBm LTE-FDD B1 (10M) -98.0dBm -98.0dBm -101.0dBm -96.3dBm LTE-FDD B3 (10M) -96.5dBm -98.5dBm -100.0dBm -93.3dBm LTE-FDD B7 (10M) -97.0dBm -95.5dBm -99.5dBm -94.3dBm LTE-FDD B8 (10M) -97.0dBm -97.0dBm -101.0dBm -93.3dBm LTE-FDD B20 (10M) -97.5dBm -99.0dBm -101.0dBm -93.3dBm LTE-FDD B28 (10M) -98.6dBm -98.7dBm -101.5dBm -94.
PAGE 109
LTE Standard Module Series EC25 Hardware Design Table 58: EC25-MX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -109dBm -110.5dBm / -104.7dBm WCDMA B4 -109.5dBm -110dBm / -106.7dBm WCDMA B5 -110dBm -111dBm / -104.7dBm LTE-FDD B2 (10M) -98dBm -99.1dBm -101.5dBm -94.3dBm LTE-FDD B4 (10M) -98.5dBm -98.2dBm -101.5dBm -96.3dBm LTE-FDD B5 (10M) -99dBm -99.2dBm -102.5dBm -94.3dBm LTE-FDD B7 (10M) -97dBm -98.5dBm -101.5dBm -94.
PAGE 110
LTE Standard Module Series EC25 Hardware Design All Antenna Interfaces ±4 ±8 kV Other Interfaces ±0.5 ±1 kV 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:        On customers’ PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc.
PAGE 111
LTE Standard Module Series EC25 Hardware Design Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTES 1. 2. The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).
PAGE 112
LTE Standard Module Series EC25 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 7.1. Mechanical Dimensions of the Module 2.4±0.2 29.0±0.15 32.0±0.15 0.
PAGE 113
LTE Standard Module Series EC25 Hardware Design Figure 45: Module Bottom Dimensions (Bottom View) EC25_Hardware_Design 112 / 112
PAGE 114
LTE Standard Module Series EC25 Hardware Design 7.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB.
PAGE 115
LTE Standard Module Series EC25 Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are design effect drawings of EC25 module. For more accurate pictures, please refer to the module that you get from Quectel.
PAGE 116
LTE Standard Module Series EC25 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:   Mounted within 168 hours at the factory environment of ≤30ºC/60%RH. Stored at <10% RH. 3.
PAGE 117
LTE Standard Module Series EC25 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm~0.20mm. For more details, please refer to document [4].
PAGE 118
LTE Standard Module Series EC25 Hardware Design Max slope 2 to 3°C/sec Reflow time (D: over 220°C) 40 to 60 sec Max temperature 238°C ~ 245°C Cooling down slope 1 to 4°C/sec Reflow Cycle Max reflow cycle 1 8.3. Packaging .1 ±0 0 5 1. 30.3± 0.15 0.35± 0.05 29.3± 0.15 44.00± 0.3 20.20± 0.15 44.00± 0.1 2.00± 0.1 4.00± 0.1 30.3± 0.15 1.75± 0.1 EC25 is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules.
PAGE 119
LTE Standard Module Series EC25 Hardware Design e p a t r e v o C 48.5 13 100 d e e f f o n o i t c e r i D 44.5+0.20 -0.
PAGE 120
LTE Standard Module Series EC25 Hardware Design 9 Appendix A References Table 61: Related Documents SN Document Name Remark [1] Quectel_EC2x&EG9x&EM05_Power_Management_ Application_Note Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EM05 modules [2] Quectel_EC2x&EG9x&EM05_AT_Commands_ Manual AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.
PAGE 121
LTE Standard Module Series EC25 Hardware Design CTS Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellit
PAGE 122
LTE Standard Module Series EC25 Hardware Design MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SGMII Serial Gigabit Media Independent Interface SIM Subscriber Identification Module SIMO Single Input Multi
PAGE 123
LTE Standard Module Series EC25 Hardware Design Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low
PAGE 124
LTE Standard Module Series EC25 Hardware Design 10 Appendix B GPRS Coding Schemes Table 63: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
PAGE 125
LTE Standard Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
PAGE 126
LTE Standard Module Series EC25 Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EC25_Hardware_Design 125 / 112
PAGE 127
LTE Module Sires EC25Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 65: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.8kbps MCS-3 GMSK A 14.