M27 GSM GPRS Wireless Module User Manual Rev. 0.1 30, July 2007 COPYRIGHT BENQ Corporation This document contains proprietary technical information which is the property of BenQ Corporation and is issued in strict confidential and shall not be disclosed to others parties in whole or in parts without written permission of BenQ Corporation The documents contain information on a product, which is under development and is issued for customer evaluation purposes only.
1. OVERVIEW ...........................................................................................................................................................................................................4 2. M27 KEY FEATURES AT A GLANCE .............................................................................................................................................................5 3. DESIGN GUIDE ORGANIZATION.......................................................................
6.2.2 7 SINGLE EXTERNAL UART SOLUTION: EXAR XR16L570IL24 .....................................................................................................40 USB INTERFACE ...............................................................................................................................................................................................41 7.1 USB CHARGER SOLUTION ...................................................................................................................
1. Overview This design guide is based mainly on the M27 evaluation board (EVB). The M27 EVB enables you to evaluate the M27 module and peripheral design. In addition, it provides sample firmware that you can use as a starting point to develop code. To give the users the system concept of the interconnections between the host and M27 module, a system block diagram is provided as the following: The reference schematics for M27 peripherals will be given in details in this design guide.
2. M27 Key Features at a glance M27 provides basic features (see in the following table) for our customers, and provide compile tool to our customers, it will gives you maximum flexibility for easy integration with the Man-Machine Interface (MMI). Feature Implementation Power supply Single supply voltage 3.3V- 4.
Storage temperature : -40 ~ +85 SMS MT, MO, CB, Text and PDU mode SIM interface Supported SIM card: 1.8V/3V External SIM card holder has to be connected via interface connector (note that card holder is not part of M27) External antenna Connected via 50 Ohm antenna connector or antenna pad Real time clock Implemented Physical characteristics Size: 45.7 x 43 x 6.8 mm Weight: 11.
3. Design Guide Organization The rest of the manual is organized as follows: Section 4 Pin out definition of M27 module is given along with the RF antenna placement and trace guidelines. In addition, the recommended power on; and handshaking sequences are shown. Section 5 Reference schematics for M27 peripheral, i.e., SIM, Audio, Keyboard, LCM, Paging indicator, Camera, NAND flash, and Micro SD. Section 6 The UART interface. Section 7 The USB interface and USB charger solution..
4. Pin Assignment of M27 module The following is the pin out definition of the M27 module NAND flash interface (14 pin assignment) Note: For pin 97, 98, 99,100- MCSI and GPIO muxed pins, they have different functions depending on the MODE field of the pin configuration register. Mode 0 GPIO function, Mode 1 MCSI function ©2007 B e n Q C o r p o r a t io n M 27 U s e r M a n u a l 8 C o n f id e n t ia l P r o p e r t y V e r s i o n : 0.
4.1. M27 Module Placement In M27 module, we have one 50ohm antenna port (interfaced by Antenna pad and grounding) for signal transfer. In addition, the RF signal will be impacted by high frequency noise interference. We strongly suggest the audio trace and SIM signal trace to be as short as possible and as far away as possible from the RF trace and power line to prevent cross coupling. The M27 offer one approach to connecting the antenna shown in the Figure: 4.2.
4.4. PWON PIN The pin POWON is dedicated to powering on the M27 module. The pin is initially HIGH when power is applied to the M27 module. Once the pin is pulled low for more than 120 ms. M27 will power on. Pin Name PWON Pin Out 14 Pull PU Reset Config Description Input Power On 120ms 4.5. VBACKUP PIN 4.5.1 VBACKUP Main Feature When main battery power (VBAT) is low or removed, real time information would be lost. For some purposes, customers would like to keep some data (e.g.
4.5.3Electrical Specification Power ON / Power OFF and Backup Conditions PARAMETER TEST CONDITIONS Battery voltage to enter Measured on the VBAT ACTIV mode from OFF mode terminal Battery voltage to enter VBACKUP 3.2, measured on BACKUP mode from ACTIV the VBAT terminal, monitored mode on the ONnOFF terminal MIN TYP Max 3.3 UNIT V 2.6 2.75 2.9 V MIN TYP Max UNIT 350 500 900 µA 2.9 3.1 3.3 V MIN TYP Max UNIT 43 65 µA 8.
4.5.5 VBACKUP Charging The backup battery can be charged by an external circuit or by M27 module itself via the pad “VBACKUP”. An external circuit with a programmable voltage regulator allows recharging the backup battery. The backup battery charge starts when the following conditions are met: Backup battery charge is enabled by a control bit Charging power supply (main battery) voltage > Backup Battery voltage Charging power supply (main battery) voltage > 2.8V 4.6.
4.7. ADCIN PIN Battery monitoring is performed by the multiplexed 10–channel 10–bit ADC MADC used to measure the battery voltage, battery temperature, battery type, battery charge current, battery charger input voltage and the backup battery voltage. The signals are converted into digital 10– bit words, stored in auxiliary ADC output registers and transmitted to an external C. This reference circuit is our recommendation. Pin Name ADCIN ADCIN2 4.8. Pin Out 5 22 3.3 EXT PIN Pin Name 3.
4.9. VRIO PIN Power supply for external level shifters Pin Name Pin Out VRIO 7 Pull Reset Config Description 1.8V output voltage for external level shifters(Note) Note: Level shifter: PMGD280UN for UART, ADG3308BRUZ-REEL for NAND flash, Add/data bus, SN74LVCH162244AGR, PCA9306DCTR and SN74AVC1T45YZPR for Camera ©2007 B e n Q C o r p o r a t io n M 27 U s e r M a n u a l 14 C o n f id e n t ia l P r o p e r t y V e r s i o n : 0.
5 Peripherals 5.1. SIM The SIM Card digital interface in the M27 ensures the translation of logic levels between M27 and the SIM Card, for the transmission of 3 different signals: SIM_CLK; a reset signal from M27 to the SIM Card (SIM_RST); and serial data from M27 to the SIM Card (SIM_IO). The SIM card interface can be programmed to drive a 1.8V SIM Card. 6 Pin SIM Socket 5.2. Audio There are 2 embedded audio drivers built in the BenQ M27 module.
Ear output Hand free Microphone 1 Speaker output ©2007 B e n Q C o r p o r a t io n M 27 U s e r M a n u a l 16 C o n f id e n t ia l P r o p e r t y V e r s i o n : 0.
Audio Path Selection AT Commands The M27 module provides the switching of audio paths using AT commands (In connection status): Default value: case (1) (1) AT$HANDHELD (EARN, EARP, MICIN2, MICIP2) (2) AT$HANDFREE (SPKPA, SPKNA, MICIN1, MICIP1) 5.3. KEYBOARD 5.3.1 Keyboard Controller Overview The keyboard controller can handle up to 5*5 keyboards, operates on a 32-kHz clock, and can generate wake-up events when the device is in sleep mode, and this reference circuit is our recommendation.
The keyboard controller includes the following main features: - Support of multi-configuration keyboards up to 5 rows x 5 columns - Integrated programmable timer - Programmable interrupt (IT) generation on key events - Event detection on both key press and key release - Multi-key press detection and decoding - Long key detection on prolonged key press - Programmable time-out on permanent key press or after keyboard release 5.3.
5.4. LCM (SPI interface) M27 Provides SPI LCM interface for customer application, it gives you the flexibility to develop customized application, and this reference circuit is our recommendation. Pin Name Pin Out Pull Reset Config Description 3.3_EXT 61 Power Supply for LCM & Back light LED LCM_CS 49 Chip Select \ Chip Select A LCM_SDO 51 Serial input data \ Serial Input Data LCM_D/Cn 53 Register select Input pin (Data/Instruction) \ Read signal LCM_CLK 55 Serial Input clock \ Write sig
Dot Matrix LCM spec SHENZHEN WELLST WGM12864COG-21 9 2 .0 General specifications 3 .0 8 6 .0 7 1 .1 6 5 . 5V . A 43 . 0 M A X 8 .0 1 .6 1 1 .5 8 .0 2 6 .0 3 8 .0V . A 3 5 .0 3 0. 0 0 . 47 5 2 . 54X 7 = 2 0. 3 2 1 9 M A X 6 4. 0 1 2 .0 1 3 0 1 4.0 5 2 . 0± 0. 2 0. 45 1 9. 0 0. 49 5 7 .0 48 . 3 2 0. 0 0. 5 1 5 1 0.5 DOT S: 1 2 8 *6 4 Display format: 128 * 64 dot matrix graphic Microprocessor interface: Serial Power level: 3.
5.5. LCM (parallel bus interface) M27 provides parallel bus (8 bit) LCM interfaces for customer application. It gives you the flexibility to develop customized application, and a reference circuit is provided here.
Level shifters between M27 pins and LCM connector P1V8_M27 3 3 3 3 3 3 3 3 DATA_ADD7 DATA_ADD6 DATA_ADD5 DATA_ADD4 DATA_ADD3 DATA_ADD2 DATA_ADD1 DATA_ADD0 U4 ADG3308BRUZ-REEL 1 20 2 VCCAVCCY 19 A1 Y 1 3 18 Y 2 17 4 A2 Y 3 16 5 A3 Y 4 15 6 A4 Y 5 14 7 A5 Y 6 13 8 A6 Y 7 12 9 A7 Y 8 11 3.3V_EXT 10 A8 EN GND 3.
5.5.2 Dimension and Pin assignment for parallel bus type LCM (YMC240160-04AAAYDGL) ©2007 B e n Q C o r p o r a t io n M 27 U s e r M a n u a l 23 C o n f id e n t ia l P r o p e r t y V e r s i o n : 0.
Pin assignment of parallel bus type LCM (YMC240160-04AAAYDGL) 5.6. Touch screen controller For USB charger application, there are two choices for the touch screen controller with SPI interface or I2C interface. 5.6.1 SPI type touch screen controller(MTK MT6301) +Vcc DCLK X+ nCS Y+ Din XBusy YDout GND PenIRQ VBAT IOVdd AUX Vref GND 5 X1 6 Y1 7 0.1U K X2 8 Y2 9 GND10 11 12 C146 17 3.3V_EXT U25 MT6301 4 3 2 1 16 15 14 3.
1 3 LCM_CLK_CON U15 PMGD280UN 2 P1V8_M27 10K J 10K J R76 3 S1 D1 G1 G2 D2 S2 LCM_CLK 6 LCM_CLK 5 LCM_CS 5 LCM_SDO 5 5 10K J R77 4 10K J R78 3.3V_EXT R79 LCM_SDI 3 LCM_SDI_CON 1 3 LCM_CS_CON P1V8_M27 10K J 10K J U13 PMGD280UN S1 2 R68 3 R70 G1 G2 D2 S2 LCM_CS 6 D1 10K J R69 5 4 3.3V_EXT 10K J R71 3 LCM_SDO_CON LCM_SDO 5.6.2 I2C type touch screen controller(TI TSC2003) U28 3.3V_EXT 1 C149 X1 2 Y1 3 0.
5.7. Paging Indicator LEDA is dedicated for paging indication. The application circuit is shows as below. The diagram below illustrates the application schematic for LED driver inputs LEDA. In each case the current limiter resistor R has to be selected in order to be compliant with maximum current drive capability of each input. Name Pin LEDA 9 Max drive current 20mA Highest level voltage VBATBB Lowest level supply Description voltage 2.
3.3V_EXT R164 150K R166 10K J R165 10K J 8 7 I2C_SCL_PAD 6 I2C_SDA_PAD 5 P1V8_M27 U22 PCA9306DCTR EN GND Vref 2 Vref 1 SCL2 SCL1 SDA2 SDA1 1 GND 2 3 4 C144 C145 0.1U K 0.1U K I2C_SCL 3 I2C_SDA 3 GND GND CAM_DB5_PAD CAM_DB4_PAD CAM_DB3_PAD CAM_DB2_PAD 41 40 38 37 48 CAM_DB1_PAD CAM_DB0_PAD 36 35 33 32 25 30 29 27 26 24 2A0 2A1 2A2 2A3 2OE 4A0 4A1 4A2 4A3 4OE C142 C143 0.1U K 0.1U K 0.1U K 0.
P1V8_M27C70 3.3V_EXT C71 0.1U K 0.1U K GND U27 1 VCCA 3 3 CAM_XCLK VCCB A 2 B GND DIR 6 4 CAM_XCLK_PAD 5 P1V8_M27 SN74AVC1T45Y ZPR GND J403 GND CAM_HS_PAD CAM_VSYNC CAM_PWDN_PAD CAM_LCLK_PAD P2V5 P1V8_M27 I2C_SDA_PAD CAM_XCLK_PAD I2C_SCL_PAD C159 0.
P1V8_M27 3 3 3 3 3 3 U32 ADG3308BRUZ-REEL 1 20 2 VCCAVCCY 19 ND_RE_M25 A1 Y1 3 18 ND_CLE_M25 Y2 17 4 A2 ND_ALE_M25 A3 Y3 16 5 ND_RDY_M25 Y4 15 6 A4 ND_CE1_M25 A5 Y5 14 7 ND_WE_M25 Y6 13 8 A6 Y7 12 9 A7 Y8 11 3.3V_EXT 10 A8 EN GND 3.3V_EXT ND_RE ND_CLE ND_ALE ND_RDY ND_CE1 ND_WE 3 3 3 3 3 3 GND 3.3V_EXT 9 9 9 9 9 9 ND_WE ND_ALE ND_CLE ND_CE1 ND_RE ND_RDY ND_WE ND_ALE ND_CLE ND_CE1 ND_RE ND_RDY F6 G4 U2 A1 A5 A2 B3 A4 B2 A6 H1 H6 A3 /WP /WE ALE CLE /CE /RE R/B VCC VCCQ 3.
5.10. Micro SD interface The micro-SD card SPI interface is compatible with SPI hosts available on the market. As any other SPI device the micro-SD card SPI channel consists of the following 4 signals: CS, CLK, DI, DO 1.8V C8 0.1uF U7 1 CLK CLK A 2 6 VCCB 4 B 5 DIR VRIO SN74AVC1T45YZPR C10 C11 0.1U K 0.1U K 3.3V 1 1.8V GND 0.1uF BGND VCCA 3 BGND 3.3V C9 CMD CS CMD CS 2 3 4 VCCA J1 A1 A2 GND 8 VCCB B1 B2 5 7 3 2 12 7 6 5 DIR P1V8 SN74LVC2T45DCUR 1.8V 3.
6 UART Interface UART/RS232 The UART includes the following additional features - Hardware flow control (such as RTS/CTS) consists of two control signal lines between the Host (DTE) and Client (DCE) that are used to control the flow of data between the devices. - Auto-baud rate with the possibility of baud-rates ranging from 1200 to 115.2K bits.
UART interface on M27 1.8V-3.3V level shifter for UART interface ©2007 B e n Q C o r p o r a t io n M 27 U s e r M a n u a l 32 C o n f id e n t ia l P r o p e r t y V e r s i o n : 0.
UART transceiver ICL3237A HW flow control When the hardware flow control type is recommended for communication between the Host(DTE) and client(DCE). Regarding the hardware flow control mechanism between the system (host side) and module (client side). The GSM engine is designed for use as a DCE.
HOST Device Client Device TX TX RX RX RTS RTS CTS CTS DCD DCD RI RI GND GND DSR DTR Auto baud Rate Mechanism The M27 module UART is set at Auto-baud rate. This means when the M27 is powered on, it automatically detects the baud rate after the first AT command sent by the host Device.
6.1 Dual external UART solution M27 support 1 UART interface. M27 module support 4 bit address and 8 bit data bus with some associated control lines. The memory bus is Intel interface with 2 independent Read/Write control lines. For dual external UART port, there are 2 chips which are pin-to-pin compatible, except the ground plane. The one is the NXP SC16C852L, the other is EXAR XR16M2550. The function blocks and reference schematics are shown below.
Dual UART interface EXAR XR16M2550 HIGH PERFORMANCE LOW VOLTAGE DUART WITH 16-BYTE FIFO Package 32 PIN QFN(5x5mm), 48 PIN TQFP (9x9mm) Level shifter EXAR XR16M2550 / NXP SC16C852L A[0..2] A[0..
3.3V C1 3.3V_EXT 10U 6.3V 3,5,7,9 R3 0 J 0603 U3 26 2 UART 14 15 13 UART_TXA UART_RSTA UART_TXB 24 23 22 19 17 UART_RXA UART_CTSA UART_RXB 21 20 18 M27 SIDE(DCE) UART 16 VCC C1+ C1- GND SHDN MBAUD C2+ C2V+ V- EN T1IN T2IN T3IN T4IN T5IN T1OUT T2OUT T3OUT T4OUT T5OUT R1OUT R2OUT R3OUT R1IN R2IN R3IN R1OUTB ICL3237CA 28 25 C2 0.47U M 1 3 C3 0.47U M 27 4 C4 0.47U M C5 0.
6.2 Single external UART solution For single external UART solution, there are two options: the one is NXP SC16C850LIET, the other is EXAR XR16L570IL24. The function block and reference schematics are shown below: 6.2.1 Single external UART solution: NXP SC16C850LIET Single UART interface NXP SC16C850LIET 1.8 V single UART, 5 Mbit/s (max.) with 128-byte FIFOs parallel bus interface Package TFBGA36(3.5x3.
1.8V IOR# A3 IOW# B4 F1 UART_RESET D0 D1 D2 D3 D4 D5 D6 D7 VDD F4 E4 F5 E5 F6 E6 D6 D5 VDD D[0..7] D0 D1 D2 D3 D4 D5 D6 D7 1 TX SC16C850LIET RX RTS CTS IOR IOW DTR RI RESET CD A[0..2] D1 INT N.C. N.C. 1.8V C6 10K J 10K J R52 R53 2 3 S1 D1 G1 G2 D2 S2 UART_TXB 6 5 10K J R51 4 3.3V 10K J R54 D2 UART_RXB D3 E1 Note : UART_TXA, UART_RXA, UART_RSTA, UART_CTSA are from M27 F3 E3 F2 A2 A4 B2 B3 E2 VSS UART_INTA N.C. LOWPWR VSS B5 N.C.
6.2.2 Single external UART solution: EXAR XR16L570IL24 Single UART interface EXAR XR16L570IL24 SMALLEST 1.62V TO 5.5V UART WITH 16-BYTE FIFO AND POWERSAVE Package 24 PIN QFN(4x4mm), 32 PIN QFN(5x5mm) A[0..2] A[0..2] IOR# IOW# UART_CSA# UART_INTA 3.3V 4 2 UART_RESET Y1 VDD OUT GND Cont 3 1 C20 U13 20 21 22 23 24 1 2 3 14 13 12 11 9 6 7 15 17 8 0.047U K XR16L570IL24 D0 D1 D2 D3 D4 D5 D6 D7 A0 A1 A2 IOR# IOW# UART_CS# PwrSave UART_INT UART_RESET CLK VCC TXA RXA RTS# CTS# 19 1.8V 1 5 1.
7 USB Interface USB signals are transmitted on a twisted pair of data cables, labeled D+ and D−. These collectively use half-duplex differential signaling to combat the effects of electromagnetic noise on longer lines. D+ and D− usually operate together; They are not separate simplex connections. Transmitted signal levels are 0.0–0.3 volts for low and 2.8–3.6 volts for high. The USB supports three data rates - Low Speed rate of 1.5 M bit/s (183 KiB/s). - Full Speed rate of 12 M bit/s (1.5 MiB/s).
7.1 USB charger solution For USB charger application, our suggestion is to use the Linear Technology LTC4067 as the Li-ion battery charger. This chip manages the power supplies that would be typical for a USB powered device or from an adaptor to an intermediate voltage bus. The battery charger is a CC/CV timer terminated type capable of charge currents up to 1.25A. The adaptor input has over-voltage protection to 13V.
8 GPIO MAPPING The module provides 4 independent GPIO pins configurable in read or write mode. The function for these I/O pins is List below.
9 Level Shifter Design 9.1 Introduction The bi-directional level shifter circuit described in this application note consists of one discrete MOS-FET for each bus line.
10. Layout notice 10.1 THT hole and pad size for 2x7 connector ©2007 B e n Q C o r p o r a t io n M 27 U s e r M a n u a l 45 C o n f id e n t ia l P r o p e r t y V e r s i o n : 0.
11. Antenna Interface 11.1 Antenna Installation & Consideration M27 is capable of sustaining a total mismatch at the antenna pad without any damage, even when transmitting at maximum RF power. The RF interface has an impedance of 50Ω. M27 must be applied to 50 ohm load/ antenna, or else the output power will degrade seriously. Antenna supplier needs to ensure that the impedance of the operating frequency range is closed to 50Ω.
Table11.3. Gain Item Description 1 Average gain Requirement 0 dBi 0.5 dBi 2 3 Peak gain Measurement The gain deviation (Peak gain – minimum gain) of all angles in H-plane should be less than 4dB in low, middle and high channels. The higher gain in DCS/PCS band would be preferred. The same as the Table11.2 item2. measure the radiation pattern at the lowest, middle and highest frequency for each band. And it must be measured in Chamber, including XY, XZ and YZ planes. Table11.4.
11.2 Antenna Pad & Cable Soldering The antenna can be soldered to the antenna pad. For proper grounding connect the antenna to the ground plane on the bottom of M27 which must be connected to the ground plane of the application.(Fig.11.1) Notes on soldering: To prevent damage to the module and to obtain long-term solder joint properties you are advised to maintain the standards of good engineering practice for soldering.
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