DISCRETE SEMICONDUCTORS DATA SHEET M3D891 BOTTOM VIEW 1PS10SB82 Schottky barrier diode Product data sheet 2003 Aug 20
NXP Semiconductors Product data sheet Schottky barrier diode 1PS10SB82 FEATURES DESCRIPTION • Low forward voltage An epitaxial Schottky barrier diode encapsulated in a SOD882 leadless ultra small plastic package. • Low diode capacitance • Leadless ultra small plastic package (1.0 mm × 0.6 mm × 0.5 mm) ESD sensitive device, observe handling precautions. • Boardspace 1.17 mm2 (approx. 10% of SOT23) • Power dissipation comparable to SOT23.
NXP Semiconductors Product data sheet Schottky barrier diode 1PS10SB82 ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS TYP. MAX. UNIT see Fig.2 IF = 1 mA − 340 mV IF = 30 mA − 700 mV rD differential diode forward resistance f = 1 MHz; IF = 5 mA; see Fig.5 12 − Ω IR continuous reverse current VR = 1 V; see Fig.3; note 1 − 0.2 μA Cd diode capacitance VR = 0 V; f = 1 MHz; see Fig.4 1 − pF Note 1.
NXP Semiconductors Product data sheet Schottky barrier diode 1PS10SB82 GRAPHICAL DATA MLE112 103 handbook, halfpage MLE113 103 handbook, halfpage IR (μA) IF (mA) 102 (2) (1) 102 (3) (1) 10 (2) 1 10 (3) 10−1 (1) (2) 1 (3) 0 0.4 0.8 1.2 VF (V) 10−2 1.6 0 5 (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. Fig.2 Fig.3 Forward current as a function of forward voltage; typical values. MLE114 1.
NXP Semiconductors Product data sheet Schottky barrier diode 1PS10SB82 PACKAGE OUTLINE Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm L SOD882 L 1 2 b e1 A A1 E D (2) 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) A1 max. b D E e1 L mm 0.50 0.46 0.03 0.55 0.47 0.62 0.55 1.02 0.95 0.65 0.30 0.22 Notes 1. Including plating thickness 2.
NXP Semiconductors Product data sheet Schottky barrier diode 1PS10SB82 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
