EG21-G MINIPCIE Hardware Design LTE Module Series Rev. EG21-G_MINIPCIE_Hardware_Design_V1.0 Date: 2019-03-11 Status: Released www.quectel.
LTE Module Series EG21-G MINIPCIE Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
LTE Module Series EG21-G MINIPCIE Hardware Design About the Document History Revision Date Author Description 1.
LTE Module Series EG21-G MINIPCIE Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ..................................................................................................................................
LTE Module Series EG21-G MINIPCIE Hardware Design 5 Dimensions and Packaging............................................................................................................ 43 5.1. General Description .............................................................................................................. 43 5.2. Mechanical Dimensions of EG21-G MINIPCIE ..................................................................... 43 5.3. Standard Dimensions of Mini PCI Express ...................
LTE Module Series EG21-G MINIPCIE Hardware Design Table Index TABLE 1: DESCRIPTION OF EG21-G MINIPCIE ............................................................................................ 10 TABLE 2: KEY FEATURES OF EG21-G MINIPCIE .......................................................................................... 10 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15 TABLE 4: PIN DESCRIPTION ...........
LTE Module Series EG21-G MINIPCIE Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 14 FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY ..............................................................................
LTE Module Series EG21-G MINIPCIE Hardware Design 1 Introduction This document defines EG21-G MINIPCIE module, and describes its air interfaces and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of EG21-G MINIPCIE module.
LTE Module Series EG21-G MINIPCIE Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG21-G MINIPCIE module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE Module Series EG21-G MINIPCIE Hardware Design 2 Product Concept 2.1. General Description EG21-G MINIPCIE module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as WinCE, Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers’ applications.
LTE Module Series EG21-G MINIPCIE Hardware Design 2.2. Module Description The following table shows the description of EG21-G MINIPCIE module. Table 1: Description of EG21-G MINIPCIE Module Description EG21-G MINIPCIE Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28 Support LTE-TDD: B38/B39/B40/B41 Support WCDMA: B1/B2/B4/B5/B6/B8/B19 Support GSM: 850/900/1800/1900MHz Support GPS, GLONASS, BeiDou/Compass, Galileo, QZSS 1) Support digital audio 2) NOTES SS 1.
LTE Module Series EG21-G MINIPCIE Hardware Design Class E2 (26dBm±3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE FDD bands Class 3 (23dBm±2dB) for LTE TDD bands LTE Features Support up to non-CA Cat 1 FDD and TDD Support 1.4MHz~20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL) LTE-TDD: Max 8.96Mbps (DL), Max 3.
LTE Module Series EG21-G MINIPCIE Hardware Design LTE: AMR/AMR-WB Support echo cancellation and noise suppression PCM Interface Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization USB Interface Compliant with USB 2.
LTE Module Series EG21-G MINIPCIE Hardware Design 2.4. Functional Diagram The following figure shows the block diagram of EG21-G MINIPCIE.
LTE Module Series EG21-G MINIPCIE Hardware Design 3 Application Interfaces The physical connections and signal levels of EG21-G MINIPCIE PCIe comply with PCI Express Mini CEM specifications. This chapter mainly describes the definition and application of the following interfaces for EG21-G MINIPCIE: Power supply (U)SIM interface USB interface UART interface PCM&I2C interfaces Control and Indicator signals Antenna interfaces 3.1.
LTE Module Series EG21-G MINIPCIE Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EG21-G MINIPCIE on the 52-pin application. Table 3: I/O Parameters Definition Type Description DI Digital Input DO Digital Output IO Bidirectional OC Open Collector PI Power Input PO Power Output Table 4: Pin Description Pin No. Mini PCI Express Standard Name EG21-G MINIPCIE Pin Name I/O Description 1 WAKE# WAKE# OC Output signal to wake up the host.
LTE Module Series EG21-G MINIPCIE Hardware Design DTE’s TX. 12 UIM_CLK USIM_CLK DO Clock signal of (U)SIM card 13 REFCLK+ UART_TX DO UART transmit data 14 UIM_RESET USIM_RST DO Reset signal of (U)SIM card 15 GND GND Mini card ground 16 UIM_VPP RESERVED Reserved 17 RESERVED RI 18 GND GND Mini card ground 19 RESERVED RESERVED Reserved 20 W_DISABLE# W_DISABLE# 21 GND GND 22 PERST# PERST# DO DI Output signal to wake up the host.
LTE Module Series EG21-G MINIPCIE Hardware Design external pull-up to 1.8V. 33 PETp0 RESERVED Reserved 34 GND GND Mini card ground 35 GND GND Mini card ground 36 USB_D- USB_DM 37 GND GND IO USB differential data (-) Mini card ground 38 USB_D+ USB_DP IO USB differential data (+) 39 3.3Vaux VCC_3V3 PI 3.3V DC supply 40 GND GND 41 3.3Vaux VCC_3V3 Require differential impedance of 90Ω Mini card ground PI 3.
LTE Module Series EG21-G MINIPCIE Hardware Design NOTES 1. 2. 3. Keep all NC, reserved and unused pins unconnected. 1) The digital audio (PCM) function is only supported on Telematics version. 2)Module’s pin3 and pin5 are prohibit pull up to high level before startup. 3.3. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 5: Definition of VCC_3V3 and GND Pins Pin No. Pin Name I/O Power Domain Description 2, 39, 41, 52 VCC_3V3 PI 3.0V~3.6V 3.
LTE Module Series EG21-G MINIPCIE Hardware Design 3.4. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. Table 6: Pin Definition of (U)SIM Interface Pin No. Pin Name I/O Power Domain Description 8 USIM_VDD PO 1.8V/3.0V Power source for (U)SIM card 10 USIM_DATA IO 1.8V/3.0V Data signal of (U)SIM card 12 USIM_CLK DO 1.8V/3.0V Clock signal of (U)SIM card 14 USIM_RST DO 1.8V/3.
LTE Module Series EG21-G MINIPCIE Hardware Design If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
LTE Module Series EG21-G MINIPCIE Hardware Design 3.5. USB Interface The following table shows the pin definition of USB interface. Table 7: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment 36 USB_DM IO USB differential data (-) Require differential impedance of 90Ω 38 USB_DP IO USB differential data (+) Require differential impedance of 90Ω EG21-G MINIPCIE is compliant with USB 2.0 specification. It can only be used as a slave device.
LTE Module Series EG21-G MINIPCIE Hardware Design It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90Ω. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides.
LTE Module Series EG21-G MINIPCIE Hardware Design AT+IPR command can be used to set the baud rate of the main UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2] for details. 3.7. PCM and I2C Interfaces EG21-G MINIPCIE provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design.
LTE Module Series EG21-G MINIPCIE Hardware Design 256KHz, 512KHz, 1024KHz and 2048KHz for different speed codecs. The following figure shows the timing relationship in primary mode with 8KHz PCM_SYNC and 2048KHz PCM_CLK. 125us PCM_CLK 1 2 255 256 PCM_SYNC MSB LSB MSB MSB LSB MSB PCM_DOUT PCM_DIN Figure 7: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge; while the PCM_SYNC rising edge represents the MSB.
LTE Module Series EG21-G MINIPCIE Hardware Design MINIPCIE’s firmware has integrated the configuration on some PCM codec’s application with I2C interface. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC. PCM_CLK BCLK PCM_SYNC LRCK PCM_DOUT DAC PCM_DIN ADC I2C_SCL SCL I2C_SDA SDA INP INN BIAS MICBIAS 4.7K Module 4.7K LOUTP LOUTN Codec 1.
LTE Module Series EG21-G MINIPCIE Hardware Design 3.8.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG=“risignaltype”,“physical” command. 120ms High Low URC return Figure 10: RI Behavior 3.8.2. DTR Signal The DTR signal supports sleep control function. Driving it to low level will wake up the module. 3.8.3.
LTE Module Series EG21-G MINIPCIE Hardware Design Table 12: Airplane Mode Controlled by Software Method AT+CFUN=? RF Function status Module Operation mode Conditions 0 RF and (U)SIM disabled Minimum functionality mode 1 RF enabled Normal mode 4 RF disabled Airplane mode Keep W_DISABLE# at high level. 3.8.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card.
LTE Module Series EG21-G MINIPCIE Hardware Design There are two indication modes for LED_WWAN# signal to indicate network status, which can be switched through following AT commands: AT+QCFG=“ledmode”,0 (Default setting) AT+QCFG=“ledmode”,2 The following tables show the detailed network status indications of the LED_WWAN# signal.
LTE Module Series EG21-G MINIPCIE Hardware Design 120ms High (external pull-up) Low URC return Figure 13: WAKE# Behavior 3.9. Antenna Interfaces EG21-G MINIPCIE antenna interfaces include a main antenna interface, an Rx-diversity antenna interface and a GNSS antenna interface. Rx-diversity function is enabled by default. 3.9.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.
LTE Module Series EG21-G MINIPCIE Hardware Design (LTE B7/B38/B40/B41) 3.9.2. Recommended RF Connector for Antenna Installation EG21-G MINIPCIE is mounted with 2mm × 2mm RF connectors for convenient antenna connection. The dimensions of the RF connectors are shown as below. Figure 14: Dimensions of the RF Connectors (Unit: mm) U.FL-LP mating plugs listed in the following figure can be used to match the RF connectors. Figure 15: Mechanicals of U.
LTE Module Series EG21-G MINIPCIE Hardware Design The following figure describes the space factor of mating plugs. Figure 16: Space Factor of Mating Plugs (Unit: mm) For more details, please visit http://www.hirose.com.
LTE Module Series EG21-G MINIPCIE Hardware Design 4 Electrical, Reliability and Radio Characteristics 4.1. General Description This chapter mainly describes the following electrical and radio characteristics of EG21-G MINIPCIE: Power supply requirements I/O requirements RF characteristics GNSS receiver ESD characteristics Thermal consideration Current consumption 4.2. Power Supply Requirements The input voltage of EG21-G MINIPCIE is 3.
LTE Module Series EG21-G MINIPCIE Hardware Design 4.3. I/O Requirements The following table shows the I/O requirements of EG21-G MINIPCIE. Table 17: I/O Requirements Parameter Description Min. Max. Unit VIH Input High Voltage 0.7 × VCC_3V3 VCC_3V3 + 0.3 V VIL Input Low Voltage -0.3 0.3 × VCC_3V3 V VOH Output High Voltage VCC_3V3 - 0.5 VCC_3V3 V VOL Output Low Voltage 0 0.4 V NOTES S 1. The PCM and I2C interfaces belong to 1.
LTE Module Series EG21-G MINIPCIE Hardware Design LTE-FDD B13/B18/B19/B20/B25/B26/B28 23dBm±2dB < -39dBm LTE-TDD B38/B39/B40/B41 23dBm±2dB < -39dBm Table 19: EG21-G MINIPCIE Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) GSM850 -108dBm NA NA -102dBm EGSM900 -108dBm NA NA -102dBm DCS1800 -107.5dBm NA NA -102dBm PCS1900 -107.5dBm NA NA -102dBm WCDMA B1 -108.2dBm -108.5dBm -109.2dBm -106.7dBm WCDMA B2 -109.5dBm -109dBm -110dBm -104.
LTE Module Series EG21-G MINIPCIE Hardware Design LTE-TDD B18 (10M) -98dBm -99.5dBm -100dBm -96.3dBm LTE-TDD B19 (10M) -98dBm -99dBm -99.8dBm -96.3dBm LTE-TDD B20 (10M) -98dBm -98.8dBm -99.7dBm -93.3dBm LTE-TDD B25 (10M) -98dBm -98dBm -100.2dBm -92.8dBm LTE-TDD B26 (10M) -98dBm -98.8dBm -100dBm -93.8dBm LTE-TDD B28 (10M) -98.1dBm -98.9dBm -99.8dBm -94.8dBm LTE-TDD B38 (10M) -97.2dBm -97.3dBm -99.2dBm -96.3dBm LTE-TDD B39 (10M) -98dBm -98.2dBm -99.8dBm -96.
LTE Module Series EG21-G MINIPCIE Hardware Design 4.6. ESD Characteristics The following table shows the ESD characteristics of EG21-G MINIPCIE. Table 20: ESD Characteristics of EG21-G MINIPCIE Part Contact Discharge Air Discharge Unit Power Supply and GND +/-5 +/-10 kV Antenna Interfaces +/-4 +/-8 kV USB Interface +/-4 +/-8 kV (U)SIM Interface +/-4 +/-8 kV Others +/-0.5 +/-1 kV 4.7.
LTE Module Series EG21-G MINIPCIE Hardware Design Thermal Pad EG21-G Mini PCIe Thermal Pad Heatsink EG21-G Module Heatsink Shielding Cover Thermal Pad PCI Express Mini Card Connector Application Board Application Board Figure 17: Referenced Heatsink Design NOTES 1. 2. The module offers the best performance when the internal BB chip stays below 105°C.
LTE Module Series EG21-G MINIPCIE Hardware Design EGSM @DRX=9 (USB disconnected) TBD mA DCS1800 @DRX=2 (USB disconnected) TBD mA DCS1800 @DRX=5 (USB disconnected) TBD mA DCS1800 @DRX=5 (USB suspended) TBD mA DCS1800 @DRX=9 (USB disconnected) TBD mA WCDMA @PF=64 (USB suspended) TBD mA WCDMA @PF=128 (USB disconnected) TBD mA WCDMA @PF=256 (USB disconnected) TBD mA WCDMA @ PF=512 (USB disconnected) TBD mA LTE-FDD @PF=32 (USB disconnected) TBD mA LTE-FDD @PF=64 (USB disconnected)
LTE Module Series EG21-G MINIPCIE Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) LTE-TDD @PF=64 (USB disconnected) TBD mA LTE-TDD @PF=64 (USB connected) TBD mA GSM850 1UL/4DL @32.03dBm TBD mA GSM850 2UL/3DL @30.03dBm TBD mA GSM850 3UL/2DL @28.95dBm TBD mA GSM850 4UL/1DL @27.6dBm TBD mA EGSM900 1UL/4DL @32.17dBm TBD mA EGSM900 2UL/3DL @30.92dBm TBD mA EGSM900 3UL/2DL @29.2dBm TBD mA EGSM900 4UL/1DL @27.94dBm TBD mA DCS1800 1UL/4DL @29.
LTE Module Series EG21-G MINIPCIE Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EGSM900 4UL/1DL@22.61dBm TBD mA DCS18001UL/4DL @25.8dBm TBD mA DCS1800 2UL/3DL @25.23dBm TBD mA DCS1800 3UL/2DL @24.09dBm TBD mA DCS1800 4UL/1DL @22.93dBm TBD mA PCS1900 1UL/4DL @25.5dBm TBD mA PCS1900 2UL/3DL @24.52dBm TBD mA PCS1900 3UL/2DL @23.24dBm TBD mA PCS1900 4UL/1DL @21.88dBm TBD mA WCDMA B1 HSDPA @21.87dBm TBD mA WCDMA B2 HSDPA @21.
LTE Module Series EG21-G MINIPCIE Hardware Design LTE-FDD B18 @22.92dBm TBD mA LTE-FDD B19 @22.87dBm TBD mA LTE-FDD B20 @22.640dBm TBD mA LTE-FDD B25 @22.9dBm TBD mA LTE-FDD B26 @23.09dBm TBD mA LTE-FDD B28 @23.5dBm TBD mA LTE-TDD B38 @23.02dBm TBD mA LTE-TDD B39 @22.88dBm TBD mA LTE-TDD B40 @22.42dBm TBD mA LTE-TDD B41 @22.9dBm TBD mA GSM850PCL=5 @31.64dBm TBD mA EGSM900PCL=5 @31.6dBm TBD mA DCS1800PCL=0 @29.2dBm TBD mA PCS1900PCL=0 @29.12dBm TBD mA WCDMA B1 @22.
LTE Module Series EG21-G MINIPCIE Hardware Design Tracking (AT+CFUN=0) Instrument Environment TBD mA Open Sky @Passive Antenna TBD mA Open Sky @Active Antenna TBD mA EG21-G_MINIPCIE_Hardware_Design 42 / 48
LTE Module Series EG21-G MINIPCIE Hardware Design 5 Dimensions and Packaging 5.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EG21-G MINIPCIE module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 5.2.
LTE Module Series EG21-G MINIPCIE Hardware Design 5.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1] for detailed A and B.
LTE Module Series EG21-G MINIPCIE Hardware Design EG21-G MINIPCIE adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679100002 as an example. Figure 20: Dimensions of the Mini PCI Express Connector (Molex 679100002) 5.4. Packaging The EG21-G MINIPCIE is packaged in a tray. Each tray contains 10pcs of modules. The smallest package of EG21-G MINIPCIE contains 100pcs.
LTE Module Series EG21-G MINIPCIE Hardware Design 6 Appendix References Table 23: Related Documents SN Document Name Remark [1] PCI Express Mini Card Electromechanical Specification Revision 1.2 Mini PCI Express specification [2] Quectel_EC2x&EG2x-G_AT_Commands_Manual AT commands manual for EC25, EC21, EG21-G and EG21-G modules Quectel_EC2x&EGxx&EM05_GNSS_AT_Commands _ Manual GNSS AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.
LTE Module Series EG21-G MINIPCIE Hardware Design DTR Data Terminal Ready EFR Enhanced Full Rate EMI Electro Magnetic Interference ESD Electrostatic Discharge ESR Equivalent Series Resistance FDD Frequency Division Duplexing FR Full Rate GLONASS GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communicatio
LTE Module Series EG21-G MINIPCIE Hardware Design PDA Personal Digital Assistant PDU Protocol Data Unit POS Point of Sale PPP Point-to-Point Protocol RF Radio Frequency RTS Ready To Send Rx Receive Direction SIMO Single Input Multiple Output SMS Short Message Service TX Transmitting Direction TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver & Transmitter UL Up Link URC Unsolicited Result Code USB Universal Serial Bus (U)SIM (Universal) Subscriber Identifi
LTE Module Series EG21-G MINIPCIE Hardware Design 7 IC & FCC Requirement FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
LTE Module Series EG21-G MINIPCIE Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8.
LTE Module Series EG21-G MINIPCIE Hardware Design interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
