User's Manual

ManualsBrandsQisda ManualsElectronicsMOD-SM Qisda BT/WLAN CWM-01

W50

WLAN / Blue to o th Wire le ss Mo dule

Re v. 1.0.0

2011/ 10/ 20

This document contains proprietary technical information which is the property of Qisda

Corporation and is issued in strict confidential and shall not be disclosed to others parties in

whole or in parts without written permission of Qisda Corporation.

The documents contain information on a product, which is under development and is issued

for customer evaluation purposes only.

Qisda may make changes to product specifications at any time, without notice.

Wire le ss Da ta Applic a tio n BD

Mo bile Co mm unic a tio ns BU

Q isda C o rpo ra tio n

18 Jihu Road, Nei-Hu, Taipei 114, Taiwan

Tel: +886-2-2799-8800

Fax: +886-2-2656-6398

http://Qisda.com

Summary of content (38 pages)

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W50 WLAN / Blue to o th Wire le ss Mo dule Re v. 1.0.0 2011/ 10/ 20 Copyright © 2010 Qisda Corporation. All rights reserved. This document contains proprietary technical information which is the property of Qisda Corporation and is issued in strict confidential and shall not be disclosed to others parties in whole or in parts without written permission of Qisda Corporation. The documents contain information on a product, which is under development and is issued for customer evaluation purposes only.
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Contents 1. REVISIO N HISTO RY ............................................................................................. 4 2. FUNC TIO NAL DESC RIPTIO N ............................................................................... 5 2.1. 3. 4. OVERVIEW ....................................................................................................................................... 5 2.2. PIN CONFIGURATION ...................................................................................
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4.2.5. 5. 6. 7. RF PERFORMANCE ........................................................................................................................ 16 MEC HANIC AL SPEC IFIC ATIO N........................................................................ 18 5.1. PACKAGE TYPE .............................................................................................................................. 18 5.2. PACKAGE DIMENSIONS ........................................................................
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1. Re visio n histo ry Ve rsio n VER: 0.0.1 Da te 2011/12/2 No te s Preliminary version - 4- Ve rsio n: 0.0.
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2. Func tio na l de sc riptio n 2.1. Overview This chapter provides a short overview over the most important functions and features of the module. This data sheet is preliminary and will be changed if needed. The module is built on the Marvell® 88W8688 low-cost highly-integrated IEEE 802.11a/g/b MAC/Baseband/RF WLAN and Bluetooth Baseband/RF system-on-chip (SoC). The module supports IEEE 802.11g payload data rates of 6, 9, 12, 18, 24, 36, 48, and 54 Mbps, as well as 802.11b data rates of 1, 2, 5.
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2.2. Pin C o nfig ura tio n 35 30 GND GND VCC_3V0 GND VCC_3V3 VCC_3V3 VCC_1V8 GND SD_CLK SD_CMD SD_DATA[1] SD_DATA[0] SD_DATA[3] 40 45 UART_CTS SD_DATA[2] GND UART_RTS UART_RX UART_TX 2.2.1.
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6 BT_PCM_DOUT O VIO_X2 Bluetooth PCM Data Out 4 BT_PCM_DIN I VIO_X2 Bluetooth PCM Data In 52 RESETn I VIO_X1 Shut down BT/WLAN IC (active low, internal 10 kOhm pull-down) POWER_DOWNn I - Shut down internal 1V8 LDO (active low, internal 10 kOhm pull-down) I VIO_X1 Clock Input for External Sleep Clock CONTROL 50 47 CLOCK SLEEP_CLK 11 JTAG_TCK I VIO_X2 JTAG Test Clock Input 12 JTAG_TDI I VIO_X2 JTAG Test Data Input JTAG_TDO O VIO_X2 JTAG Test Data Output JTAG_TRSTn I VI
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34 VCC_1V8 O - internal 1V8 voltage regulator, for test purpose, leave unconnected 53 VCC_BT_ANT_DIAG I - Supply for BT antenna diagnose circuit 20 VCC_WLAN_ANT_DIAG I - Supply for WLAN antenna diagnose circuit GND - - Ground 1,3,8, 10,16, 18,21, 22,25, 27,28, 30,31, 35,42 *) The antenna diagnose functionality is supported only when antenna has a DC path with 51K Ohm resistance to ground. - 8- Ve rsio n: 0.0.
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3. Te c hnic a l De sc riptio n 3.1. Ra dio Fe a ture s 3.1.1. RF po rt For WLAN and Bluetooth, the module provides single ended, 50 ohm matched bidirectional ports. The RX / TX switches are incorporated either in module or in 88W8688 chip. 3.1.2. RF Blue to o th The RF part of Bluetooth has a balun for transforming the differential RF port of 88W8688 to single ended port of module. The balun is also used for powering internal PA / LNA with 1, 8V supply.
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3.2.1. Ma in c lo c k The local oscillator and digital clocks are generated from crystal. The crystal is tuned during production process and tune values are stored in on board E2PROM. 3.2.2. Sle e p c lo c k The sleep clock is delivered from a external 32 kHz oscillator. This clock as from external source is required for Bluetooth low power mode applications. 3.3. Sta rt up a nd Re se t A low level at POWER_DOWNn pin turns off internal 1V8 LDO, but 3V0 band gap reference remain on.
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3.1 po we ring 3.3.2. Re se t After powering the IC correctly, it can be anytime reset by pulling down of signal RESETn for at least 5 ms (Pic 3.1). The reset by POWER_DOWNn-RESETn sequence is also possible. In this case the duration of POWER_DOWNn should be at least 700 ms. 3.2 Re se t b y RESETn - 11 - Ve rsio n: 0.0.
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3.3 Re se t b y RESETn a nd PO WER_DO WNn 3.4. Ante nna dia g no se c irc uit The picture below shows the principle of antenna diagnose circuit. Requirement for functionality of circuit is that the external antenna has a internal DC path to ground with real impedance value of 51K Ohm. This impedance builds with in module built-in resistor of 51K Ohm a voltage divider.
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3.5. Po we r supply 3.5.1. Ma in po we r All for functionality necessary power supplies are generated by into module integrated 1.8 V LDO, 1V and 3.0 V band gap reference. The digital core supply of 1,2V is generated by in 88W8688 integrated LDO powering external voltages VCC_VIO_X1/2 VCC_3V3 are turned on. For correct functionality the start-up timing below has to follow. An additional reset isn’t necessary. The VCC_VIO_X1 and X2 can be turned on before VCC_3V3 but latest concurrently with it.
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3.4 Po we r supply struc ture 3.5.2. Supply o f I/ O pins The I/O pins are grouped in two supply domains: VCC_VIO_X1 and VCC_VIO_X2. Basically each domain can be powered either from 1,8V or 3,3V, but in circuits used E2PROM can’t be powered by dual voltage. So supply of the VCC_VIO_X2 domain is specified by E2PROM chip. The supply for VCC_VIO_X2 can be chosen at ordering. The supply for VCC_VIO_X1 can be free chosen. 3.5.3.
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4. Ele c tric a l spe c ific a tio n 4.1. Ab so lute m a xim um ra ting s Symbol Parameter Min. Max. Units VIO_X1 Power supply voltage with respect to VSS 0 2.3 V 0 4.2 V VIO_X2 Power supply voltage with respect to VSS 0 2.3 V 0 4.2 V 3V3 Power supply voltage with respect to VSS 0 3.45 V -40 +85 ℃ Typ. Max. Units +85 ℃ Storage temperature Tstg 4.2. O pe ra ting c o nditio ns 4.2.1. Enviro nm e nta l c o nditio ns Symbol Parameter Min.
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4.2.3. Dig ita l pins Symbol Parameter VCC_VIO Min. Typ. Max. Units POWER_ DOWNn Power Down input, High - 1.4 - 5.5 V Power Down input, Low - -0.3 - 0.5 V Vin Input high voltage 1.8 1.2 - V18+0.3 V 3.3 2.3 - V33+0.3 V Vin Input low voltage 1.8 -0.3 - 0.6 V 3.3 -0.3 - 1.1 V Vout Output high voltage 1.8 1.22 - - V 3.3 2.57 - - V Vout Output low voltage 1.8 - - 0.4 V 3.3 - - 0.4 V 4.2.4.
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Pa ra m e te r Ite m s Spe c ific a tio ns Channel 79 Carrier Spacing 1 MHz separation Duplexing Time Division Duplex Hopping Rate 1600 hops/per second Symbol Rate 1 Mbps (GFSK) 2 Mbps (π/4-DQPSK) 3 Mbps (8DPSK) Modulation GFSK BT =0.5 π/4-DQPSK 8DPSK 4.2.5.2 WLAN Ra dio C ha ra c te ristic s Pa ra m e te r Ite m s Spe c ific a tio ns Frequency Band 2.4000~2.4835Ghz (2.
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Pa ra m e te r Ite m s Spe c ific a tio ns PER <10%, Rx Sensitivity @ 6.0 Mbps: -88dBm PER <10%, Rx Sensitivity @ 54.0 Mbps: -72dBm 802.11g Mode Sensitivity 5. Me c ha nic a l spe c ific a tio n 5.1. Pa c ka g e Type 54pin LGA, 1,6mm pitch 5.2. Pa c ka g e dim e nsio ns Figure 3 : Package dimensions Parameter Description Min. Typ. Max. Units A Height 0.15 21 0.15 mm B Width 0.15 30 0.3 mm C Thickness 0.2 4 0.15 mm D Pin to Pin Pitch tbd 1.6 tbd mm - 18 - Ve rsio n: 0.0.
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E Edge to Pin tbd 0.9 tbd mm F Edge to Pin tbd 3.6 tbd mm G Pin Width tbd 1 tbd mm 5 g Weight - 19 - Ve rsio n: 0.0.
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6. La b e ling a nd o rde ring info rm a tio n 6.1. Pro duc t la b e l 2 Product Labels of W50 have been placed on Shielding Frame and Shielding Case. For more information about the W50 Product Labels, please refer to the below 6.1.1 and 6.1.2. 6.1.1. Shie lding Fra m e C o ve r La b e l The Label type of W50 Shielding Frame cover label is a 2D-Code Label with 9 * 9 mm dimensions. The P/N has been defined as 4E.1HR02.001. The 2D-Code digits have been defined as below: 1st digit: Present the 2D-Code type.
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B. P/N: Present the Harman PCBA Part Number. C. S/N: Present the Harman Serial Number. D. EC: Present the Engineering Changer Number. 2D Ba rc o de De finitio n (1/ 3) xxx 1 xxxxxxxx xx 01 Qisda Harman Supplier Serial EC Harman PCBA Fixed Desc. Code No. Level Module No. Part. No.
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tion Materials, Packing Materials, Labels, and Taps. For more information about the illustration of W50 packaging materials, please refer to the Figure 1 and Figure 2. Table 1 W50 Packaging table Type 1. Humidity Protection Materials 2. Packing Materials 3. Labels Q isda P/ N Pa c ka g ing Fig ure No . Aluminum Bag L460 * W410 * T0.15 mm ALUMINUM BAG GW50 4G.1HR01.00 1 8 Humidity Indicator CARD HUMIDITY INDICATOR GP 4J.G3501.002 9 DESICCANT BAG DESICCANT BAG 68*89 3H.09005.
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Figure 1 W50 Packaging 1/2 Figure 2 W50 Packaging 2/2 - 23 - Ve rsio n: 0.0.
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7.2. Pa c king Ma te ria ls 7.2.1. Hum idity Pro te c tio n Ma te ria ls 7.2.1.1. Alum inum Ba g : The L460*W410*T0.15 mm dimensions Aluminum bag is prepared for the W50 module vacuum packing on the Humidity protection purpose. The P/N has been defined as 4G.1HR01.001. Please see the below illustration and picture for the W50 Aluminum bag: - 24 - Ve rsio n: 0.0.
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7.2.1.2. Hum idity Indic a to r: The L102*W38 mm dimensions Humidity Indicator is prepared for including in the W50 Aluminum Bag on the Humidity Inspection purpose. The P/N has been defined as 4J.G3501.002. Please see the below illustration and picture for the W50 Humidity Indicator: 湿度卡图.jpg - 25 - Ve rsio n: 0.0.
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7.2.1.3. De sic c a nt: The L89*W68 mm dimensions and Mineral Bentonite inside Desiccant is prepared for the W50 module packaging on the Humidity prevention purpose. The P/N has been defined as 3H.09005.001. Please see the below illustration and picture for the W50 Desiccant: - 26 - Ve rsio n: 0.0.
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7.2.2. Pa c king Ma te ria ls 7.2.2.1. Re e l: The 13” dimension and PS Black Reel is prepared for the W50 module packaging, met to ESD standard Ohm: 10^7Ω~10^11Ω and EIA-471-D. The P/N has been defined as 4B.1HR02.002. Please see the below illustrations and pictures for the W50 Reel: 7.2.2.2. Pizza Bo x: The L356*W344*T61mm dimensions and B Flute Pizza Box is prepared for the W50 Reel(with Aluminum Bag) inside. The P/N has - 27 - Ve rsio n: 0.0.
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been defined as 4D.1HR01.001. Please see the below illustration and pictures for the W50 Pizza Box: - 28 - Ve rsio n: 0.0.
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7.2.2.3. C a rto n: The L355*W340*T384mm dimensions and AB/F Carton is pre- pared for the 5 Pizza Boxes inside. The P/N has been defined as 4D.1HR02.001. Please see the below illustration and picture for the W50 Carton: 7.2.3. La b e ls 7.2.3.1. O O B La b e l: 4 O O B La b e ls o n Re e l, Alum inum Ba g , Pizza Bo x a nd C a r- - 29 - Ve rsio n: 0.0.
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to n a re pla c e d fo r the W50. Fo r m o re info rm a tio n a b o ut the W50 O O B La b e ls, ple a se re fe r to the b e lo w de sc riptio n. The W50 O O B La b e l o n Re e l with 100 * 50 mm dimensions defined as 4E.1HR01.001. Please see the below picture illustration and detail information. Ite m C o nte nt Re m a rk Reel ID R+Year+Month+SN SN is from 0001~9999 PIO No Defined by Harman, will be Ex.
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Ite m C o nte nt Re m a rk General MOD-SM Qisda Add sample build status, Desc. BT/WLANCWM-01.C1A Ex.C1a.EVT3-2/C1b.EVT3-3/C3.EVT3-4 Q’ty 400 400 pcs for each Reel EC Started at 03 and be up- EVT 3-2(C1a): EC05/ 3-3 (C1b): EC06/ dated by every pilot run EC07 3-4(C3): DVT (D1a/b): EC08/ (D2): EC09 FCC ID VRSGW50 The W50 O O B La b e l o n Alum inum Ba g with 100 * 50 mm dimensions defined as 4E.1HR01.001. Please see the below picture illustration and detail information.
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Ite m C o nte nt Lot No Re m a rk L+Year+month+SN (a) 5 Pizza boxes are in 1 Lot. (b) SN is from 0001~9999 Ex. L2011040001 Model No GW50 Qisda Model No. Harman Part Defined by Harman, will be C1b sample:2318091 No changed for each shipment C3/D1 sample:2321122 D2 sample :2357720 Part No. 9J.1HR01.001 Qisda Part No. General MOD-SM Qisda Add sample build status, Desc. BT/WLANCWM-01.C1A Ex.C1a.EVT3-2/C1b.EVT3-3/C3.
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Ite m C o nte nt Re m a rk Box ID B+Year+Month+SN SN is from 0001~9999 Ex. B2011040001 PIO No Defined by Harman, will be changed for each shipment Lot No L+Year+month+SN (a) 5 Pizza boxes are in 1 Lot. (b) SN is from 0001~9999 Ex. L2011040001 Model No GW50 Qisda Model No. Harman Defined by Harman, will be C1b sample:2318091 Part No changed for each shipment C3/D1 sample:2321122 D2 sample : 2357720 Part No. 9J.1HR01.001 Qisda Part No.
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Ite m C o nte nt Re m a rk DVT (D1a/b): EC08/ (D2): EC09 FCC ID VRSGW50 The W50 O O B La b e l o n C a rto n with 100 * 50 mm dimensions defined as 4E.1HR01.001. Please see the below picture illustration and detail information. Ite m C o nte nt Re m a rk Carton ID C+Year+Month+SN SN is from 0001~9999 Ex. C2011040001 PIO No Defined by Harman, will be changed for each shipment Lot No L+Year+month+SN (a) 5 Pizza boxes are in 1 Lot.
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Ite m C o nte nt Re m a rk ment (c ) D2 sample : 02357720 Part No. 9J.1HR01.001 Qisda Part Number General MOD-SM Qisda BT/WLAN Add sample build status as “XX” Desc. CWM-01.CXX Ex.C1A=EVT3-2/C1B=EVT3-3/ C3=EVT3-4 Q’ty Depend on shipment Q’ty 400 pcs for 1 Reel, Max Q’ty is 2000 pcs for each Carton EC FCC ID Start from 03 and be up- EVT 3-2(C1a): EC05/ 3-3 (C1b): EC06/ 3-4(C3): EC07 dated by every pilot run DVT (D1a/b): EC08/ (D2): EC09 VRSGW50 7.2.3.2.
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pared for the ESD Indicator purpose. The P/N has been defined as 4E.G3503.00. Please see the below illustration and picture for the W50 Caution Label: 7.2.4. Ta pe s: The 400 pcs W50 of per Reel with PS Black Cover and Carrier Tapes are prepared for the W50 Module packaging, met to ESD standard Ohm: 10^4Ω~10^6Ω and EIA-481-D. The P/N has been defined as Cover Tap-4B.1HR01.001 and Carrier Tap-4B.1HR03.001.
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7.3. Shipm e nt, sto ra g e a nd ha ndling The W50 Shipment, Storage and Handling are based and acting on per Carton with 5 Pizza Box packages and 2,000 pcs W50 inside. 8. C e rtific a tio ns 8.1. FCC Regulations: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
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Changes or modifications not expressly approved by the party responsible for compliance could void the user‘s authority to operate the equipment. RF Exposure Information This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of §2.1091.