Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 0 kPa up to 3.92 kPa SMD

MP3V5004G

Rev 2, 06/2010

Freescale Semiconductor

Pressure

Integrated Silicon Pressure Sensor,

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MP3V5004G series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of

applications, but particularly those employing a microcontroller or

microprocessor with A/D inputs. This sensor combines a highly sensitive

implanted strain gauge with advanced micromachining techniques, thin-film

metallization, and bipolar processing to provide an accurate, high level

analog output signal that is proportional to the applied pressure.

Features

• Temperature Compensated from 10°C to 60°C

• Available in Gauge Surface Mount (SMT) Configuration

• Durable Thermoplastic (PPS) Package

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device Marking

None Single Dual Gauge Differential Absolute

Small Outline Package (MP3V5004 Series)

MP3V5004GC6U

Rail

482A

• •

MP3V5004G

MP3V5004GC6T1

Tape & Reel

482A

• •

MP3V5004G

MP3V5004DP

Trays 1351

• •

MP3V5004DP

MP3V5004GVP

Trays

1368

• •

MP3V5004GV

MP3V5004GP

Trays

1369

• •

MP3V5004GP

MP3V5004G

0 to 3.92 kPa (0 to 400 mm H

0.6 to 3.0 V Output

Series

MP3V5004GVP

CASE 1368

MP3V5004GP

CASE 1369

MP3V5004GC6U/6T1

CASE 482A

MP3V5004DP

CASE 1351

SMALL OUTLINE PACKAGES

Typical Applications

• Washing Machine Water Level

• Ideally Suited for Microprocessor or

Microcontroller-Based Systems

Summary of content (14 pages)

PAGE 1
Pressure Freescale Semiconductor MP3V5004G Rev 2, 06/2010 Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MP3V5004G Series 0 to 3.92 kPa (0 to 400 mm H2O) 0.6 to 3.0 V Output The MP3V5004G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 3.92 400 kPa mm H2O Supply Voltage(1) VS 2.7 3.0 3.3 VDC IS — — 10 mAdc VFSS — 1.8 — V Offset(3) (4) VOFF 0.45 0.6 0.75 V Sensitivity V/P — 0.6 5.9 — V/kPa mV/mm H2O — — — — — — ±1.5 ±2.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) PMAX 16 kPa Storage Temperature TSTG –30 to +100 °C TA 0 to +85 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 4
Pressure On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482A). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
PAGE 5
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Part Number Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below.
PAGE 6
Pressure PACKAGE DIMENSIONS –A– D 8 PL 0.25 (0.010) 4 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.
PAGE 7
Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 7
PAGE 8
Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G 8 Sensors Freescale Semiconductor
PAGE 9
Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 9
PAGE 10
Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G 10 Sensors Freescale Semiconductor
PAGE 11
Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 11
PAGE 12
Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MP3V5004G 12 Sensors Freescale Semiconductor
PAGE 13
Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 13
PAGE 14
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.