Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsBJTs & IGBTsTransistor

1. Product profile

1.1 General description

NPN general-purpose double transistors in a small SOT143B Surface-Mounted

Device (SMD) plastic package.

1.2 Features and benefits

 Low current (max. 100 mA)

 Low voltage (max. 30 V and 6 V)

 AEC-Q101 qualified

 Small SMD plastic package

1.3 Applications

 General-purpose switching and amplification

 For use in Schmitt trigger applications

1.4 Quick reference data

BCV63; BCV63B

NPN general-purpose double transistors

Rev. 4 — 4 August 2010 Product data sheet

Table 1. Product overview

Type number Package PNP complement

NXP JEITA

BCV63 SOT143B - -

BCV63B BCV64B

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per transistor

collector current - - 100 mA

Transistor TR1

CEO

collector-emitter voltage open base - - 30 V

DC current gain V

=5V; I

=2mA

BCV63 110 - 800

BCV63B 200 - 450

Summary of content (12 pages)

PAGE 1
BCV63; BCV63B NPN general-purpose double transistors Rev. 4 — 4 August 2010 Product data sheet 1. Product profile 1.1 General description NPN general-purpose double transistors in a small SOT143B Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number BCV63 Package PNP complement NXP JEITA SOT143B - BCV63B BCV64B 1.2 Features and benefits     Low current (max. 100 mA) Low voltage (max. 30 V and 6 V) AEC-Q101 qualified Small SMD plastic package 1.
PAGE 2
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors Table 2. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit - - 6 V BCV63 110 - 800 BCV63B 200 - 450 Transistor TR2 VCEO DC current gain hFE [1] collector-emitter voltage open base VCE = 700 mV; IC = 2 mA [1] Group selection will be done on TR1. Due to matched dies, hFE values for TR2 are the same as for TR1. 2. Pinning information Table 3.
PAGE 3
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
PAGE 4
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors 7. Characteristics Table 8. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit collector-base cut-off current VCB = 30 V; IE = 0 A - - 15 nA VCB = 30 V; IE = 0 A; Tj = 150 C - - 5 A VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA - 75 300 mV VBEsat base-emitter saturation voltage IC = 10 mA; IB = 0.
PAGE 5
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors mgt727 600 VBE (mV) 1000 hFE (1) 500 mgt728 1200 (1) 400 800 (2) (2) 300 600 200 400 (3) (3) 100 200 0 10−1 1 10 102 0 10−2 103 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 C (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C (3) Tamb = 150 C Fig 1. BCV63B: DC current gain as a function of collector current; typical values mgt729 104 Fig 2.
PAGE 6
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors 8. Application information Rc Rc 1 R1 2 4 3 Vo TR1 TR2 R2 3 Vi mgd829 Fig 5. Schmitt trigger application 9. Test information 9.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
PAGE 7
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors 10. Package outline 3.0 2.8 1.1 0.9 1.9 4 2.5 2.1 3 0.45 0.15 1.4 1.2 1 2 0.88 0.78 0.48 0.38 0.15 0.09 1.7 Dimensions in mm Fig 6. 04-11-16 Package outline SOT143B 11. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.
PAGE 8
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors 12. Soldering 3.25 0.6 (3×) 0.5 (3×) 1.9 solder lands 0.7 0.6 (3×) (3×) solder resist 2 solder paste 3 occupied area 0.7 0.6 Dimensions in mm 0.75 0.95 0.9 1 Fig 7. sot143b_fr Reflow soldering footprint SOT143B 4.45 2.2 1.2 (3×) 1.425 (3×) solder lands solder resist 4.6 2.575 occupied area Dimensions in mm 1.425 preferred transport direction during soldering 1 1.2 Fig 8.
PAGE 9
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors 13. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BCV63_63B v.4 20100804 Product data sheet - BCV63_BCV63B_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • • • • • • Legal texts have been adapted to the new company name where appropriate.
PAGE 10
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
PAGE 11
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.
PAGE 12
BCV63; BCV63B NXP Semiconductors NPN general-purpose double transistors 16. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . .