User's Manual
Table Of Contents
- 1. Introduction
- 2. Product profile
- 3. General description
- 4. Features
- 5. Ordering information
- 6. Functional description
- 7. Application design-in information
- 8. Application information
- 9. Recommended operating conditions
- 10. Limiting values
- 11. Characteristics
- 12. Static characteristics
- 13. Dynamic characteristics
- 14. Thermal characteristics
- 15. Handling information
- 16. Soldering
- 17. Mounting
- 18. Marking
- 19. Packing information
- 20. Package outline
- 21. Support information
- 22. Test information
- 23. Safety instructions
- 24. Appendix
- 25. Abbreviations
- 26. Glossary
- 27. References
- 28. Legal information
ATOP Preliminary Specification © NXP B.V. 2012. All rights reserved.
Preliminary Specification Rev. 0.75 — 14th August 2012 34 of 42
NXP Semiconductors
OM12001 (ATOP)
Telematics
19. Packing information
OM12001 (ATOP) modules are packed in trays. Before packing and shipping, trays have
been dry baked for 16 hours at 125°C, according to IPC/JEDEC J-Std-033B.1.
OM12001 (ATOP) has been tested according to IPC/JEDEC J-STD 020D and is classified
as Moisture Sensitivity Level 3 (MSL3).
20. Package outline
ATOP presents itself as a 33x33x3.35 mm module. Ball size is 0.8 mm with a 1.6mm pitch.