Technical Specifications

Bond
®
brand XP
®
Gypsum
Board or Gold Bond
®
brand
eXP
®
Interior Extreme
®
Gypsum Panels, the XP
system achieves a score of
10 for ASTM D 3273 and 0
for ASTM G 21 - a complete
wall system with enhanced
resistance to mold.
ADVANTAGES
Resists the growth of mold per
ASTM G 21 with a score of 0,
the best possible score.
Resists the growth of mold per
ASTM D 3273 with a score of
10, the best possible score.
Hardens quickly and easy
to sand, allowing faster joint
finishing.
Lightweight formula is 30%
lighter than conventional
ProForm Setting Joint
Compound.
Low shrinkage.
Greater joint strength with
exceptional bond.
Not affected by humidity and
moisture when hardened and
dried.
Permits same-day joint
finishing.
Available in 5, 20, 45, 90
and 210 minute set times for
greater flexibility.
09 29 00
PROFORM
®
brand QUICK SET
LITE SETTING COMPOUND
09 29 00
Job Name _______________________________________________________
Contractor ______________________________________ Date ____________
Submittal Approvals: (Stamps or Signatures)
ProForm
®
is a registered trademark of National Gypsum Properties, LLC.
MANUFACTURER
National Gypsum Company
2001 Rexford Road
Charlotte, NC 28211
(704) 365-7300
Technical Information:
1-800-NATIONAL
(1-800-628-4662)
Fax: 1-800-FAX NGC1
(1-800-329-6421)
Internet Home Page:
nationalgypsum.com
nationalgypsum.com/espanol
09 29 00/NGC BuyLine: 1100
DESCRIPTION
ProForm
®
brand Quick Set
Lite Setting Compound is
a quick setting/hardening
compound that is 30% lighter
than conventional setting
compound, can be easily
sanded and requires less time
and effort to work.
BASIC USES
Quick Set Lite Compound
provides a lightweight, easy
to sand finish for fast, smooth
joint finishing.
Quick Set Lite is specially
formulated to provide
excellent joint strength, even
in poor drying conditions.
Quick Set Lite permits heavy
fills and faster joint finishing
with low shrinkage.
Quick Set Lite is compatible
with all types of gypsum
board and may be used
where a shortened joint
finishing schedule is desired.
Quick Set Lite is used as a
prefill material for gaps in
gypsum board construction
that are wider than
recommended and also in
voids in above-grade interior
concrete.
MOLD RESISTANCE
Quick Set Lite Compound offers
superior mold resistance
and achieves the highest
mold resistant scores on
industry tests. When tested
in a system with ProForm
®
brand Paper Joint Tape, Gold
Excellent for all phases of
finishing, including taping,
finishing, filling, patching,
skimming, laminating and even
texturing.
Contains no VOC.
GREENGUARD CERTIFIED
ProForm Quick Set Lite Setting
Compound has achieved
GREENGUARD Gold
Certification.
LIMITATIONS
Not to be applied over moist
surfaces or surfaces subject to
moisture.
Do not mix with any other
material. Use only clean,
drinkable water.
Mixing equipment and tools
must be thoroughly cleaned
between batches.
Each fresh batch of
compound must be kept
free of previous batches;
otherwise, the working life
will be shortened.

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