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AG35 Hardware Design

Automotive Module Series

Rev. AG35_Hardware_Design_V1.3

Date: 2019-05-20

Status: Released

www.quectel.com

Summary of content (134 pages)

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AG35 Hardware Design Automotive Module Series Rev. AG35_Hardware_Design_V1.3 Date: 2019-05-20 Status: Released www.quectel.
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Automotive Module Series AG35 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
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Automotive Module Series AG35 Hardware Design About the Document History Revision Date Author Description 1.0 2018-03-19 Eden LIU/ Dominic GONG Initial Eden LIU/ Dominic GONG/ Ethan SHAN 1. Updated the variants and/or frequency bands of AG35 (Table 1). 2. Updated the functional diagram (Figure 1). 3. Updated the pin assignment of AG35 (Figure 2). 4. Updated the drive current of STATUS pin (Table 4). 5. Enabled SHDN_N (pin 176), and added the description of the interface in Chapter 3.7.2.3. 6.
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Automotive Module Series AG35 Hardware Design 16. Updated the recommended reflow soldering thermal profile and involved parameters (Chapter 8.2). 1.2 2019-04-30 Eden LIU/ Dominic GONG 1. Removed the optional LTE-FDD B28 from AG35-NA. 2. Enabled HSIC interface (pin 194/195) and added related information thereof (Chapter 2.2, Chapter 2.3, Chapter 3.2, Chapter 3.3 and Chapter 3.23). 3. Added audio interface characteristics (Table 17). 4.
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Automotive Module Series AG35 Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 4 Table Index ................................................................................................................................
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Automotive Module Series AG35 Hardware Design 3.12. Audio Interface (Optional) ......................................................................................................... 55 3.13. PCM and I2C Interfaces............................................................................................................ 57 3.14. SDIO Interfaces......................................................................................................................... 60 3.14.1. SDIO1 Interface .............
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Automotive Module Series AG35 Hardware Design 7.3. Design Effect Drawings of the Module.................................................................................... 121 8 Storage, Manufacturing and Packaging ........................................................................................ 122 8.1. Storage .................................................................................................................................... 122 8.2. Manufacturing and Soldering .................
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Automotive Module Series AG35 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF AG35 SERIES MODULES ..................................................................... 17 TABLE 2: AG35 KEY FEATURES ..................................................................................................................... 18 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 25 TABLE 4: PIN DESCRIPTION .................
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Automotive Module Series AG35 Hardware Design TABLE 42: AG35-J OPERATING FREQUENCIES ........................................................................................... 81 TABLE 43: PIN DEFINITION OF GNSS ANTENNA INTERFACE..................................................................... 85 TABLE 44: GNSS FREQUENCY ....................................................................................................................... 85 TABLE 45: ANTENNA REQUIREMENTS..............................
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Automotive Module Series AG35 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 22 FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 24 FIGURE 3: SLEEP MODE CURRENT CONSUMPTION DIAGRAM ................................................................ 37 FIGURE 4: SLEEP MODE APPLICATION VIA UART .........
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Automotive Module Series AG35 Hardware Design FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 87 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 87 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 88 FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................
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Automotive Module Series AG35 Hardware Design 1 Introduction This document defines the AG35 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module.
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Automotive Module Series AG35 Hardware Design OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.
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Automotive Module Series AG35 Hardware Design Antenna type GSM850 Gain (dBi) GSM1900 Gain (dBi) Fixed External Antenna Antenna type 4.50 LTE Band 2 Gain (dBi) 2.00 Fixed External Antenna AG35-E: Antenna type Fixed External Antenna 2.00 WCDMA Band II Gain (dBi) 2.00 WCDMA Band IV Gain (dBi) 5.00 LTE Band 4 Gain (dBi) 5.00 LTE Band 5 Gain (dBi) 4.50 LTE Band 7 Gain (dBi) 7.00 WCDMA LTE Band 5 Band V Gain Gain (dBi) (dBi) 9.00 9.00 LTE Band 7 Gain (dBi) LTE Band 38 Gain (dBi) 8.00 8.
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Automotive Module Series AG35 Hardware Design be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help.
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Automotive Module Series AG35 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating AG35 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
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Automotive Module Series AG35 Hardware Design In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
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Automotive Module Series AG35 Hardware Design 2 Product Concept 2.1. General Description AG35 is a series of automotive-grade LTE-FDD/LTE-TDD/WCDMA/TD-SCDMA/EVDO/CDMA/GSM wireless communication module with LTE/WCDMA receive diversity.
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Automotive Module Series AG35 Hardware Design GNSS GPS, GLONASS, BeiDou/ Compass, Galileo, QZSS GPS, GLONASS, BeiDou/ Compass, Galileo, QZSS GPS, GLONASS, BeiDou/ Compass, Galileo, QZSS GPS, GLONASS, BeiDou/ Compass, Galileo, QZSS,SBAS GPS, GLONASS, BeiDou/ Compass, Galileo, QZSS AG35 is an SMD type module which can be embedded in applications through its 299-pin LGA pads. This, coupled with its compact profile of 33.0mm × 37.5mm × 3.
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Automotive Module Series AG35 Hardware Design Support Multiuser MIMO in DL direction  FDD: Max 150Mbps (DL)/50Mbps (UL)  TDD: Max 130Mbps (DL)/30Mbps (UL) WCDMA Features Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA Support QPSK, 16-QAM and 64-QAM modulation  DC-HSDPA: Max 42Mbps (DL)  HSUPA: Max 5.76Mbps (UL)  WCDMA: Max 384Kbps (DL)/384Kbps (UL) TD-SCDMA Features Support CCSA Release 3 TD-SCDMA  Max 4.2Mbps (DL)/2.
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Automotive Module Series AG35 Hardware Design Support master and slave modes, but must be the master in long frame synchronization SGMII Interface (Optional) Support 10/100/1000Mbps WLAN Interface Compliant with 802.11, 4-bit, 1.8V WLAN interface SDIO Interfaces SDIO1: Compliant with SD 3.0 protocol Used for WLAN function SDIO2: Compliant with SD 3.0 protocol USB Interface Compliant with USB 2.
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Automotive Module Series AG35 Hardware Design Extended temperature range: -40°C ~ +85°C 2) eCall temperature range: -40°C ~ +90°C 3) Storage temperature range: -40°C ~ +95°C Firmware Upgrade USB interface DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 4. 1) Within operation temperature range, the module is 3GPP compliant, and emergency call can be dialed out with a maximum power and data rate.
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Automotive Module Series AG35 Hardware Design ANT_MAIN PAM SAW Duplex ANT_GNSS ANT_DIV SAW Switch LNA SAW VBAT_RF PA APT PRx DRx Tx NAND DDR2 SDRAM Transceiver VBAT_BB VDD_EXT IQ SHDN_N PWRKEY PMIC Control Control Baseband RESET_N ADCs 19.2M XO STATUS BT_EN* NET_STATUS RTC Audio PM_ENABLE SPKS MICS PCM SGMII WLAN SDIOs USB (U)SIM I2CS UARTs HSIC* Figure 1: Functional Diagram NOTE “*” means under development. 2.4.
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Automotive Module Series AG35 Hardware Design 3 Application Interfaces 3.1. General Description AG35 is equipped with 299-pin LGA pads that can be connected to cellular application platform.
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Automotive Module Series AG35 Hardware Design 3.2.
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Automotive Module Series AG35 Hardware Design NOTES 1. 2. 3. 4. 5. Pins 59, 65, 67, 144~147 and 149 cannot be pulled up before power-up. PWRKEY (pin 2) output voltage is 0.8V because of the diode drop in the Qualcomm chipset. GND pins 215~299 should be connected to ground in the design. Keep all RESERVED pins and unused pins unconnected. “*” means under development. 3.3. Pin Description The following tables show the pin definition and description of AG35.
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Automotive Module Series AG35 Hardware Design transmitting burst. VDD_EXT 168 GND 10, 13, 16, 17, 30, 31, 35, 39, 44, 45, 54, 55, 63, 64, 69, 70, 75, 76, 81~84, 89~94, 96~100, 102~106, 108~112, 114, 116~118, 120~126, 128~131, 142, 148, 153, 154, 157, 158, 167, 174, 177, 178, 181, 184, 187, 191, 196~299 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull up circuits. Ground Turn on/off Pin Name PWRKEY RESET_N SHDN_N Pin No.
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Automotive Module Series AG35 Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment The drive current should be less than 0.15mA. Require external pull-up. If unused, keep it open. STATUS 171 OD Indicate the module’s operation status NET_MODE 147 DO Indicate the module’s network registration status VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. DO Indicate the module’s network activity status VOHmin=1.35V VOLmax=0.45V 1.8V power domain.
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Automotive Module Series AG35 Hardware Design For 1.8V (U)SIM: Vmax=1.9V Vmin=1.7V USIM_VDD USIM_CLK USIM_RST USIM_DATA 26 27 28 29 PO DO DO IO Power supply for (U)SIM card Clock signal of (U)SIM card Reset signal of (U)SIM card Data signal of (U)SIM card For 3.0V (U)SIM: Vmax=3.05V Vmin=2.7V IOmax=50mA Either 1.8V or 3V is supported by the module automatically. For 1.8V USIM: VOLmax=0.45V VOHmin=1.35V For 3.0V USIM: VOLmax=0.45V VOHmin=2.55V For 1.8V USIM: VOLmax=0.45V VOHmin=1.
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Automotive Module Series AG35 Hardware Design UART1_RXD UART1_DCD UART1_TXD UART1_RI UART1_DTR 58 59 60 61 62 DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.
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Automotive Module Series AG35 Hardware Design VIHmin=1.2V VIHmax=2.0V open. ADC Interfaces Pin Name ADC2 Pin No. 172 I/O Description DC Characteristics Comment AI General purpose analog to digital converter interface Voltage Range: 0.1V to 1.7V If unused, keep it open. Voltage Range: 0.3V to VBAT_BB If unused, keep it open. ADC0 173 AI General purpose analog to digital converter interface ADC1 175 AI General purpose analog to digital converter interface Voltage Range: 0.
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Automotive Module Series AG35 Hardware Design PCM data frame synchronization signal VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. PCM data input VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PCM clock VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain.
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Automotive Module Series AG35 Hardware Design VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V I2C2_SCL 74 DO 1.8V only. If unused, keep it open. I2C2 serial data VOLmax=0.45V VOHmin=1.35V External pull-up resistor is required. 1.8V only. If unused, keep it open. Description DC Characteristics Comment IOmax=50mA 1.8V/2.85V configurable power output. If unused, keep it open. SDIO2 Interface (for SD Card) Pin Name Pin No.
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Automotive Module Series AG35 Hardware Design VOHmin=2.01V details. If unused, keep it open. DC Characteristics Comment MDIO Interface Pin Name VDD_MDIO EPHY_RST_N SGMII_MCLK SGMII_ MDATA Pin No. 4 6 7 8 I/O Description PO SGMII_MDATA pull-up power source DO DO IO 1.8V/2.85V configurable power output. If unused, keep it open. Ethernet PHY reset 1.8V： VOLmax=0.45V VOHmin=1.35V 2.85V： VOLmax=0.35V VOHmin=2.14V 1.8V/2.85V power domain. If unused, keep it open.
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Automotive Module Series AG35 Hardware Design open. SGMII_TX_P 14 AO SGMII transmission (+) If unused, keep it open. SGMII_TX_M 15 AO SGMII transmission (-) If unused, keep it open. WLAN Interface (SDIO1 and WLAN Control Interfaces) Pin Name SDC1_CMD SDC1_CLK SDC1_DATA0 SDC1_DATA1 SDC1_DATA2 SDC1_DATA3 PM_ENABLE Pin No. 18 19 20 21 22 23 5 AG35_Hardware_Design I/O Description DC Characteristics Comment IO WLAN SDIO command signal VOLmax=0.45V VOHmin=1.35V 1.
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Automotive Module Series AG35 Hardware Design WLAN_EN WLAN_ WAKE WLAN_ SLP_CLK 149 160 169 WLAN function enable control via Wi-Fi module VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Wake up the module via WLAN VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. DO WLAN sleep clock VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V If unused, keep it open.
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Automotive Module Series AG35 Hardware Design W_DISABLE# 151 DI Airplane mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Pulled up by default. In low voltage level, module can enter into airplane mode. If unused, keep it open. I/O Description DC Characteristics Comment RESERVED Pins Pin Name Pin No. RESERVED 36~38, 40, 41, 95, 101, 113, 115, 77~80, 143, 159 161, 162, 179, 180, 182, 183, 185, 186, 188~190, 192~193 Reserved Keep these pins unconnected.
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Automotive Module Series AG35 Hardware Design Mode Airplane Mode AT+CFUN=4 or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. Power down Mode In this mode, the power management unit shuts down the power supply. Software is not active.
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Automotive Module Series AG35 Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode.   Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host.
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Automotive Module Series AG35 Hardware Design Host Module USB_VBUS VDD USB_DP USB_DP USB_DM USB_DM GND GND Figure 5: Sleep Mode Application with USB Remote Wakeup   Sending data to AG35 through USB will wake up the module. When AG35 has URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3.
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Automotive Module Series AG35 Hardware Design   Sending data to AG35 through USB will wake up the module. When AG35 has URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an external control circuit to let the module enter into sleep mode.    Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held in high level or keep it open.
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Automotive Module Series AG35 Hardware Design Software: AT+CFUN command provides choices of the functionality level, through setting into 0, 1, or 4.  AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by AT+QCFG=“airplanecontrol” command.
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Automotive Module Series AG35 Hardware Design 157, 158, 167, 174, 177, 178, 181, 184, 187, 191, 196~299 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Burst Transmission Burst Transmission VBAT Ripple Drop Min.3.
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Automotive Module Series AG35 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of AG35 should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is recommended to use an LDO to supply power for the module.
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Automotive Module Series AG35 Hardware Design Table 7: PWRKEY Pin Description Pin Name PWRKEY Pin No. 2 Description DC Characteristics Comment Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When AG35 is in power down mode, it can be turned on by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY.
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Automotive Module Series AG35 Hardware Design The turn on scenario is illustrated in the following figure. NOTE VBAT ≥500ms VIH≥1.3V PWRKEY VIL≤0.5V RESET_N ≥2.5s STATUS (OD) ≥12s UART Inactive Active ≥13s USB Inactive Active About 100ms VDD_EXT Figure 13: Timing of Turning on Module NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. 3.7.2.
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Automotive Module Series AG35 Hardware Design VBAT ≥650ms ≥29.5s PWRKEY STATUS (OD) Module Status RUNNING Power-down procedure OFF VDD_EXT Figure 14: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY Pin. Please refer to document [2] for details about the AT+QPOWD command. NOTES 1. 2.
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Automotive Module Series AG35 Hardware Design for the module VIHmin=1.3V VILmax=0.5V Driving the SHDN_N pin to a low level voltage and then releasing it will make the module shut down unconditionally. The shut-down scenario is illustrated in the following figure. SHDN_N R1 N MOS Shut down pulse R2 Figure 15: Shut Down the Module Using Driving Circuit VBA T 200ms TBD SHDN_N STATUS (OD) Module Status RUNNING OFF Figure 16: Timing of Turning off Module via SHDN_N NOTES 1.
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Automotive Module Series AG35 Hardware Design 3.8. Reset the Module The RESET_N can be used to reset the module. The module can be reset by driving the RESET_N to a low level voltage for 150~460ms. As the RESET_N pin is sensitive to interference, the routing trace on the interface board of the module is recommended to be as short as possible and totally ground shielded. Table 9: RESET_N Pin Description Pin Name RESET_N Pin No. 1 Description DC Characteristics Comment Reset the module VIHmax=2.
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Automotive Module Series AG35 Hardware Design The reset scenario is illustrated in the following figure. VBAT ≤ 460ms ≥ 150ms VIH ≥ 1.3V RESET_N VIL ≤ 0.5V Module Status Running Resetting Restart Figure 19: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin both failed. Please assure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9.
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Automotive Module Series AG35 Hardware Design AG35 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and is disabled by default. Please refer to document [2] about AT+QSIMDET command for details. The following figure shows a reference design of (U)SIM interface with an 8-pin (U)SIM card connector.
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Automotive Module Series AG35 Hardware Design       Keep the placement of (U)SIM card connector as close as possible to the module. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.
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Automotive Module Series AG35 Hardware Design The USB interface is recommended to be reserved for firmware upgrade in application design. The following figure shows a reference circuit of USB interface.
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Automotive Module Series AG35 Hardware Design 3.11. UART Interfaces The module provides three UART interfaces: main UART interface, UART2 interface and debug UART interface. The following are the features of these UART interfaces.    The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. The interface is used for data transmission and AT command communication.
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Automotive Module Series AG35 Hardware Design UART2_RTS 166 DI Request to send 1.8V power domain Table 14: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_TXD 71 DO Transmit data 1.8V power domain DBG_RXD 72 DI Receive data 1.8V power domain The logic levels are described in the following table. Table 15: Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.
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Automotive Module Series AG35 Hardware Design Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both module input and output circuit designs. But please pay attention to the direction of connection. VDD_1V8 4.7K VDD_1V8 1nF Module MCU/ARM 10K UART1_RXD /TXD /RXD UART1_TXD 1nF VDD_1V8 4.
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Automotive Module Series AG35 Hardware Design SPK2_N 133 AO Earphone analog output 2 (-) SPK1_P 134 AO Earphone analog output 1 (+) SPK1_N 135 AO Earphone analog output 1 (-) MICBIAS 136 AO Bias voltage output for microphone MIC2_N 137 AI Microphone analog input 2 (-) MIC2_P 138 AI Microphone analog input 2 (+) MIC1_N 139 AI Microphone analog input 1 (-) MIC1_P 140 AI Microphone analog input 1 (+) AGND 141 Analog ground Table 17: Audio Interface Characteristics Parameter
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Automotive Module Series AG35 Hardware Design 3.13. PCM and I2C Interfaces AG35 provides one Pulse Code Modulation (PCM) digital interface for audio design. The interface supports the following modes:   Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB.
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Automotive Module Series AG35 Hardware Design 125us 1 PCM_CLK 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_OUT PCM_IN Figure 26: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 18: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_IN 66 DI PCM data input 1.8V power domain PCM_OUT 68 DO PCM data output 1.
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Automotive Module Series AG35 Hardware Design I2C2_SCL 74 DO I2C2 serial clock Require external pull-up to 1.8V NOTES 1. By default, I2C1 is used for codec configuration while I2C2 is not available with any codec configuration driver. 2. When the built-in codec is used, its 8-bit address is 0x31 when reading and 0x30 when writing. In order to avoid conflicts, please avoid using I2C1 peripherals with the same addresses. 3. When the built-in codec is used, pin 152 and pins 65~68 will not be used.
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Automotive Module Series AG35 Hardware Design 3.14. SDIO Interfaces AG35 provides two SDIO interfaces which support SD 3.0 protocol. 3.14.1. SDIO1 Interface SDIO1 interface is used for WLAN function. More details are provided in Chapter 3.16. 3.14.2. SDIO2 Interface SDIO2 interface supports SD card. The following tables show the pin definition of SDIO2 interface. Table 20: Pin Definition of SDIO2 Interface Pin Name Pin No.
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Automotive Module Series AG35 Hardware Design Module R7 NM SDC2_DATA2 SDC2_DATA1 SDC2_DATA0 SDC2_CLK R8 NM R9 NM R10 NM R11 NM R12 470K 100uF VDD_SDIO SDC2_DATA3 SD Card Connector VDD_EXT VDD_3V C10 C9 C8 VDD 100nF 100pF 33pF R1 0R CD/DAT3 R2 0R DAT2 R3 0R DAT1 R4 0R DAT0 R5 0R CLK R6 0R CMD SDC2_CMD SD_INS_DET C7 C1 NM D1 C2 NM D2 C3 NM D3 C4 NM D4 C5 NM D5 D7 C6 NM D6 DETECTIVE VSS Figure 28: Reference Circuit of SD Card Application Please follow the principles bel
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Automotive Module Series AG35 Hardware Design 3.15. SGMII Interface (Optional) AG35 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces. Key features of the SGMII interface are shown below:       IEEE802.3 compliance Half/full duplex for 10/100/1000Mbps Support VLAN tagging Support IEEE1588 and Precision Time Protocol (PTP) Can be connected to an external Ethernet PHY like AR8033, or an external switch Management interfaces support dual power domains: 1.
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Automotive Module Series AG35 Hardware Design SGMII Module MDI AR8033 Ethernet Transformer RJ45 Control Figure 25: Simplified Block Diagram for Ethernet Application The following figure shows a reference design of SGMII interface with PHY AR8033 application. Module R1 10K R2 1.
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Automotive Module Series AG35 Hardware Design 3.16. Wireless Connectivity Interfaces AG35 supports a low-power SDIO 3.0 interface (SDIO1 interface) for WLAN function, and UART2 & PCM interfaces for BT function*. The following table shows the pin definition of wireless connectivity interfaces. Table 22: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment DO WLAN power enable 1.
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Automotive Module Series AG35 Hardware Design VOHmin=1.35V UART2_TXD 163 DO Transmit data 1.8V power domain UART2_CTS 164 DO DTE clear to send 1.8V power domain UART2_RXD 165 DI Receive data 1.8V power domain UART2_RTS 166 DI DTE request to send 1.8V power domain PCM_IN 66 DI PCM data input 1.8V power domain PCM_OUT 68 DO PCM data output 1.8V power domain PCM_SYNC 65 IO PCM data frame sync signal 1.8V power domain PCM_CLK 67 IO PCM data bit clock 1.
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Automotive Module Series AG35 Hardware Design Module AF20 DCDC/LDO PM_ENABL E VDD_3V3 POWER VDD_EXT SDC1_DATA3 SDIO_D3 SDC1_DATA2 SDIO_D2 SDC1_DATA1 SDIO_D1 SDC1_DATA0 WLAN VIO SDC1_CLK SDIO_D0 Close to module 15~24R SDIO_CLK SDC1_CMD WLAN_EN SDIO_CMD WLAN_EN NM-0R WLAN_SLP_CLK 32KHZ_IN 10K 15K WLAN_WAKE COEX_UART_RX COEX LTE_UART_TXD COEX_UART_TX BT_EN Bluetooth (Under Development) LTE_UART_RXD BT_EN* UART2_RTS BT_UART_RTS UART2_CTS BT_UART_CTS UART2_TXD BT_UART_RXD UA
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Automotive Module Series AG35 Hardware Design     trace is 50Ω (±10%). Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 50mm.
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Automotive Module Series AG35 Hardware Design ADC1 175 General purpose analog to digital converter interface The following table describes the characteristics of ADC interfaces. Table 24: Characteristics of ADC Interfaces Parameter Min. ADC2 Voltage Range Typ. Max. Unit 0.1 1.7 V ADC0 Voltage Range 0.3 VBAT_BB V ADC1 Voltage Range 0.3 VBAT_BB V ADC Resolution 15 bits ADC Sample Rate 2.4 MHz NOTES 1. 2. 3.
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Automotive Module Series AG35 Hardware Design Table 26: Working State of the Network Connection Status /Activity Indicator Pin Name Logic Level Changes Network Status Always High Registered on LTE network Always Low Others Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling NET_MODE NET_STATUS A reference circuit is shown in the following figure.
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Automotive Module Series AG35 Hardware Design Table 27: Pin Definition of STATUS Pin Name STATUS Pin No. 171 I/O Description Comment OD Indicate the module’s operation status Require external pull-up The following figure shows different design circuits of STATUS, and customers can choose either one according to application demands. VBAT VDD_MCU 33K 2.2K STATUS MCU_GPIO Module STATUS Module Figure 31: Reference Circuit of the STATUS NOTES 1.
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Automotive Module Series AG35 Hardware Design Table 28: Default Behaviors of RI State Response Idle RI keeps in high level URC RI outputs 120ms low pulse when new URC returns The default RI behaviors can be configured flexibly by AT+QCFG=“urc/ri/ring” command. Please refer to document [2] for more details. 3.21. USB_BOOT Interface AG35 provides a USB_BOOT pin which is multiplexed with COEX_UART_RX.
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Automotive Module Series AG35 Hardware Design 3.22. RTC AG35 has a real time clock within the PMIC, but has no dedicated RTC power supply pin. The RTC is powered by VBAT_BB. If VBAT_BB is removed, the RTC will not be maintained. NOTE If RTC needs to be maintained, then VBAT_BB must be powered all the time. 3.23. HSIC Interface* AG35 provides a HSIC interface for EAVB.
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Automotive Module Series AG35 Hardware Design Impedance 45Ω ~ 55Ω Intra-pair match < 2.5mm (15ps) Maximum trace length 8cm HSIC to all other signals > 3 × line width HSIC_DATA to HSIC_STROBE > 3 × line width Length matching Spacing NOTES 1. “*” means under development. 2. More details will be provided in a future release of this document.
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Automotive Module Series AG35 Hardware Design 4 GNSS Receiver 4.1. General Description AG35 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). AG35 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, AG35 GNSS engine is switched off. It has to be switched on with AT command.
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Automotive Module Series AG35 Hardware Design Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky < 2.5 m Description Conditions Typ. Unit Cold start Autonomous -146 dBm Reacquisition Autonomous -158 dBm Tracking Autonomous -162 dBm Autonomous 35 s XTRA enabled 18 s Autonomous 26 s XTRA enabled 2.2 s Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky < 2.5 m Description Conditions Typ.
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Automotive Module Series AG35 Hardware Design @open sky XTRA enabled 2.2 s Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky < 2.5 m Description Conditions Typ. Unit Cold start Autonomous -146 dBm Reacquisition Autonomous -158 dBm Tracking Autonomous -162 dBm Autonomous 35 s XTRA enabled 18 s Autonomous 26 s XTRA enabled 2.2 s Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky < 2.5 m Description Conditions Typ.
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Automotive Module Series AG35 Hardware Design Warm start @open sky Hot start @open sky Accuracy (GNSS) CEP-50 Autonomous 26 s XTRA enabled 2.2 s Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky < 2.5 m NOTES 1. 2. 3. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes.
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Automotive Module Series AG35 Hardware Design 5 Antenna Interfaces AG35 includes a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50Ω. 5.1. Main/Rx-diversity Antenna Interface 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces are shown below.
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Automotive Module Series AG35 Hardware Design TD-SCDMA B39 1880~1920 1880~1920 MHz LTE-FDD B1 1920~1980 2110~2170 MHz LTE-FDD B3 1710~1785 1805~1880 MHz LTE-FDD B5 824~849 869~894 MHz LTE-FDD B8 880~915 925~960 MHz LTE-TDD B34 2010~2025 2010~2025 MHz LTE-TDD B38 2570~2620 2570~2620 MHz LTE-TDD B39 1880~1920 1880~1920 MHz LTE-TDD B40 2300~2400 2300~2400 MHz LTE-TDD B41 2555~2655 2555~2655 MHz Table 39: AG35-E Operating Frequencies 3GPP Band Transmit Receive Unit E
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Automotive Module Series AG35 Hardware Design LTE-TDD B38 2570~2620 2570~2620 MHz LTE-TDD B40 2300~2400 2300~2400 MHz Table 40: AG35-NA Operating Frequencies 3GPP Band Transmit Receive Unit GSM850 824~849 869~894 MHz PCS1900 1850~1910 1930~1990 MHz WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz LTE-FDD B2 1850~1910 1930~1990 MHz LTE-FDD B4 1710~1755 2110~2155 MHz LTE-FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570
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Automotive Module Series AG35 Hardware Design WCDMA B2 1850~1910 1930~1990 MHz WCDMA B3 1710~1785 1805~1880 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B8 880~915 925~960 MHz LTE-FDD B1 1920~1980 2110~2170 MHz LTE-FDD B2 1850~1910 1930~1990 MHz LTE-FDD B3 1710~1785 1805~1880 MHz LTE-FDD B4 1710~1755 2110~2155 MHz LTE-FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570 2620~2690 MHz LTE-FDD B8 880~915 925~960 MHz LTE FDD B28 703~748 7
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Automotive Module Series AG35 Hardware Design LTE-FDD B8 880~915 925~960 MHz LTE-FDD B9 1749.9~1784.8 1844.9~1879.8 MHz LTE-FDD B19 830~845 875~890 MHz LTE-FDD B21 1747.9~1462.8 1495.9~1510.8 MHz LTE FDD B28 703~748 758~803 MHz LTE TDD B41 2535~2655 2535~2655 MHz NOTE 1) EVDO/CDMA BC0 for AG35-CE is optional. 5.1.3. Reference Design of RF Antenna Interfaces A reference design of main and Rx-diversity antenna interfaces is shown as below.
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Automotive Module Series AG35 Hardware Design NOTES 1. 2. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve receiving sensitivity. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. Please refer to document [2] for details. 5.1.4. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50Ω.
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Automotive Module Series AG35 Hardware Design Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:      Use an impedance simulation tool to accurately control the characteristic impedance of RF traces as to 50Ω.
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Automotive Module Series AG35 Hardware Design For more details about RF layout, please refer to document [5]. 5.2. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 43: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 119 AI GNSS antenna interface 50Ω impedance Table 44: GNSS Frequency Type Frequency Unit GPS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz Galileo 1575.
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Automotive Module Series AG35 Hardware Design NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.
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Automotive Module Series AG35 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by HIROSE. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.
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Automotive Module Series AG35 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit https://www.hirose.com.
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Automotive Module Series AG35 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 46: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.3 V Voltage at ADC0 0.
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Automotive Module Series AG35 Hardware Design 6.2. Power Supply Ratings Table 47: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.
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Automotive Module Series AG35 Hardware Design 3. tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 3) Within eCall temperature range, the emergency call function must be functional until the module is broken.
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Automotive Module Series AG35 Hardware Design WCDMA PF=64 (USB disconnected) 2.0 mA WCDMA PF=64 (USB suspend) 2.4 mA WCDMA PF=128 (USB disconnected) 1.8 mA WCDMA PF=256 (USB disconnected) 1.5 mA WCDMA PF=512 (USB disconnected) 1.4 mA BC0 SCI=1 (USB disconnected) 3.5 mA BC0 SCI=1 (USB suspend) 3.7 mA LTE-FDD PF=32 (USB disconnected) 3.8 mA LTE-FDD PF=64 (USB disconnected) 2.7 mA LTE-FDD PF=64 (USB suspend) 3.3 mA LTE-FDD PF=128 (USB disconnected) 2.
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Automotive Module Series AG35 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) EVDO/CDMA data transfer (GNSS OFF) TD-SCDMA data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) AG35_Hardware_Design LTE-TDD PF=64 (USB connected) 35.0 mA LTE-TDD PF=64 (USB disconnected) 23.0 mA EGSM900 4DL/1UL @32.66dBm 249.2 mA EGSM900 3DL/2UL @32.51dBm 421.6 mA EGSM900 2DL/3UL @30.65dBm 495.0 mA EGSM900 1DL/4UL @29.37dBm 568.9 mA DCS1800 4DL/1UL @29.21dBm 174.
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Automotive Module Series AG35 Hardware Design LTE data transfer (GNSS OFF) LTE-FDD B1 @23.01dBm 698.07 mA LTE-FDD B3 @23.24dBm 708.78 mA LTE-FDD B5 @23.28dBm 629.16 mA LTE-FDD B8 @23.27dBm 597.21 mA LTE-TDD B34 @22.73dBm 334.99 mA LTE-TDD B38 @22.85dBm 430.39 mA LTE-TDD B39 @22.97dBm 330.62 mA LTE-TDD B40 @22.94dBm 405.78 mA LTE-TDD B41 @22.91dBm 456.63 mA EGSM900, PCL=5 @32.3dBm 230.4 mA EGSM900, PCL=12 @19.3dBm 103.2 mA EGSM900, PCL=19 @5.3dBm 73.
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Automotive Module Series AG35 Hardware Design Idle state AG35_Hardware_Design GSM DRX=5 (USB disconnected) 1.7 mA GSM DRX=5 (USB suspend) 1.9 mA GSM DRX=9 (USB disconnected) 1.6 mA WCDMA PF=64 (USB disconnected) 2.0 mA WCDMA PF=64 (USB suspend) 2.4 mA WCDMA PF=128 (USB disconnected) 1.7 mA WCDMA PF=256 (USB disconnected) 1.5 mA WCDMA PF=512 (USB disconnected) 1.4 mA LTE-FDD PF=32 (USB disconnected) 3.7 mA LTE-FDD PF=64 (USB disconnected) 2.
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Automotive Module Series AG35 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) AG35_Hardware_Design LTE-TDD PF=64 (USB disconnected) 17.5 mA EGSM900 4DL/1UL @33.02dBm 235 mA EGSM900 3DL/2UL @32.85dBm 405 mA EGSM900 2DL/3UL @30.4dBm 445 mA EGSM900 1DL/4UL @29.2dBm 515 mA DCS1800 4DL/1UL @29.7dBm 175 mA DCS1800 3DL/2UL @29.
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Automotive Module Series AG35 Hardware Design LTE-FDD B5 @23.18dBm 530 mA LTE-FDD B7 @23.7dBm 710 mA LTE-FDD B8 @23.6dBm 600 mA LTE-FDD B20 @23.8dBm 600 mA LTE-FDD B28A @23.3dBm 780 mA LTE-FDD B28B @23.5dBm 700 mA LTE-TDD B38 @23.3dBm 385 mA LTE-TDD B40 @22.95dBm 370 mA EGSM900 @PCL=5 246 mA EGSM900 @PCL=12 116 mA EGSM900 @PCL=19 88 mA DCS1800 @PCL=0 177 mA DCS1800 @PCL=7 128 mA DCS1800 @PCL=15 109 mA WCDMA B1 (max power) @23.
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Automotive Module Series AG35 Hardware Design GSM DRX=9 (USB disconnected) 1.7 mA WCDMA PF=64 (USB disconnected) 2.2 mA WCDMA PF=64 (USB suspend) 2.5 mA WCDMA PF=128 (USB disconnected) 1.8 mA WCDMA PF=256 (USB disconnected) 1.6 mA WCDMA PF=512 (USB disconnected) 1.5 mA LTE-FDD PF=32 (USB disconnected) 3.6 mA LTE-FDD PF=64 (USB disconnected) 2.6 mA LTE-FDD PF=64 (USB suspend) 2.8 mA LTE-FDD PF=128 (USB disconnected) 2.0 mA LTE-FDD PF=256 (USB disconnected) 1.
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Automotive Module Series AG35 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call AG35_Hardware_Design GSM850 4DL/1UL @27.02dBm 160 mA GSM850 3DL/2UL @27.05dBm 265 mA GSM850 2DL/3UL @26.82dBm 355 mA GSM850 1DL/4UL @26.69dBm 456 mA PCS1900 4DL/1UL @25.21dBm 155 mA PCS1900 3DL/2UL @25.11dBm 230 mA PCS1900 2DL/3UL @25.01dBm 320 mA PCS1900 1DL/4UL @24.84dBm 410 mA WCDMA B2 HSDPA (max power) @22.
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Automotive Module Series AG35 Hardware Design WCDMA voice call PCS1900 @PCL=0 90 mA PCS1900 @PCL=7 590 mA PCS1900 @PCL=15 595 mA WCDMA B2 (max power) @22.96dBm 580 mA WCDMA B4 (max power) @22.96dBm 560 mA WCDMA B5 (max power) @23.15dBm 570 mA Table 52: AG35-LA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 10 uA AT+CFUN=0 (USB disconnected) 1.0 mA GSM DRX=2 (USB disconnected) 1.9 mA GSM DRX=5 (USB disconnected) 1.
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Automotive Module Series AG35 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) AG35_Hardware_Design WCDMA PF=64 (USB disconnected) 20 mA LTE-FDD PF=64 (USB connected) 31 mA LTE-FDD PF=64 (USB disconnected) 21 mA GSM850 4DL/1UL @32.62dBm 228 mA GSM850 3DL/2UL @32.0dBm 369 mA GSM850 2DL/3UL @30.12dBm 435 mA GSM850 1DL/4UL @29.38dBm 527 mA EGSM900 4DL/1UL @32.96dBm 241 mA EGSM900 3DL/2UL @32.51dBm 364 mA EGSM900 2DL/3UL @30.
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Automotive Module Series AG35 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) AG35_Hardware_Design EGSM900 2DL/3UL @23.71dBm 274 mA EGSM900 1DL/4UL @22.85dBm 333 mA DCS1800 4DL/1UL @25.86dBm 147 mA DCS1800 3DL/2UL @25.24dBm 226 mA DCS1800 2DL/3UL @23.54dBm 293 mA DCS1800 1DL/4UL @22.56dBm 367 mA PCS1900 4DL/1UL @25.41dBm 138 mA PCS1900 3DL/2UL @25.21dBm 220 mA PCS1900 2DL/3UL @23.28dBm 286 mA PCS1900 1DL/4UL @22.21dBm 359 mA WCDMA B1 HSDPA @22.
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Automotive Module Series AG35 Hardware Design LTE-FDD B4 @23.5dBm 675 mA LTE-FDD B5 @23.55dBm 555 mA LTE-FDD B7 @23.61dBm 654 mA LTE-FDD B8 @23.59dBm 629 mA LTE-FDD B28A @23.5dBm 709 mA LTE-FDD B28B @23.
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Automotive Module Series AG35 Hardware Design Table 53: AG35-J Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 20 uA AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF=64 (USB disconnected) 1.9 mA WCDMA PF=64 (USB suspend) 2.2 mA WCDMA PF=128 (USB disconnected) 1.6 mA WCDMA PF=256 (USB disconnected) 1.4 mA WCDMA PF=512 (USB disconnected) 1.3 mA LTE-FDD PF=32 (USB disconnected) 3.4 mA LTE-FDD PF=64 (USB disconnected) 2.
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Automotive Module Series AG35 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA B1 HSDPA @22.32dBm 550 mA WCDMA B3 HSDPA @22.32dBm 590 mA WCDMA B5 HSDPA @22.32dBm 530 mA WCDMA B6 HSDPA @22.32dBm 536 mA WCDMA B8 HSDPA @22.48dBm 580 mA WCDMA B19 HSDPA @22.32dBm 550 mA WCDMA B1 HSUPA @22.09dBm 565 mA WCDMA B3 HSUPA @22.09dBm 596 mA WCDMA B5 HSUPA @22.32dBm 550 mA WCDMA B6 HSUPA @22.28dBm 545 mA WCDMA B8 HSUPA @22.
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Automotive Module Series AG35 Hardware Design WCDMA B8 (max power) @22.96dBm 598 mA WCDMA B19 (max power) @23.15dBm 590 mA Conditions Typ. Unit Cold Start @Passive Antenna 47.5 mA Hot Start @Passive Antenna 45.2 mA Lost State @Passive Antenna 44.1 mA Open Sky @Passive Antenna 28.8 mA Conditions Typ. Unit Cold Start @Passive Antenna 45.5 mA Hot Start @Passive Antenna 45.6 mA Lost State @Passive Antenna 46.1 mA Open Sky @Passive Antenna 28.7 mA Conditions Typ.
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Automotive Module Series AG35 Hardware Design Table 57: AG35-LA GNSS Current Consumption Parameter IVBAT (GNSS) Description Searching (AT+CFUN=0) Tracking (AT+CFUN=0) Conditions Typ. Unit Cold Start @Passive Antenna 46.8 mA Hot Start @Passive Antenna 47.1 mA Lost State @Passive Antenna 47.1 mA Open Sky @Passive Antenna 32.3 mA Conditions Typ. Unit Cold Start @Passive Antenna 46.1 mA Hot Start @Passive Antenna 45.1 mA Lost State @Passive Antenna 45.
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Automotive Module Series AG35 Hardware Design WCDMA B8 24dBm+1/-3dB <-49dBm EVDO/CDMA BC0 1) 24dBm+2/-1dB <-49dBm TD-SCDMA B34 24dBm+1/-3dB <-49dBm TD-SCDMA B39 24dBm+1/-3dB <-49dBm LTE-FDD B1 23dBm±2dB <-39dBm LTE-FDD B3 23dBm±2dB <-39dBm LTE-FDD B5 23dBm±2dB <-39dBm LTE-FDD B8 23dBm±2dB <-39dBm LTE-TDD B34 23dBm±2dB <-39dBm LTE-TDD B38 23dBm±2dB <-39dBm LTE-TDD B39 23dBm±2dB <-39dBm LTE-TDD B40 23dBm±2dB <-39dBm LTE-TDD B41 23dBm±2dB <-39dBm Table 60: AG35-E RF Outp
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Automotive Module Series AG35 Hardware Design LTE-FDD B8 23dBm±2dB <-39dBm LTE-FDD B20 23dBm±2dB <-39dBm LTE-FDD B28 23dBm±2dB <-39dBm LTE-TDD B38 23dBm±2dB <-39dBm LTE-TDD B40 23dBm±2dB <-39dBm Table 61: AG35-NA RF Output Power Frequency Max. Min.
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Automotive Module Series AG35 Hardware Design DCS1800 30dBm±2dB 0dBm±5dB PCS1900 30dBm±2dB 0dBm±5dB WCDMA B1 24dBm+1/-3dB <-49dBm WCDMA B2 24dBm+1/-3dB <-49dBm WCDMA B3 24dBm+1/-3dB <-49dBm WCDMA B4 24dBm+1/-3dB <-49dBm WCDMA B5 24dBm+1/-3dB <-49dBm WCDMA B8 24dBm+1/-3dB <-49dBm LTE-FDD B1 23dBm±2dB <-39dBm LTE-FDD B2 23dBm±2dB <-39dBm LTE-FDD B3 23dBm±2dB <-39dBm LTE-FDD B4 23dBm±2dB <-39dBm LTE-FDD B5 23dBm±2dB <-39dBm LTE-FDD B7 23dBm±2dB <-39dBm LTE-FDD B8 23d
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Automotive Module Series AG35 Hardware Design LTE-FDD B1 23dBm±2dB <-39dBm LTE-FDD B3 23dBm±2dB <-39dBm LTE-FDD B5 23dBm±2dB <-39dBm LTE-FDD B8 23dBm±2dB <-39dBm LTE-FDD B9 23dBm±2dB <-39dBm LTE-FDD B19 23dBm±2dB <-39dBm LTE-FDD B21 23dBm±2dB <-39dBm LTE-FDD B28 23dBm±2dB <-39dBm LTE-TDD B41 23dBm±2dB <-39dBm NOTES 1. 1) EVDO/CDMA BC0 for AG35-CE is optional. 2. In GPRS 4 slots TX mode, the max output power is reduced by 3.0dB.
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Automotive Module Series AG35 Hardware Design LTE-FDD B1 (10M) -98 -99 -102 -96.3 LTE-FDD B3 (10M) -98.6 -99 -102 -93.3 LTE-FDD B5 (10M) -98.5 -100 -102.5 -94.3 LTE-FDD B8 (10M) -98.5 -100 -102.5 -93.3 LTE-TDD B34 (10M) -98.1 -99 -101.7 -96.3 LTE-TDD B38 (10M) -98.5 -98 -101 -94.3 LTE-TDD B39 (10M) -98.4 -99 -102 -96.3 LTE-TDD B40 (10M) -98.3 -99 -101.5 -96.3 LTE-TDD B41 (10M) -97.6 -98 -100.5 -94.
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Automotive Module Series AG35 Hardware Design LTE-TDD B40 (10M) -98 -98.3 -101.3 -96.3 Table 66: AG35-NA RF Receiving Sensitivity Frequency Receive Sensitivity (Typ.) (Unit: dBm) Primary Diversity SIMO 3GPP (SIMO) GSM850 -108.5 NA NA -102 PCS1900 -108.2 NA NA -102 WCDMA B2 -109.5 -110.2 -110.4 -104.7 WCDMA B4 -109.8 -109.5 -110.9 -106.7 WCDMA B5 -110 -109.5 -110.8 -104.7 LTE-FDD B2 (10M) -98 -98.5 -100.6 -94.3 LTE-FDD B4 (10M) -97.9 -98.2 -100.3 -96.
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Automotive Module Series AG35 Hardware Design WCDMA B3 -109 -110 -111 -103.7 WCDMA B4 -109.5 -110 -111 -106.7 WCDMA B5 -110 -111.5 -112 -104.7 WCDMA B8 -109.5 -111 -111.5 -103.7 LTE-FDD B1 (10M) -98.2 -99.1 -101.8 -96.3 LTE-FDD B2 (10M) -98.6 -99.8 -102.4 -94.3 LTE-FDD B3 (10M) -98.6 -98.9 -102 -93.3 LTE-FDD B4 (10M) -97.4 -99 -101.3 -96.3 LTE-FDD B5 (10M) -99.2 -100.2 -102.5 -94.3 LTE-FDD B7 (10M) -97.4 -98.4 -101 -94.3 LTE-FDD B8 (10M) -98.3 -99.
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Automotive Module Series AG35 Hardware Design LTE-FDD B9 (10M) -98.2 -98 -100 -95.3 LTE-FDD B19 (10M) -97.9 -98 -99.8 -96.3 LTE-FDD B21 (10M) -98 -98.5 -100 -96.3 LTE-FDD B28 (10M) -98.5 -98.5 -100.9 -94.8 LTE-TDD B41 (10M) -97.9 -98 -99.5 -94.3 NOTE 1) EVDO/CDMA BC0 for AG35-CE is optional. 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general.
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Automotive Module Series AG35 Hardware Design        On customers’ PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary.
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Automotive Module Series AG35 Hardware Design Thermal Pad AG35 Module Thermal Pad Heatsink Heatsink Application Board Shielding Cover Application Board Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTES 1. 2. For better performance, the maximum temperature of the internal BB chip should be kept below 105°C.
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Automotive Module Series AG35 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the tolerances for dimensions without tolerance values are ±0.05mm. 7.1. Mechanical Dimensions of the Module 3.00± 0.20 33.00± 0.15 Pin 1 37.50± 0.
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Automotive Module Series AG35 Hardware Design 3.45 3.45 3.15 3.50 Pin 1 R0.70 2.75 2.50 1.40 33.00± 0.15 1.30 3.30 0.70 3.15 0.70 1.65 1.00 37.50± 0.
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Automotive Module Series AG35 Hardware Design 7.2. Recommended Footprint 4.1 3.45 4.45 3.80 3.45 3.15 3.50 0.70 Pin 1 3.30 2.75 R0.70 33.00±0.15 1.30 2.50 1.40 3.15 1.00 1.30 1.65 1.30 0.70 37.50±0.15 0.30 3.80 3.15 3.45 0.50 1.30 0.35 1.00 0.70 Figure 46: Module Bottom Dimensions (Top View) NOTE For convenient maintenance of the module, please keep about 3mm between the module and other components on the host PCB.
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Automotive Module Series AG35 Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are renderings of AG35 module. For authentic appearance, please refer to the module that you receive from Quectel.
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Automotive Module Series AG35 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage AG35 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at < 40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:   Mounted within 168 hours at the factory environment of ≤ 30ºC/60%RH. Stored at <10% RH. 3.
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Automotive Module Series AG35 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.13mm~0.15mm. For more details, please refer to document [6].
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Automotive Module Series AG35 Hardware Design Reflow Zone Max slope 2 to 3°C/sec Reflow time (D: over 220°C) 40 to 60 sec Max temperature 238°C ~ 245°C Cooling down slope 1 to 4°C/sec Reflow Cycle Max reflow cycle 1 8.3. Packaging AG35 is packaged in tape and reel carriers. One reel is 10.56 meters long and contains 220 modules. The figures below show the package details, measured in mm.
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Automotive Module Series AG35 Hardware Design Cover tape Direction of Feed Figure 51: Reel Specifications AG35_Hardware_Design 125 / 129
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Automotive Module Series AG35 Hardware Design 9 Appendix A References Table 71: Related Documents SN Document Name Remark [1] Quectel_AG35_Power_Management_Application_ Note AG35 Power Management Application Note [2] Quectel_AG35_AT_Commands_Manual AG35 AT Commands Manual [3] Quectel_UMTS<E_EVB_User_Guide UMTS<E EVB User Guide [4] Quectel_AG35_GNSS_AT_Commands_Manual AG35 GNSS AT Commands Manual [5] Quectel_RF_Layout_Application_Note RF Layout Application Note [6] Quectel_Module_Se
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Automotive Module Series AG35 Hardware Design DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EAVB Ethernet Audio Video Bridging EFR Enhanced Full Rate ESD Electrostatic Discharge EVDO Evolution-Data Optimized FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Global Positioning System GSM
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Automotive Module Series AG35 Hardware Design MOS Mean Opinion Score MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SIM Subscriber Identification Module SMS Short Message Service TDD Time Division Duplexing TDMA Time Divisi
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Automotive Module Series AG35 Hardware Design VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VΩax Maximum Output High Level Voltage Value VΩin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Va
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Automotive Module Series AG35 Hardware Design 10 Appendix B GPRS Coding Schemes Table 73: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
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Automotive Module Series AG35 Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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Automotive Module Series AG35 Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 AG35_Hardware_Design 132 / 129
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Automotive Module Series AG35 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 75: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.