M10 Quectel Cellular Engine Hardware Design M10_HD_V3.
M10 Hardware Design Document Title M10 Hardware Design Revision 3.0 Date 2012-03-02 Status Released Document Control ID M10_HD_V3.0 General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel.
M10 Hardware Design Contents Contents ............................................................................................................................................ 2 Table Index ........................................................................................................................................ 4 Figure Index ...................................................................................................................................... 5 0. Revision history .........
M10 Hardware Design 3.9.1. Decrease TDD noise and other noise ...................................................................... 47 3.9.2. Microphone interfaces configuration....................................................................... 48 3.9.3. Receiver and speaker interface configuration.......................................................... 49 3.9.4. Earphone interface configuration ............................................................................ 51 3.10.
M10 Hardware Design Table Index TABLE 1: RELATED DOCUMENTS ............................................................................................. 9 TABLE 2: TERMS AND ABBREVIATIONS ................................................................................ 10 TABLE 3: MODULE KEY FEATURES ........................................................................................ 15 TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE ................................................
M10 Hardware Design Figure Index FIGURE 1: MODULE FUNCTIONAL DIAGRAM ...................................................................... 18 FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT......................................................... 19 FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ................... 26 FIGURE 4: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ................... 27 FIGURE 5: REFERENCE CIRCUIT OF THE VBAT INPUT ..................................................
M10 Hardware Design FIGURE 42: REFERENCE CIRCUIT OF THE NETLIGHT ........................................................ 60 FIGURE 43: REFERENCE CIRCUIT OF THE STATUS ............................................................. 61 FIGURE 44: REFERENCE CIRCUIT OF THE LIGHT_MOS ..................................................... 62 FIGURE 45: REFERENCE CIRCUIT OF SD CARD ................................................................... 63 FIGURE 46: REFERENCE CIRCUIT OF RF INTERFACE ...................
M10 Hardware Design 0. Revision history Revision Date Author Description of change 1.00 2009-06-27 Tracy ZHANG Initial 1.01 2009-09-18 Yong AN 1. 2. 3. 4. 1.02 2009-11-12 Yong AN 1. Modified VRTC voltage inputting range. Modified Figure 1. Added Table 7 and Figure 4 with remark. Modified ordering information content in Chapter 6. 5. Added VCHG pin description. 6. Modified current consumption data in Table 36. 7. Added appendix A and B. 2. 3. 1.03 2010-06-09 Yong AN 1. 2. 3. 4. 5. 6. 7.
M10 Hardware Design 7. Deleted the content of charging function. M10_HD_V3.
M10 Hardware Design 1. Introduction This document defines the M10 module and describes the hardware interface of M10 module which are connected with the customer application and the air interface. This document can help customer quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customer can use M10 module to design and set up mobile applications easily. 1.1.
M10 Hardware Design 1.2.
M10 Hardware Design Abbreviation Description Li-Ion Lithium-Ion MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol RF Radio Frequency RMS Root Mean Square (value) RTC Real Time Clock RX Receive Direction SIM Subscriber Identification Module SMS Short Message Service TDMA Time Division Multiple
M10 Hardware Design Abbreviation Description SM SIM phonebook 1.3. Directives and standards The M10 module is designed to comply with the FCC statements. FCC ID is XMR201202M10. The Host system using M10, should have label indicating FCC ID: XMR201202M10. 1.3.1. FCC Statement Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. 1.3.2.
M10 Hardware Design exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : a) b) l'appareil ne doit pas produire de brouillage, et L’utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 1.4.
M10 Hardware Design GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.
M10 Hardware Design 2. Product concept The M10 is a Quad-band GSM/GPRS engine that works at frequencies GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M10 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to Appendix A and Appendix B. With a tiny profile of 29mm×29mm ×3.
M10 Hardware Design Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C 1) Storage temperature: -45°C ~ +90°C GPRS data downlink transfer: max. 85.6 kbps GPRS data uplink transfer: max. 85.6 kbps Coding scheme: CS-1, CS-2, CS-3 and CS-4 Support the protocols PAP (Password Authentication Protocol) usually used for PPP connections Internet service protocols TCP/UDP/FTP/HTTP/MMS/SMTP Support Packet Switched Broadcast Control Channel (PBCCH) CSD transmission rates: 2.4, 4.8, 9.6, 14.
M10 Hardware Design 1) When the module works in this temperature range, the deviation from the GSM specification might occur. For example, the frequency error or the phase error could increase. Table 4: Coding schemes and maximum net data rates over air interface Coding scheme 1 Timeslot 2 Timeslot 4 Timeslot CS-1: 9.05kbps 18.1kbps 36.2kbps CS-2: 13.4kbps 26.8kbps 53.6kbps CS-3: 15.6kbps 31.2kbps 62.4kbps CS-4: 21.4kbps 42.8kbps 85.6kbps 2.2.
M10 Hardware Design Figure 1: Module functional diagram 2.3. Evaluation board In order to help customer on the application of M12, Quectel supplies an Evaluation Board (EVB) that hosts the module directly with appropriate power supply, SIM card holder, RS-232 serial interface, handset RJ11 port, earphone port, antenna and other peripherals to control or test the module. For details, please refer to the document [13]. M10_HD_V3.
M10 Hardware Design 3. Application interface The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular application platform. Sub-interfaces included in these pads are described in detail in following chapters: Power supply (refer to Chapter 3.3) Serial interfaces (refer to Chapter 3.8) Two analog audio interfaces (refer to Chapter 3.9) SIM interface (refer to Chapter 3.10) SD card interface(refer to Chapter 3.
M10 Hardware Design 3.1.2. Pin description Table 5: Pin description Power supply PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT VBAT 50,51 52 I Module main power supply. VBAT=3.3V~4.6V . Vmax= 4.6V Vmin=3.3V Vnorm=4.0V It must be able to provide sufficient current in a transmitting burst which typically rises to 1.6A. VRTC 16 I/O Power supply for RTC when VBAT is not supplied. Charging for backup battery or golden capacitor when the VBAT is supplied. VImax=VBAT VImin=2.
M10 Hardware Design EMERG_ OFF 17 I Emergency off. Pulling down for at least 20ms will turn off the module in case of emergency. Use it only when normal shutdown through PWRKEY or AT command cannot perform well. VILmax=0.4V VIHmin=2.2V Vopenmax=2.8V Open drain/collector driver required in cellular device application. If unused, keep this pin open. Module status indication PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT STATUS 54 O Used to indicate module’s operating status.
M10 Hardware Design VILmin=-0.3V VILmax= 0.25*VDD_EXT VIHmin= 0.75*VDD_EXT VIHmax= VDD_EXT+0.3 VOLmax= 0.15*VDD_EXT VOHmin= 0.85*VDD_EXT If unused, keep these pins open. Open drain output port Imax=60mA If unused, keep this pin open.
M10 Hardware Design VILmax= 0.25*VDD_EXT VIHmin= 0.75*VDD_EXT VIHmax= VDD_EXT+0.3 VOLmax= 0.15*VDD_EXT VOHmin= 0.85*VDD_EXT these pins open. If used, SD_DATA is connected to SD card DATA0 pin. DESCRIPTION DC CHARACTERISTICS COMMENT O Voltage supply for SIM card The voltage can be selected by software automatically. Either 1.8V or 3V. 13 I/O SIM data When SIM_VDD=3V VILmax=0.4V VIHmin= SIM_VDD-0.4 VOLmax=0.4V VOHmin= SIM_VDD-0.4 When SIM_VDD=1.8V VILmax= 0.15*SIM_VDD VIHmin= SIM_VDD-0.
M10 Hardware Design 0.9*SIM_VDD VOLmax= 0.12*SIM_VDD VOHmin= 0.9*SIM_VDD SIM_RST 15 O SIM reset When SIM_VDD=3V VILmax=0.36V VIHmin= 0.9*SIM_VDD VOLmax=0.4V VOHmin= 0.9*SIM_VDD When SIM_VDD=1.8V VILmax= 0.12*SIM_VDD VIHmin= 0.9*SIM_VDD VOLmax= 0.12*SIM_VDD VOHmin= 0.9*SIM_VDD SIM_ PRESENCE 11 I SIM card detection VILmax=0.67V VIHmin=1.7V If unused, keep this pin open. PIN NAME PIN NO.
M10 Hardware Design 3.2. Operating modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Mode Function Normal operation GSM/GPRS SLEEP The module will automatically go into SLEEP mode if DTR is set to high level and there is no interrupt (such as GPIO interrupt or data on serial port). In this case, the current consumption of module will reduce to the minimal level.
M10 Hardware Design Alarm mode RTC alert function launches this restricted operation while the module is in POWER DOWN mode. The module will not be registered to GSM network and only parts of AT commands can be available. 1) Use the EMERG_OFF pin only while failing to turn off the module by the command “AT+QPOWD=1” and the ON/OFF pin. Please refer to Chapter 3.4.2.4. 3.3. Power supply The power supply range of M12 is from 3.3V to 4.6V which is supplied with a single voltage source of VBAT.
M10 Hardware Design 4.615ms 577us Burst:1.6A IBAT Max:400mV VBAT Figure 4: Ripple in supply voltage during transmitting burst 3.3.1. Power supply pins The VBAT pins are dedicated to connect the module supply voltage. VRTC pin can be used to connect a rechargeable coin battery or a golden capacitor which can help to maintain the system clock when VBAT supply is not applied. 3.3.2. Minimizing supply voltage drop Please pay special attention to the power supply design for your applications.
M10 Hardware Design C1>=100uF; C2=0.1uF~1uF; C3=10pF; C4=33pF Figure 5: Reference circuit of the VBAT input 3.3.3. Monitor power supply To monitor the supply voltage, you can use the “AT+CBC” command which includes three parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the 0-100 percent of battery capacity and actual value measured between VBAT and GND. The voltage is continuously measured at an interval depending on the operating mode.
M10 Hardware Design module and save the configuration to flash memory of module. After these configurations, the URC “RDY” would be received from the Serial Port of module every time when the module is powered on. Refer to Chapter “AT+IPR” in document [1]. 3.4.1.1. Power on module using the PWRKEY pin Customer’s application can turn on the module by driving the pin PWRKEY to a low level voltage and after STATUS pin outputs a high level, PWRKEY pin can be released.
M10 Hardware Design The power on scenarios is illustrated as following figure. 1 54ms VBAT 2 EMERG_OFF (INPUT) >1s VIH > 0.6*VBAT PWRKEY (INPUT) VIL<0.1*VBAT VDD_EXT (OUTPUT) 800ms STATUS (OUTPUT) MODULE STATUS OFF BOOTING RUNNING Figure 8: Timing of turning on system ① Make sure that VBAT voltage is stable before pulling down PWRKEY pin. The interval time between them is recommended 30ms. ② Keep the EMERG_OFF pin open if not used.
M10 Hardware Design the module will go into the alarm mode. In this case, the module will send out an Unsolicited Result Code (URC) when the baud rate of the Serial Port is set to a fixed one. RDY ALARM MODE +CFUN:0 Note: This result code does not appear when autobauding is active because a valid baud rate is not available immediately after powering up the module. Therefore, the module is recommended to set to a fixed baud rate.
M10 Hardware Design 3.4.2.1. Power down module using the PWRKEY pin Customer’s application can turn off the module by driving the PWRKEY to a low level voltage for certain time. The power-down scenario is illustrated as in Figure 9. The power-down procedure causes the module to log off from the network and allows the software to save important data before completely disconnecting the power supply, thus it is a safe way.
M10 Hardware Design data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power-down procedure, the module sends out the result code as shown below: NORMAL POWER DOWN After this moment, no other AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by STATUS pin, which is a low level voltage in this mode.
M10 Hardware Design 3.4.2.4. Emergency shutdown The module can be shut down by driving the pin EMERG_OFF to a low level voltage for over 20ms and then releasing it. The EMERG_OFF line can be driven by an Open Drain/Collector driver or a button. The circuit is illustrated as the following figures. Figure 10: Reference circuit for EMERG_OFF by using driving circuit Figure 11: Reference circuit for EMERG_OFF by using button Be cautious to use the pin EMERG_OFF.
M10 Hardware Design 3.4.3. Restart module using the PWRKEY pin Customer’s application can restart the module by driving the PWRKEY to a low level voltage for certain time, which is similar to the way to turn on the module. Before restarting the module, at least 500ms should be delayed after detecting the low level of STATUS. The restart scenario is illustrated as the following figure. Figure 12: Timing of restarting system The module can also be restarted by the PWRKEY after emergency shutdown.
M10 Hardware Design 3.5. Power saving Upon system requirement, there are several actions to drive the module to enter low current consumption status. For example, “AT+CFUN” can be used to set the module into minimum functionality mode and DTR hardware interface signal can be used to lead system to SLEEP mode. 3.5.1.
M10 Hardware Design 3.5.3. Wake up module from SLEEP mode When the module is in the SLEEP mode, the following methods can wake up the module. If the DTR Pin is pulled down to a low level, it would wake up the module from the SLEEP mode. The serial port will be active about 20ms after DTR is changed to low level. Receive a voice or data call from network to wake up module. Receive an SMS from network to wake up module. RTC alarm expired to wake up module.
M10 Hardware Design Figure 14: RTC supply from non-chargeable battery Figure 15: RTC supply from rechargeable battery MODULE VRTC 1.5K RTC Core Large Capacitance Capacitor Figure 16: RTC supply from capacitor Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used. M10_HD_V3.
M10 Hardware Design Figure 17: Seiko XH414H-IV01E Charge Characteristic 3.8. Serial interfaces The module provides two unbalanced asynchronous serial ports including Serial Port, Debug Port. The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from 4800bps to 115200bps.
M10 Hardware Design The Debug Port: DBG_TXD: Send data to the COM port of a debugging computer DBG_RXD: Receive data from the COM port of a debugging computer UART3: TXD_AUX: Send data to the RXD of DTE RXD_AUX: Receive data from the TXD of DTE The logic levels are described in the following table. Table 9: Logic levels of the serial interface Parameter Min Max Unit VIL 0 0.25*VDD_EXT V VIH 0.75*VDD_EXT VDD_EXT +0.3 V VOL 0 0.15*VDD_EXT V VOH 0.
M10 Hardware Design The module disables hardware flow control in default, AT command “AT+IFC=2,2” is used to enable hardware flow control. Used for AT command, GPRS data, CSD FAX, etc. Multiplexing function is supported on the UART Port. So far only the basic mode of multiplexing is available. Support the communication baud rates as the following: 300,600,1200,2400,4800,9600,14400,19200,28800,38400,57600,115200. The default setting is autobauding mode.
M10 Hardware Design 3.8.1.2. The connection of UART The connection between module and host via UART port is very flexible. Three connection styles are illustrated as below. UART Port connection is shown as below when it is applied in modulation-demodulation. Figure 18: Connection of all functional UART port Three lines connection is shown as below. Figure 19: Connection of three lines UART port UART Port with hardware flow control is shown as below. This connection will enhance the M10_HD_V3.
M10 Hardware Design reliability of the mass data communication. Figure 20: Connection of UART port with hardware flow control 3.8.1.3. Software upgrade The TXD and RXD can be used to upgrade software. The PWRKEY pin must be pulled down before the software upgrade. Please refer to the following figure for software upgrade. Module (DCE) IO Connector UART port TXD TXD RXD RXD GND PWRKEY GND PWRKEY Figure 21: Connection of software upgrade 3.8.2.
M10 Hardware Design 460800bps. Figure 22: Connection of software debug 3.8.3. UART Port 3 UART3: Two data lines: TXD3and RXD3 UART3 port is used for AT command only and does not support GPRS data, CSD FAX, Multiplexing function etc. Support the communication baud rates as the following: 4800, 9600, 14400, 19200,28800,38400,57600,115200. The default baud rate setting is 115200bps, and does not support autobauding. The baud rate can be modified by AT+QSEDCB command.
M10 Hardware Design 3.8.4. UART Application The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM system is 3V, the divider resistor should be changed from 5.6K to 10K. Figure 24: 3.3V level match circuit The reference design of 5V level match is shown as below. The construction of dotted line can refer to the construction of solid line. Please pay attention to direction of connection. Input dotted line of module should refer to input solid line of the module.
M10 Hardware Design The following picture is an example of connection between module and PC. A RS_232 level shifter IC or circuit must be inserted between module and PC, since these three UART ports do not support the RS_232 level, while support the CMOS level only.
M10 Hardware Design Table 11: Pin definition of Audio interface Interface (AIN1/AOUT1) (AIN2/AOUT2) Name Pin Function MIC1P 23 Microphone1 input + MIC1N 24 Microphone1 input - SPK1P 22 Audio1 output+ SPK1N 21 Audio1 output- MIC2P 25 Microphone2 input + MIC2N 26 Microphone2 input - SPK2P 20 Audio2 output+ AGND 19 Suggested to be used in audio circuit. Do not connect to digital GND in host PCB as it could produce TDD noise.
M10 Hardware Design The severity degree of the RF interference in the voice channel during GSM transmitting period largely depends on the application design. In some cases, GSM850/GSM900 TDD noise is more severe; while in other cases, DCS1800/PCS1900 TDD noise is more obvious. Therefore, customer can have a choice based on test results. Sometimes, even no RF filtering capacitor is required. The capacitor which is used for filtering out RF noise should be close to RJ11 or other audio interfaces.
M10 Hardware Design 3.9.3.
M10 Hardware Design Close to speaker GND Differential layout 33pF 10pF Module ESD 22uF SPK2P AGND Figure 30: Speaker interface configuration of AOUT2 Close to speaker GND Differential layout Amplifier circuit 10pF 33pF 10pF 33pF ESD C1 Module SPK2P AGND C2 ESD GND Figure 31: Speaker interface with amplifier configuration of AOUT2 Note: The value of C1 and C2 depends on the input impedance of audio amplifier. M10_HD_V3.
M10 Hardware Design 3.9.4. Earphone interface configuration Close to Socket Differential layout GND 4.7uF GND GND 33pF 33pF MIC2N MIC2P Module 68R 22uF SPK2P 3 AGND 33pF 4 2 1 10pF Amphenol 9001-8905-050 AGND AGND GND GND GND Figure 32: Earphone interface configuration Table 12: Typical electret microphone characteristic Parameter Min Type Max Unit Working Voltage 1.2 1.5 2.0 V Working Current 200 500 uA External Microphone Load Resistance 2.
M10 Hardware Design 3.10. SIM card interface 3.10.1. SIM card application The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM card, which is intended for use with a SIM application Tool-kit. The SIM interface is powered from an internal regulator in the module. Both 1.8V and 3.0V SIM Cards are supported.
M10 Hardware Design VDD_EXT 10K Module SIM_VDD SIM_RST SIM_CLK SIM_PRESENCE SIM_DATA 100nF SIM_CARD VCC RST CLK 22R 22R 22R PRESENCE GND VPP IO GND ESDA6V8V6 GND GND Figure 33: Reference circuit of the 8 pins SIM card Note: Please do not use “AT+QSIMDET=1,1” which causes to initialize SIM card when Figure 33 circuit is adopted. If customer does not need the SIM card detection function, keep SIM_PRESENCE open.
M10 Hardware Design In SIM interface designing, in order to ensure good communication performance with SIM card, the following design principles should be complied with. Place the SIM card holder close to module as close as possible. Ensure the trace length of SIM signals do not exceed 20mm. Keep the SIM signals far away from VBAT power and RF trace. The width of SIM_VDD trace is not less than 0.5mm. Place a bypass capacitor close to SIM card power pin. The value of capacitor is less than 1uF.
M10 Hardware Design Table 15: Pin description of Amphenol SIM card holder Name Pin Function SIM_VDD C1 SIM Card Power supply SIM_RST C2 SIM Card Reset SIM_CLK C3 SIM Card Clock GND C5 Ground VPP C6 Not Connect SIM_DATA C7 SIM Card data I/O For 8-pin SIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for more information.
M10 Hardware Design VPP C6 Not Connect SIM_DATA C7 SIM Card Data I/O SIM_DETECT C8 Pulled down GND with external circuit. When the tray is present, C4 is connected to C8. 3.11. Keypad interface The keypad interface consists of 5 keypad column inputs and 5 keypad row outputs. The basic configuration is 5 keypad columns and 5 keypad rows, giving 25 keys.
M10 Hardware Design Module KBC0 KBC1 KBC2 KBC3 KBC4 GPIO1_KBC5 KBR0 KBR1 KBR2 KBR3 KBR4 Figure 37: Reference circuit of the keypad interface If a 5*5 matrix does not provide enough keys, GPIO1 could be multiplexed as KBC5 to configure a 5*6 keypad matrix. Then, the keypad interface consists of 5 keypad row outputs and 6 keypad column inputs. The basic configuration is 5 keypad rows and 6 keypad columns, giving 30 keys. Note: This function is not supported in the default firmware. 3.12.
M10 Hardware Design Table 19: Characteristic of the ADC Item Min Voltage range 0 Typ Max Units 2.8 V ADC Resolution 10 bits ADC accuracy 2.7 mV 3.13. Behaviors of the RI Table 20: Behaviors of the RI State RI response Standby HIGH Voice calling Changed to LOW, then: 1. Changed to HIGH when call is established. 2. Use ATH to hang up the call, RI changes to HIGH. 3.
M10 Hardware Design Figure 38: RI behaviour of voice calling as a receiver Figure 39: RI behaviour of data calling as a receiver Figure 40: RI behaviour as a caller M10_HD_V3.
M10 Hardware Design Figure 41: RI behaviour of URC or SMS received 3.14. Network status indication The NETLIGHT signal can be used to drive a network status indicator LED. The working state of this pin is listed in Table 21. Table 21: Working state of the NETLIGHT State Module function Off The module is not running. 64ms On/ 800ms Off The module is not synchronized with network. 64ms On/ 2000ms Off The module is synchronized with network. 64ms On/ 600ms Off GPRS data transfer is ongoing.
M10 Hardware Design 3.15. Operating status indication The STATUS pin is set as an output pin and can be used to judge whether module is power-on, please refer to Chapter 3.4. In customer design, this pin can be connected to a GPIO of DTE or be used to drive an LED in order to judge the module’s operation status. A reference circuit is shown in figure 43. Table 22: Pin definition of the STATUS Name Pin Function STATUS 54 Indicate module’s operating status Figure 43: Reference circuit of the STATUS 3.
M10 Hardware Design Table 23: Pin definition of the GPIO interface Name Pin PU/PD Function GPIO0 64 Pulled up internally to 75K resistor General Purpose Input/Output Port GPIO1_KBC5 38 Pulled up internally to 75K resistor General Purpose Input/Output Port Keypad interface KBC5 3.17. Open drain output (LIGHT_MOS) The module provides an open drain output pin to control keyboard backlight. The output LIGHT_MOS can sink 60mA. This open-drain output switch is high impedance when disabled.
M10 Hardware Design 3.18. SD card interface The module provides SD card interface that supports many types of memory, such as Memory Stick, SD/MCC card and T-Flash or Micro SD card. The following are the main features of SD card interface.
M10 Hardware Design Table 26: Pin name of the SD card and T-Flash(Micro SD) card Pin NO. Pin name of SD card Pin name of T-Flash(Micro SD) card 1 CD/DATA3 DATA2 2 CMD CD/DATA3 3 VSS1 CMD 4 VCC VCC 5 CLK CLK 6 VSS2 VSS 7 DATA0 DATA0 8 DATA1 DATA1 9 DATA2 In SD card interface designing, in order to ensure good communication performance with SD card, it should be complied with following design principles. Route SD card signals as short as possible.
M10 Hardware Design 4. Antenna interface The Pin 43 is the RF antenna pad. The RF interface has an impedance of 50Ω. A reference circuit is shown in following figure. By default, the resistor R1 is 0 ohm and capacitor C1 and C2 are not mounted. R1 0R RF_ANT C1 NM MODULE C2 NM Figure 46: Reference circuit of RF interface 4.1. Antenna installation M10 provides an RF antenna PAD for customer’s antenna connection.
M10 Hardware Design 4.2. RF output power Table 28: The module conducted RF output power Frequency Max Min GSM850 33dBm ±2dB 5dBm±5dB EGSM900 33dBm ±2dB 5dBm±5dB DCS1800 30dBm ±2dB 0dBm±5dB PCS1900 30dBm ±2dB 0dBm±5dB Note: In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in chapter 13.16 of 3GPP TS 51.010-1. 4.3.
M10 Hardware Design Figure 47: Recommendation of RF pad welding M10_HD_V3.
M10 Hardware Design 5. Electrical, reliability and radio characteristics 5.1. Absolute maximum ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table: Table 31: Absolute maximum ratings Parameter Min Max Unit VBAT -0.3 4.7 V Peak current of power supply 0 2 A RMS current of power supply (during one TDMA- frame) 0 0.7 A Voltage at digital pins -0.3 3.3 V Voltage at analog pins -0.3 3.
M10 Hardware Design 5.3. Power supply ratings Table 33: The module power supply ratings Parameter Description Conditions Min Type Max Unit VBAT Supply voltage Voltage must stay within the min/max values, including voltage drop, ripple, and spikes. 3.3 4.0 4.6 V Voltage drop during transmitting burst Maximum power control level on GSM850 and GSM900. 400 mV Voltage ripple Maximum power control level on GSM850 and GSM900 @ f<200kHz @ f>200kHz 50 2 mV mV IVBAT M10_HD_V3.
M10 Hardware Design Parameter Description Conditions DCS1800/PCS1900 Peak supply current (during transmission slot) 1) 2) Min 2) Maximum power control level on GSM900. Type Max 423/445 1.6 Unit mA 1.8 A Power control level PCL 5 Power control level PCL 0 5.4. Current consumption The values of current consumption are shown in Table 34.
M10 Hardware Design @power level #15,Typical 66mA DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 12 GSM850 @power level #5 <550mA,Typical 341mA @power level #12,Typical 135mA @power level #19,Typical 85mA EGSM 900 @power level #5 <550mA,Typical 347mA @power level #12,Typical 156mA @power level #19,Typical 103mA DCS 1800 @power level #0 <450mA,Typical 318mA @power level #7,Typical 118mA @power level #15,Typical 84mA PCS 1900 @power level #0 <450mA,Typical 335mA @power level #7,Typical 128mA @power level #15,Ty
M10 Hardware Design @power level #19,Typical 109mA EGSM 900 @power level #5 <660mA,Typical 464mA @power level #12,Typical 221mA @power level #19,Typical 117mA DCS 1800 @power level #0 <530mA,Typical 423mA @power level #7,Typical 166mA @power level #15,Typical 99mA PCS 1900 @power level #0 <530mA,Typical 445mA @power level #7,Typical 165mA @power level #15,Typical 100mA Note: GPRS Class 12 is the default setting. The module can be configured from GPRS Class 1 to Class 12 by “AT+QGPCLASS”.
M10 Hardware Deesign 6. M Mechanical dime ensions Thiss chapter desccribes the mechanical dim mensions of the module. 6.1.. Mechanical dimensio ons of mod dule Figure 48: 4 M10 top aand side dim mensions（Un nit: mm） M10__HD_V3.
M10 Hardware Design test point Figure 49: M10 bottom dimensions（Unit: mm） Figure 50: PAD bottom dimensions（Unit: mm） M10_HD_V3.
M10 Hardware Design 6.2. Footprint of recommendation single pad M10_HD_V3.
M10 Hardware Design safe area line module dimension keepout area Figure 51: Footprint of recommendation（Unit: mm） Note1：Keep out the area below the test point in the host PCB. Place solder mask. Note2：In order to maintain the module, keep about 3mm between the module and other components in host PCB. Note3：Keep out area in above figure in which is forbid to pour GND copper. Since the RF test point in this area, avoid generating parasitic capacitance between RF test point and GND. M10_HD_V3.
M10 Hardware Deesign 6.3.. Top view of the mod dule Figure 52: Top view off the module 6.4.. Bottom view of the module m Figure F 53: B Bottom view of o the modulle M10__HD_V3.
M10 Hardware Design Appendix A: GPRS coding schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in Table 36. Table 36: Description of different coding schemes Scheme Code rate USF Pre-coded USF CS-1 1/2 3 3 CS-2 2/3 3 CS-3 3/4 CS-4 1 Radio Block excl.USF and BCS BCS Tail Coded bits Punctured bits 181 40 6 268 3 6 3 12 Data rate Kb/s 4 456 0 9.05 16 4 588 132 13.4 312 16 4 676 220 15.6 428 16 - 456 - 21.
M10 Hardware Design Appendix B: GPRS multi-slot classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependant, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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