CNN0301IG001 HS 3001 Integration Guide Version: 1.
General TERMS OF USE OF NEW MATERIALS - PLEASE READ CAREFULLY From time to time, Novatel Wireless, in its sole discretion, may make available for download on its website (www.nvtl.com), or may transmit via mail or email, updates or upgrades to, or new releases of, the firmware, software or documentation for its products (collectively, 'New Materials').
Copyright © 2013 Novatel Wireless. All rights reserved. Complying with all applicable copyright laws is the responsibility of the user. Without limiting the rights under copyright, no part of this document may be reproduced, stored in or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying, recording or otherwise), or for any purpose, without the express written permission of Novatel Wireless.
Warranty Information [Revised: 11/11/2010] This warranty applies to (a) products sold directly by Novatel Wireless M2M, unless a different warranty is specified in a written agreement between Novatel Wireless M2M and the purchaser; and (b) products sold to end users through a distributor authorized by Novatel Wireless M2M, but only where the authorized distributor does not provide a separate warranty on such products, and Novatel Wireless M2M has agreed to provide this warranty to such end users.
available to purchaser), in which case the purchaser shall be responsible for paying Novatel Wireless M2M's cost for reshipping the product to purchaser (or to Novatel Wireless M2M's authorized distributor), and Novatel Wireless M2M's usual charges for unpacking, testing, and repacking the product for reshipment to purchaser (or to Novatel Wireless M2M's authorized distributor).
Novatel Wireless M2M'S SOLE RESPONSIBILITY AND PURCHASER'S SOLE REMEDY UNDER THIS LIMITED WARRANTY SHALL BE FOR Novatel Wireless M2M TO REPAIR OR REPLACE THE PRODUCT (OR IF REPAIR OR REPLACEMENT IS NOT POSSIBLE, PROVIDE A CREDIT OR REFUND OF THE PURCHASE PRICE) AS PROVIDED ABOVE.
Regulatory Compliance FCC CERTIFICATION Novatel Wireless M2M certifies that the Enabler HS 3001 CDMA Radio Module (FCC ID: MIVCNN0301) complies with the RF requirements applicable to broadband PCS equipment operating under the authority of 47 CFR Part 24, Subpart E and Part 22 Subpart H of the FCC Rules and Regulations.
l l l l l The antenna connected to the Enabler HS 3001 module must be installed to provide at least 20 cm separation from the human body at all times. The Enabler HS 3001 module and transmitter antennas must not be co-located with any other transmitter or antenna within a host device. The transmitter antenna used with the Enabler HS 3001 module must not exceed the following levels: l Band Class 0: the maximum gain is 2.2 dBi. l Band Class 1: the maximum gain is 8 dBi.
FCC NOTICE TO USERS Novatel Wireless M2M has not approved any changes or modifications to this device by the user. Any changes or modifications could void the users authority to operate the device. See 47 CFR Sec. 15.21. The device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. See 47 CFR Sec.
In order to use the Enabler HS 3001 module without any additional FCC certification the installation must meet the following conditions: l l l The system antenna(s) connected to the Enabler HS 3001 module must be installed to provide at least 20 cm separation from the human body during normal operation. The system antennas must not be co-located with any other transmitter or antenna.
Important Safety Information The following information applies to the devices described in this manual. Always observe all standard and accepted safety precautions and guidelines when handling any electrical device. l l l l Save this manual: it contains important safety information and operating instructions. Do not expose the HS 3001 product to open flames. Ensure that liquids do not spill onto the devices. Do not attempt to disassemble the product: Doing so will void the warranty.
l While operating a vehicle l The driver or operator of any vehicle should not operate a wireless data device. Doing so will detract from the driver or operator's control and operation of that vehicle. In some countries, operating such communication devices while in control of a vehicle is an offense. Disclaimer The information and instructions contained within this publication comply with all FCC, GCF, PTCRB, R&TTE, IMEI and other applicable codes that are in effect at the time of publication.
Table of Contents 1 Introduction 1 Technical Specifications 3 Reference Documents 5 Typical Usage 5 Contacting Novatel Wireless M2M 5 2 Module Power 6 Operating Power 7 Typical Input Current 7 3 Interfaces 8 Module Mounting To Host Board (Reference) 9 Mounting Tab Soldering Guidelines 12 Connectors 13 RF Board-to-Board Connector Option 13 I/O Connector Pin Assignments 13 Specific Absorption Rate (SAR) Guidelines 16 SAR Compliance 17 4 Hardware Design Guidelines 18 Advanced
Audio Schematics 27 Control Connector Signal Descriptions And Functions 29 Module Power (PINS 87, 89, 91, 93, 95, 97, 99) 29 Modem Power-on And Recovery Techniques 30 Power Switch Logic Detect (Pin 85) 30 ON/OFF (PIN 37) 30 Phone On - PON (PIN 35) 31 Internal Power Switch 32 Voltage Reference - VREG_MSME1.
USB Driver Installation (Windows 7) 48 - xiv -
1 Introduction Technical Specifications Reference Documents Typical Usage Contacting Novatel Wireless M2M -1-
The HS 3001 modem is a compact, wireless OEM module that uses the Code Division Multiple Access (CDMA) international communications standard to provide two-way wireless capabilities. The HS 3001 module is a fully approved CDMA device, enabling applicationspecific, two-way communication and control. The small size of the HS 3001 module allows it to integrate easily into the application and packaging.
Technical Specifications Housing l l Size (L x W x H): Weight: Application Interface 28.0 mm x 25.0 mm x 4.50 mm 4.13 grams l USB: VBUS: Mic Bias Out: Audio Mic Inputs: Ear Audio Out: l Headset Out L&R: l l l l Interfaces l Host Interface: Data input/output interface: l Primary serial port: l l USB port: l GPIO: Audio: Voice: l l l Antenna Interface: Command protocol: l Reference clock: l l ADC: UART2: l Logic: l Serial Interface 100 position 0.
Mechanical: Operational l Operational vibration Random IEC60068-2-64 / MILSTD-202G Method 214A 50-2000 Hz, 7.
Reference Documents l l l l CNN0301AT001 - HS 3001 AT Command Reference CNN0301TG001 - HS 3001 Transition Guide ENF0000SD001 - HDK Guide CNN0301AN001- Using Digital Audio on the HS 3001 Typical Usage The following applications can use the HS 3001 module for transmitting/receiving data/voice: l l l l l l l l l l Automated Meter Reading (AMR) Point of Sale Applications (POS) E-mail and Internet access Automated Vehicle Location (AVL) Machine to Machine communication (M2M) Telematics Telemetry Wireless Secu
2 Module Power Operating Power -6-
Operating Power The HS3001 module requires an in/out voltage of 3.4V to 4.4V. The supply ripple must be less than 25mV across all frequencies. Typical Input Current Typical Results @ 3.6 V, 20 deg C, with 1000 μF at connector input on VBAT and RF terminated into a 50 Ω resistive load. Traffic Data Rate: Full Band Mode Avg (mA) Peak (mA) Notes BC0 RC3, 3.6 V Max Power 23.5 dBm 540 590 BC0 RC3, 3.6 V, TX=0 dBm 180 180 BC1 RC3, 3.6 V Max Power 23.5 dBm 600 680 BC1 RC3, 3.
3 Interfaces Module Mounting to Host Board (Reference) Mounting Tab Soldering Guidelines Connectors RF Board-to-Board Connector Option I/O Connector Pin Assignments Specific Absorption Rate (SAR) Guidelines -8-
Figure 3-1 Pin 1 Reference, 100-Pin I/O Connector Module Mounting To Host Board (Reference) Solder the module to a PCB using the mounting tabs provided. These tabs provide circuit grounding for the module. Do not add solder paste to mounting pads, RF connector, or shield pads. The only portion recommended for thermal relief is along the outer edge of each pad, where you would place a soldering iron. The rest of the pad should be solid flood to the copper ground underneath the module.
Figure 3-2 Host Board Layout - 10 -
Figure 3-3 Host Pads for Board-To-Board RF Connector - 11 -
Mounting Tab Soldering Guidelines Do not apply excessive solder during module mounting. Solder bridging to internal components can occur if you use an overly large iron tip and hold it against the vertical shield walls while applying solder at the junction between the iron and the module. Coverage of the outer ¾ of the tab is sufficient for securing the module.
Connectors On the Modem: 100-Pin I/O Connector, Plug, SMT, Dual Row, 0.4 mm Pitch l l Novatel Wireless M2M PN = CON-1040-0100 Molex PN = 55909-1074 On the Host: 100-Pin I/O Connector, Socket, SMT, Dual Row, 0.4 mm Pitch (Mate to module) l l Novatel Wireless M2M PN = CON-1040-0101 Molex PN = 51338-1074 The mated height of the two connectors is 1.50 mm. RF Board-to-Board Connector Option On The Modem: Novatel Wireless M2M PN = CON-0009-0006 Sunridge PN = MCE-15A-G01 No connector required on the host PCB.
Pin Function Description Notes 14 PCM_CLK Digital Audio Clock 15 UART_RX UART1 RX (Output) 16 PCM_SYNC Digital Audio Interface Sync 17 UART_DTR Data Terminal Ready 18 PCM_DOUT Digital Audio I/F Data Out 19 UART_DCD Data Carrier Detect 20 Reserved N/A was GPIO 18 on GSM0308 21 UART_TX UART1 TX (input) was SPI_MOSI on GSM0308 22 Reserved N/A was GPIO 15 on GSM0308 23 UART_RING UART_RING 24 Reserved N/A 25 UART_DSR Data Set Ready 26 Reserved N/A was GPIO 14 on GSM0
Pin Function Description 43 Reserved N/A 44 ADC2 Analog In #2 45 Reserved N/A 46 Reserved N/A 47 HSDETECT Headset Detect 48 Reserved N/A 49 Reserved N/A 50 Reserved N/A 51 Reserved N/A 52 Reserved N/A 53 HSMICBIAS Headset Microphone Bias 54 GND Ground 55 HSMIC Microphone (+) 56 CLK32K_BUF Buffered 32.
Pin Function Description Notes 75 GND Ground 76 Reserved N/A 77 VRIO Reference Voltage (< 5 mA) for external interfaces 78 Reserved N/A 79 Reserved N/A 80 Reserved N/A 81 Reserved N/A 82 Reserved N/A was SIM IO on GSM0308 83 Reserved N/A was VBACKUP on GSM0308 84 Reserved N/A was SIM Detect on GSM0308 85 PSLOGIC Power Switch Logic Select was VBAT on GSM0308 86 GND Ground/Power Return/Shield 87 VBAT Power Input 88 GND Ground 89 VBAT Power Input 90 GND Gr
Portable Device Definition FCC defines as a transmitting antenna located at a distance ≤ 20cm from the user. Mobile Device Definition FCC defines as a transmitting antenna located at a distance ≥ 20cm from the user. SAR Compliance European and US certification bodies require that you test Specific Absorption Rate (SAR). SAR is a measure of energy absorbed by organic tissue over a specific time.
4 Hardware Design Guidelines Advanced Tips for an RF-Friendly Layout Audio Reference Design Control Connector Signal Descriptions and Functions Circuit Protection - 18 -
Use the following guidelines to successfully implement your PCB layout to obtain the best performance, the lowest possible EMI emissions, the maximum thermal conduction, the highest mechanical integrity, and the best voice quality. The HS 3001 module is a compact, high performance design, yet it is easy to interface into the final product. To experience its full potential, designers should pay close attention to ground structures, the routing of RF and Digital traces, and the size of the power supply lines.
Figure 4-1 Example of good ground plane for CDMA modules Thermal Relief Because the ground plane acts as a large heat sink, it can affect the solderability of components. A common method to reduce this effect is to use thermal relief around the pad in question. However, you must be careful when using thermal relief for high current or high frequency applications.
Figure 4-2 Example of a POOR RF Thermal Relief If thermal relief is necessary, use short, fat traces. This will still provide a solderable connection, while providing a better RF connection. Making the traces shorter also allows for a more continuous ground plane due to less copper being removed from the area. We also recommend that you have ground vias around all thermal relief of critical ground pins such as the five cellular shield tabs.
Figure 4-3 Example of a GOOD RF Thermal Relief Modem Mounting Tabs Soldering the tabs on the module is an important part of the assembly of the module and host board. The following figure shows an ideal ground structure for the tabs. One half of the pad is covered with a solid ground. This allows for a low impedance connection while still providing some thermal relief for the soldering process.
Figure 4-4 Modem Tabs - Ideal Ground Structure Antenna And RF Signal Trace The PCB trace that feeds the RF output port must be designed for a 50 ohm characteristic impedance. The RF trace should be coplanar, or routed into internal layers to keep the top layer continuous around and underneath the cellular module. Provide ample ground vias around the RF contacts, the RF trace, and launch pad. If possible, keep I/O and power traces away from the RF port.
The RF cable going between the cellular module and the antenna is very lossy; therefore, you should keep the length of this cable as short a possible. The following design parameters are for the coplanar microstrip between the Module RF compression pads and the U.FL style coaxial connector. The coplanar waveguide microstrip details are shown below.
Engineering Layer Stack-up And Impedance Layer Line Width/Space (mil) Control Impedance (Ω) L1 51.18/24 mil 50 ± 10% L1 1 oz +plating CORE 0.3 11.81mil L2 1 oz PP 3313 3.3003mil CORE 0.6 23.62mil PP 3313 3.3198mil L3 1 oz CORE 0.3 11.81mil L4 1 oz +plating Overlap THK: 1.47 mm Material : FR4 IT-180A Finish THK: 1.6 ± 0.16 mm Layer LW/LS(mil) Calculate Value (Ω) H1(mil)Er1 H2(mil)Er2 L1 55/22.09 mil ± 5% 50.6 (coplanar waveguide) 43.3 ± 5% 4.
Even the best layout will have some impedance from the source to the cellular module; therefore, sufficient bulk decoupling capacitance is required at the Vbat input to the cellular module. If necessary, you may use up to two 1000 µF, low ESR, tantalum capacitors to provide the desired decoupling. If used, the capacitors should be located very close to the cellular interface connector VBAT pins.
Audio Schematics - 27 -
Figure 4-6 Audio Reference Design Schematic - 28 -
Control Connector Signal Descriptions And Functions Unless otherwise noted in the following sections, all digital signals will reference the following specifications: Parameter Parameter/Conditions Comments MIN TYP MAX UNIT VIH High level Input voltage 1.17 1.83 V VIL Low level Input voltage -0.3 0.
Modem Power-on And Recovery Techniques The HS 3001 provides module integrators with improved modem power-on and recovery techniques, while maintaining backwards compatibility to Enabler IIIG integrations. The addition of an internal power switch and an input power-on logic select pin allows users the flexibility to maintain backwards compatibility or select different power-on options. This internal power switch also allows integrators the flexibility of not supplying an external power switch.
Pin 35 PON (Power On) is a signal input and is the normal method for turning the modem ON or OFF. However, Pin 35 cannot turn the modem on if Pin 37 is low, because the modem will not have power applied to it. offdly=0 only affects the powering off of the device, not power on. Parameter Min Enable Threshold Voltage 1.5 Enable Input Current 1.5 Typ Max VBAT Units V µA Pulldown approximately 1MΩ.
A falling-edge on this Active-Low input will switch-ON or switch-OFF the module. The firmware controlled OFF function will deregister the modem from the network before shutting the modem OFF. This input has a “weak pull-up” resistor internal to the module. If users want the modem to automatically come on when power is applied, they can tie this line low. If RTC Sleep is required, then the PON line must be floated to allow the internal resistor to pull the line high.
Voltage Reference - VREG_MSME1.8 (PIN 77) To be used as a voltage reference source ONLY. Do not connect current loads to this pin. When driving external circuitry, this pin should be decoupled to ground with at least a 0.1 µF capacitor at the output.This pin can be left open if not driving external circuitry. Noise induced on this pin will affect the performance of the baseband.
GPIO number Pin number GPIO 7 66 GPIO 8 72 Each general-purpose signal may be selected as inputs or outputs. The GPIOs can be used independently as a user-specified function. Digital I/O Specifications -Baseband Functions Parameter Comments Min Typ Max Units VIH High level input voltage CMOS / Schmitt 1.17 1.83 V VIL low level input voltage CMOS / Schmitt -0.3 0.
Serial Interfaces And Handshake (Pins 11, 13, 15, 17, 19, 21, 23, 25) The pin naming for TX/RX/RTS/CTS/DTR/DSR/DCD/RI is referenced as a DCE. The DTE device should match their input pins to the Novatel Wireless M2M outputs and vice-versa. Additionally, there are AT commands that may need to be executed in order to ensure proper operation. See the chart below.
l l Tying DTR (pin 17) and RTS (pin 11) to ground to “spoof” flow control will cause the modem to draw more current. We do not recommend leaving DTR (pin 17) and RTS (pin 11) unconnected. If you are not going to use these signals, do one of the following: n Pull up DTR (pin 17) and RTS (pin 11) through a 100K resistor; or n Tie RTS (pin 11) to CTS (pin 13), and tie DTR (pin 17) to DSR (pin 25) on the modem to loopback the signals. UART 2 (Pins 27, 29) UART2 supports RX and TX only.
within the module. Pin Name Pin Number Signal Direction Description PCM_RX 12 I Serial Data Input PCM_TX 18 O Serial Data Output PCM_CLK 14 IO Serial Clock I/O PCM_FSYNC 16 IO Frame Synchronization I/O 32 KHz Output (PIN 56) A 32.768 kHz signal is available as an output from the module. This signal should only be used as an input to a high impedance device. Additional loads or capacitance on the line may cause performance issues with the module. If the line is not used, leave floating.
Handset Microphone Input (PINS 65, 67) Parameter Test Conditions Min Typ Max Units Full scale input voltage voltage across either MIC 1P and MIC1N, MIC2P and MIC2N 0.89 1.00 1.
Headset Speaker Output Left And Right (PINS 57, 59) Parameter Test Conditions Min Typ Max Units Notes Both modes - HPH_LP and HPH_RN configured single ended, analog volume control = 0 dB DAC to HPH_LP and HPH_RN fullscale output f = 1.02 kHz, 0 dBm Output DC level, HPH_LP and Input = 0.999 dBm HRH_RN wih respect to VSS 0.531 0.595 0.668 Vrms 1.03 1.05 1.07 V 0.5 Ω 27.
Generally, ESD protection (typically TVS/Transzorb devices) should be added to all signals that leave the host board. This includes VBAT/VCC. Series resistors (typically 47 ohms) can also be added in series with data lines to limit the peak current during a voltage excursion. It is your responsibility to protect the module from electrical disturbances and excursions that exceed the specified operating parameters.
5 USB Driver Installation USB Driver Installation (Windows XP) USB Driver Installation (Windows 7) - 41 -
USB Driver Installation (Windows XP) These instructions illustrate how to correctly install the USB drivers in Windows XP using the Novatel Wireless M2M Driver Setup Utility. 1. Run the Novatel Wireless M2M Driver Setup Utility by double-clicking the Novatel Wireless M2MDriverSetup executable file. The Novatel Wireless M2M Driver Setup Utility Extraction window opens. Figure 5-1 Novatel Wireless M2M Driver Setup Utility Extraction Once the contents have been extracted to memory, the Welcome Window opens.
Figure 5-2 Novatel Wireless M2M Driver Setup Utility Welcome 2. To install the drivers, select Install. The Novatel Wireless M2M Driver Setup Utility Window opens.
Figure 5-3 Novatel Wireless M2M Driver Setup Utility Prepare System Window 3. Select Next to continue. The Novatel Wireless M2M Driver Setup Utility Installation Window opens while the system installs the drivers. 4. Disconnect any Novatel Wireless M2M devices. Previous drivers will be removed during this phase. During the installation, your computer's display may freeze and appear nonresponsive. If this occurs, allow the computer to continue working.
Figure 5-4 Novatel Wireless M2M Driver Setup Utility Installation Window Figure 5-5 Novatel Wireless M2M Driver Setup Utility Driver Installation 5. When prompted to install the device driver, select Next.
Figure 5-6 Novatel Wireless M2M Driver Setup Utility Driver Installation Progress You may see the following warning message: Figure 5-7 Windows Security Window - 46 -
6. Click Continue Anyway. When installation of the USB drivers is complete, the Completion window opens. Figure 5-8 Novatel Wireless M2M Driver Setup Utility Driver Install Completion Window 7. Click Finish. When the installation is complete, the list of attached devices will appear within the Attached Devices Window.
Figure 5-9 Novatel Wireless M2M Driver Setup Utility Attached Devices Window USB Driver Installation (Windows 7) These instructions illustrate how to correctly install the USB drivers in Windows 7 using the Novatel Wireless M2M Driver Setup Utility. 1. Run the Novatel Wireless M2M Driver Setup Utility by double-clicking the Novatel Wireless M2MDriverSetup executable file. The Novatel Wireless M2M Driver Setup Utility Welcome window opens.
Figure 5-10 Novatel Wireless M2M Driver Setup Utility Welcome Window Once the contents have been extracted to memory, the Driver Setup Window opens.
Figure 5-11 Novatel Wireless M2M Driver Setup Utility Preparation Window 2. To install the drivers, click Install. The Novatel Wireless M2M Driver Setup Utility Prepare System Window opens.
Figure 5-12 Novatel Wireless M2M Driver Setup Utility Installation Window 3. Select Next to continue. The Novatel Wireless M2M Driver Setup Utility Installation Window opens while the system installs the drivers. 4. Disconnect any Novatel Wireless M2M devices. Previous drivers will be removed during this phase. During the installation, your computer's display may freeze and appear nonresponsive. If this occurs, allow the computer to continue working.
Figure 5-13 Novatel Wireless M2M Driver Setup Utility Driver Installation 5. When prompted to install the device driver, select Next. Figure 5-14 Windows Security Window 6. Select Install this driver software anyway.
During the driver install phase, you may be prompted to continue or stop installation due to potential compatibility issues. Figure 5-15 Novatel Wireless M2M Driver Setup Utility Driver Install Completion Window When installation of the USB drivers is complete, the Completion window opens. 7. If there are no errors, click Finish. 8. If the status displays an issue, click Correct issues! 9. At the "OK to apply fix" prompt, click Yes.
Figure 5-16 Novatel Wireless M2M Driver Setup Utility Attached Devices Window Figure 5-17 Novatel Wireless M2M Driver Setup Utility Apply Fix Window When the installation is complete, the list of Attached Devices appears within the Novatel Wireless M2M Driver Setup Utility Attached Devices window.
Figure 5-18 Novatel Wireless M2M Driver Setup Utility Attached Devices Window - 55 -
