DISCRETE SEMICONDUCTORS DATA SHEET BFS19 NPN medium frequency transistor Product data sheet Supersedes data of 1999 Apr 15 2004 Jan 05
NXP Semiconductors Product data sheet NPN medium frequency transistor BFS19 FEATURES PINNING • IC(max) = 25 mA PIN • VCEO(max) = 20 V. APPLICATIONS DESCRIPTION 1 base 2 emitter 3 collector • Medium frequency applications in thick and thin-film circuits. DESCRIPTION handbook, halfpage NPN medium frequency transistor in a SOT23 plastic package. 3 3 1 MARKING MARKING CODE(1) TYPE NUMBER BFS19 1 2 2 F2* Top view MAM255 Note 1. * = p : Made in Hong Kong. * = t : Made in Malaysia.
NXP Semiconductors Product data sheet NPN medium frequency transistor BFS19 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX.
NXP Semiconductors Product data sheet NPN medium frequency transistor BFS19 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient VALUE UNIT 500 K/W note 1 Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER collector cut-off current CONDITIONS MIN. TYP. MAX.
NXP Semiconductors Product data sheet NPN medium frequency transistor BFS19 PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.
NXP Semiconductors Product data sheet NPN medium frequency transistor BFS19 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.
