User's Manual
Table Of Contents
- 1. Introduction
- 2. Product profile
- 3. General description
- 4. Features
- 5. Ordering information
- 6. Functional description
- 7. Application design-in information
- 8. Application information
- 9. Recommended operating conditions
- 10. Limiting values
- 11. Characteristics
- 12. Static characteristics
- 13. Dynamic characteristics
- 14. Thermal characteristics
- 15. Handling information
- 16. Soldering
- 17. Mounting
- 18. Marking
- 19. Packing information
- 20. Package outline
- 21. Support information
- 22. Test information
- 23. Safety instructions
- 24. Appendix
- 25. Abbreviations
- 26. Glossary
- 27. References
- 28. Legal information
ATOP Preliminary Specification © NXP B.V. 2012. All rights reserved.
Preliminary Specification Rev. 0.75 — 14th August 2012 32 of 42
NXP Semiconductors
OM12001 (ATOP)
Telematics
• 0.8 mm for the outer pads
The recommendation for the stencil thickness is 150 µm.
18. Marking
Figure 12 shows label present on the module.
5.G7-G13, H7-H13, J7, J8, J12, J13, K7, K8, K12, K13, L7, L8, L12, L13, M7-M13, N7-N13
Fig 11. Stencil design