ME910G1 HW Design Guide 1VV0301593 Rev.
ME910G1 Hardware Design Guide APPLICABILITY TABLE PRODUCTS ME910G1-W1 ME910G1-WW ME910G1-WWV ME910G1-W3 1VV0301593 Rev.
ME910G1 Hardware Design Guide CONTENTS APPLICABILITY TABLE 2 CONTENTS 3 1. INTRODUCTION 8 Scope 8 Audience 8 Contact Information, Support 8 Symbol Convention 9 Related Documents 9 2. 3.
ME910G1 Hardware Design Guide 4. POWER SUPPLY 26 Power Supply Requirements 26 Power Consumption 27 Idle Mode 27 ME910G1-W1 Connected Mode 28 ME910G1-WW and ME910G1-WWV Connected Mode 29 ME910G1-W3 Connected Mode 29 General Design Rules 30 Electrical Design Guidelines of the Power Supply 30 4.3.1.1. +5V Source Power Supply Design Guidelines 30 4.3.1.2. +12V Source Power Supply Design Guidelines 31 4.3.1.3. Battery Source Power Supply Design Guidelines 32 5.
ME910G1 Hardware Design Guide 5.7.3.3. RS232 Level Translation 6. 51 General Purpose I/O 52 Using a GPIO as INPUT 53 Using a GPIO as OUTPUT 53 Indication of Network Service Availability 53 External SIM Holder 54 ADC Converter 54 Forced USB Boot 55 Antenna Tuner 55 GPIO 55 MIPI 56 RF SECTION 57 Antenna Requirements 57 PCB Design Guidelines 58 PCB Guidelines in Case of FCC Certification 59 6.1.2.1. Transmission Line Design 59 6.1.2.2. Transmission Line Measurements 60 6.1.2.
ME910G1 Hardware Design Guide 10. 11. 12. Drawing 68 APPLICATION PCB DESIGN 69 Recommended Footprint for the Application 69 PCB Pad Design 71 Recommendations for PCB Pad Dimensions 72 Thermal Performance 72 Stencil 73 Solder Paste 74 Solder Reflow 74 Inspection 75 PACKAGING 76 Tray 76 Reel 78 Carrier Tape Detail 78 Reel Detail 79 Packaging Detail 80 Moisture Sensitivity 80 CONFORMITY ASSESSMENT ISSUES 81 Approvals Summary 81 EMEA Approvals 82 EU RED 82 12.2.1.1.
ME910G1 Hardware Design Guide 12.3.1.4. FCC Antenna Info 86 12.3.1.5. FCC Labelling Requirements for the Host Device 87 Canada ISED 88 12.3.2.1. ISED Database 88 12.3.2.2. ISED Regulatory Notices 88 Brazil ANATEL 12.3.3.1. 91 ANATEL Regulatory Notices APAC Approvals 92 Taiwan NCC 92 12.4.1.1. NCC Regulatory Notices 92 Japan JRL/JTBL 12.4.2.1. 13.
ME910G1 Hardware Design Guide 1. INTRODUCTION Scope This document describes the electrical specifications, mechanical information, interface application, and manufacturing information of the Telit ME910G1 module. With the help of this document and other application notes or user guides, users can understand the Telit ME910G1 module well and quickly develop various products. Audience This document is intended system integrators who use the Telit ME910G1 module in their products.
ME910G1 Hardware Design Guide Symbol Convention Danger: This information MUST be followed, or catastrophic equipment failure or personal injury may occur. Warning: Alerts the user on important steps about the module integration. Note/Tip: Provides advice and suggestions that may be useful when integrating the module. Electro-static Discharge: Notifies the user to take proper grounding precautions before handling the product.
ME910G1 Hardware Design Guide 2. GENERAL PRODUCT DESCRIPTION Overview The ME910G1 module is a CATM/ NBIoT communication product that allows integrators to plan availability for lifecycle applications, highly recommended for new designs specified for worldwide coverage. The ME910G1-WWV product is fully voice capable, the digital audio interface make it suitable for applications such as voice enabled alarm panels, mHealth patient monitors and special phones such as those for the elderly or sensory-impaired.
ME910G1 Hardware Design Guide Product HW Rev ME910G1-W3 0.0 2G Band (MHz) LTE CATM1 NBIoT B1, B2, B3, B4, B5, B8, B12, B13, B14, B18, B19, B20, B25, B26, B27, B28, B66, B85, B8_39d* Table 2: Product Variants and Frequency Bands CS Voice VoLTE External Antenna Tuner Support Region N N Worldwide * See notes below Refer to “RF Section” for details information about frequencies and bands.
ME910G1 Hardware Design Guide • Telematics services • Road pricing • Pay-as-you-drive insurance • Stolen vehicles tracking • Internet connectivity Main Features Function Features Modem • • • • CATM and NBIoT technologies SMS support (text and PDU) Alarm management Real Time Clock Interfaces • • • • • USB 2.
ME910G1 Hardware Design Guide Band Mode Class RF power (dBm) Nominal* B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B85, B8_39d (LTE) CAT-M1 3 23 B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B85, B86, B8_39d (LTE) CAT-NB2 3 23 B71 (LTE) CAT-NB2 5 21 Table 5: Transmission Output power ME910G1-WW * Max output power tolerance range according to 3GPP TS 36.521-1 and 3GPP TS 51.
ME910G1 Hardware Design Guide RX Sensitivity ME910G1-W1 REFsens (dBm) Typical REFsens (dBm)* 3GPP limit CATM1 / Band1 -107.6 -102.7 CAT M1 / Band2 -108.0 -100.3 CAT M1 / Band3 -107.6 -99.3 CAT M1 / Band4 -107.8 -102.3 CAT M1 / Band5 -107.9 -100.8 CAT M1 / Band8 -107.8 -99.8 CAT M1 / Band12 -107.8 -99.3 CAT M1 / Band13 -108.0 -99.3 CAT M1 / Band18 -108.0 -102.3 CAT M1 / Band19 -108.0 -102.3 CAT M1 / Band20 -107.8 -99.8 CAT M1 / Band25 -108.0 - CAT M1 / Band26 -108.
ME910G1 Hardware Design Guide REFsens (dBm) Typical REFsens (dBm)* 3GPP limit CAT NB2 / Band20 -116.6 -108.2 CAT NB2 / Band25 -116.8 - CAT NB2 / Band26 -116.8 -108.2 CAT NB2 / Band28 -116.9 -108.2 CAT NB2 / Band66 -116.6 -108.2 CAT NB2 / Band71 -115.4 - CAT NB2 / Band85 -116.8 - Band Table 8: RX Sensitivity ME910G1-W1 * 3GPP TS 36.521-1 Release 15 Minimum performance requirement ME910G1-WW and ME910G1-WWV REFsens (dBm) Typical 3GPP REFsens (dBm)* 3GPP limit CATM1 / Band1 -106.
ME910G1 Hardware Design Guide REFsens (dBm) Typical 3GPP REFsens (dBm)* 3GPP limit CAT NB2 / Band2 -116.2 -108.2 CAT NB2 / Band3 -116.4 -108.2 CAT NB2 / Band4 -115.6 - CAT NB2 / Band5 -116.5 -108.2 CAT NB2 / Band8 -115.9 -108.2 CAT NB2 / Band12 -116.6 -108.2 CAT NB2 / Band13 -116.8 -108.2 CAT NB2 / Band18 -116.6 -108.2 CAT NB2 / Band19 -116.4 -108.2 CAT NB2 / Band20 -116.0 -108.2 CAT NB2 / Band25 -116.2 - CAT NB2 / Band26 -116.1 -108.2 CAT NB2 / Band28 -116.8 -108.
ME910G1 Hardware Design Guide REFsens (dBm) Typical REFsens (dBm)* 3GPP limit CAT M1 / Band5 -106.7 -100.8 CAT M1 / Band8 -107.0 -99.8 CAT M1 / Band12 -106.7 -99.3 CAT M1 / Band13 -107.5 -99.3 CAT M1 / Band14 -107.6 -99.3 CAT M1 / Band18 -107.5 -102.3 CAT M1 / Band19 -107.1 -102.3 CAT M1 / Band20 -107.0 -99.8 CAT M1 / Band25 -107.4 -100.3 CAT M1 / Band26 -106.9 -100.3 CAT M1 / Band27 -107.0 -100.8 CAT M1 / Band28 -106.9 -100.8 CAT M1 / Band66 -107.4 -102.
ME910G1 Hardware Design Guide Temperature Range Temperature Range Note Operating Temperature Range –40°C to +85°C The module is fully functional (*) and compliant according to regulatory standards. Storage Temperature Range –40°C to +105°C The module is not powered and not connected to power supply Table 11: Temperature Range Note: (*) Functional: if applicable, the module can make and receive voice calls, data calls, send and receive SMS and data traffic. 1VV0301593 Rev.
ME910G1 Hardware Design Guide 3. PINS ALLOCATION Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 COMMUNICATION PORT (FW upgrade and Data) B15 USB_D+ I/O USB differential Data (+) C15 USB_D- I/O USB differential Data (-) A13 VUSB I Enable pin for the internal USB transceiver. Asynchronous Serial Port (USIF0) 5 / 3V Internal PD (100K) (FW upgrade and Data with Flow Control) N15 C103/TXD I Serial data input from DTE CMOS 1.
ME910G1 Hardware Design Guide Pin Signal I/O Function Type B7 DVI_TX I/O Digital Audio Interface (TX) 1.8V B8 DVI_CLK I/O Digital Audio Interface (CLK) 1.8V D15 SPI_MOSI I/O SPI MOSI CMOS 1.8V E15 SPI_MISO I/O SPI_MISO CMOS 1.8V F15 SPI_CLK I/O SPI Clock CMOS 1.8V H14 SPI_CS I/O SPI Chip Select CMOS 1.8V GPIO_01 /STAT LED CMOS 1.8V Comment SPI DIGITAL IO C8 GPIO_01 I/O STAT LED is alternate function internal PD (100K) C9 GPIO_02 I/O GPIO_02 CMOS 1.
ME910G1 Hardware Design Guide Pin Signal I/O Function Type Comment GNSS Section R9 ANT_GNSS I GNSS Antenna (50 ohm) RF R7 GNSS_LNA_EN O External GNSS LNA Enable CMOS 1.8V Miscellaneous Functions R13 HW_SHUTDOWN* I HW Unconditional Shutdown VBATT Active low R12 ON_OFF*/WAKE* I Input command for power ON and to wake from deep sleep mode 1.8V Active low R11 VAUX/PWRMON O Supply Output for external accessories / Power ON Monitor 1.
ME910G1 Hardware Design Guide Pin Signal I/O Function Type H2 GND - Ground Power J2 GND - Ground Power K2 GND - Ground Power L2 GND - Ground Power R2 GND - Ground Power M3 GND - Ground Power N3 GND - Ground Power P3 GND - Ground Power R3 GND - Ground Power D4 GND - Ground Power M4 GND - Ground Power N4 GND - Ground Power P4 GND - Ground Power R4 GND - Ground Power N5 GND - Ground Power P5 GND - Ground Power R5 GND - Grou
ME910G1 Hardware Design Guide Pin Signal I/O Function Type Comment D1 RESERVED - RESERVED F1 RESERVED - RESERVED B2 RESERVED - RESERVED C2 RESERVED - RESERVED D2 RESERVED - RESERVED B3 RESERVED - RESERVED C3 RESERVED - RESERVED D3 RESERVED - RESERVED E3 RESERVED - RESERVED F3 RESERVED - RESERVED G3 RESERVED - RESERVED K3 RESERVED - RESERVED Only on HW0.0 L3 RESERVED - RESERVED Only on HW0.
ME910G1 Hardware Design Guide Pin Signal I/O Function G14 RESERVED - RESERVED J14 RESERVED - RESERVED K14 RESERVED - RESERVED N13 RESERVED - RESERVED L13 RESERVED - RESERVED J13 RESERVED - RESERVED M13 RESERVED - RESERVED K13 RESERVED - RESERVED H13 RESERVED - RESERVED G13 RESERVED - RESERVED F13 RESERVED - RESERVED B11 RESERVED - RESERVED B10 RESERVED - RESERVED A9 RESERVED - RESERVED A8 RESERVED - RESERVED E13 RESERVED - RESERVED D13 RES
ME910G1 Hardware Design Guide LGA Pads Layout TOP VIEW A 1 B C D E F G H J K L M N P R ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_PA VBATT_PA GND GND VBATT VBATT_PA VBATT_PA GND ATC2 GND GND GND GND GND GND GND GND 2 GND RES RES RES GND GND GND GND GND 3 SIMVCC RES RES RES RES RES RES RES RES 4 SIMIN RES RES GND 5 SIMIO RES RES GND GND GND 6 SIMCLK DVI_RX RES GND GND GND 7 SIMRST DVI_TX RES RES RES GNSS_L
ME910G1 Hardware Design Guide 4. POWER SUPPLY The power supply circuit and board layout are an important part of the product design. Make sure to follow the guidelines and requirements for optimal performance . Power Supply Requirements The external power supply must be connected to VBATT and VBATT_PA pads and must fulfil the following requirements: Power Supply Value Nominal Supply Voltage 3.8V Operating Voltage Range 3.2 V - 4.2 V Extended Voltange Range 2.6 V - 4.5 V VBATTmin 2.
ME910G1 Hardware Design Guide Note: When turning on the modem, the voltage must be at least VBATTmin. Note: The HardwareUser Guide specifications must be recognized and carefully implemented to use the module in its “Extended Operating Voltage Range”. Power Consumption Idle Mode Mode Measure (Typical) Switched Off Mode Description Module switched off after switched it on (after power supplied, without power cycle on and off, 13uA) 3uA IDLE mode CATM (mA) NBIoT (mA) 2G (mA) AT+CFUN=1 9.5 9.2 9.
ME910G1 Hardware Design Guide Mode Measure* (Typical) GPS Mode Description (mA) Acquisition Active State (GNSS ON, CFUN=4) GPS+GLO, DPO on DWELL=280ms 22 Navigation Acquisition Active State (GNSS ON, CFUN=5 eDRX) GPS+GLO, DPO off 69.3 55.9 GPS+GLO, DPO off 68.5 GPS+GLO, DPO off 15.
ME910G1 Hardware Design Guide ME910G1-WW and ME910G1-WWV Connected Mode Measure (Typical) Mode Connected mode CATM NBIoT GPRS Mode Description Average (mA) Peak (mA) 380 1100 1 RB, RMC, TBS=5, QPSK, 23dBm, Band 85, 28, 12 320 900 1 RB, RMC, TBS=5, QPSK,23dBm, Band 13, 26, 5, 18, 19, 20, 8 305 800 1 RB, RMC, TBS=5, QPSK, 23dBm, Band 3, 2, 25, 4, 1, 66 240 335 3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 20dBm, Band 71 600 1000 3.
ME910G1 Hardware Design Guide General Design Rules The main guidelines for the Power Supply Design include three different design steps: • the electrical design of the power supply • the thermal design • the PCB layout Electrical Design Guidelines of the Power Supply The electrical design of the power supply depends on a drained power source. The electrical design guidelines categories are: • +5V input (typically PC internal regulator output) • +12V input (typically automotive) • Battery 4.3.1.
ME910G1 Hardware Design Guide Figure 2: An example of linear regulator with 5V input 4.3.1.2. +12V Source Power Supply Design Guidelines • The desired output for the power supply is 3.8V, so due to the large difference between the input source and the desired output, a linear regulator is not suitable and shall not be used. A switching power supply will be preferable because of its better efficiency. • A regulator must be provided to absorb current peaks.
ME910G1 Hardware Design Guide Figure 3: An example of switching regulator with 12V input 4.3.1.3. Battery Source Power Supply Design Guidelines The nominal output of the desired power supply is 3.8V and the maximum voltage allowed is 4.2V. So a single 3.7V Li-Ion cell battery type is sufficient to power the Telit ME910G1 module. • A low ESR Bypass capacitor of adequate capacity must be provided to stop the current absorption peaks. The recommended capacitor is a 100μF.
ME910G1 Hardware Design Guide Note: Make the PCB design to have the best connection of GND pads to large copper surfaces. Note: The ME910G1 includes a function to prevent overheating. Power Supply PCB Layout Guidelines As seen in the electrical design guidelines, the power supply shall have a low ESR capacitor on the output to cut the current peaks on the input to protect the supply from spikes. The placement of this component is essential for the correct working of the circuitry.
ME910G1 Hardware Design Guide with noise sensitive circuitry such as the microphone amplifier/buffer or the earphone amplifier. • Power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables. • The insertion of the EMI filter on VBATT pins is recommended in those designs where antenna is placed near batteries or supply lines. For this purpose, a Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 ferrite bead can be used.
ME910G1 Hardware Design Guide Note: If the power saving configuration is enabled by AT+CPSMS Command, VAUX during the period of deep sleep mode is OFF RTC Supply RTC is functional when ME910G1 is in PSM or OFF state and VBATT pin is supplied. RTC settings are lost if VBATT supply is temporary disconnected. 1VV0301593 Rev.
ME910G1 Hardware Design Guide 5. DIGITAL SECTION ME910G1 has four main operation states: • OFF state: Vbatt is applied and only RTC is running. Baseband is switched OFF and the only change possible is the ON state. • ON state: baseband is fully switched on and ME910G1 is ready to accept AT commands. ME910G1 can be idle or connected. • Sleep mode state: main baseband processor is intermittently switched ON and AT commands can be processed with some latency. ME910G1 is idle with low current consumption.
ME910G1 Hardware Design Guide Power On To turn on the ME910G1 the pad ON_OFF*/WAKE* must be tied low for at least 5 second and then released. The maximum current that can be drained from the ON_OFF*/WAKE* pad is 0,1 mA. The ON_OFF*/WAKE* pad can make an asynchronous wakeup of the system from PSM Mode, before the scheduled event of timer T3412 expired. To make asynchronous exit from PSM mode ON_OFF*/WAKE* pin must be set to LOW for at least 5 seconds.
ME910G1 Hardware Design Guide A flow chart showing the proper turn on procedure is displayed below: “Modem ON Proc” START N VBATT>VBATTmin? Y Y PWRMON=ON ? N ON_OFF*/WAKE* = LOW GO TO “HW Shutdown Unconditional” Delay = 5 sec ON_OFF*/WAKE*= HIGH PWRMON=ON ? N Y Delay = 1 sec GO TO “Start AT Commands”” “Modem ON Proc” END Figure 6: Turn on procedure flow chart 1VV0301593 Rev.
ME910G1 Hardware Design Guide A flow chart showing the AT commands managing procedure is displayed below: “Start AT CMD” START Delay = 300 msec Enter AT AT answer in 1 sec ? N GO TO “HW Shutdown Unconditional” Y GO TO “Modem ON Proc.
ME910G1 Hardware Design Guide For example: 1- Let's assume you need to drive the ON_OFF*/WAKE* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1): 2- Let's assume you need to drive the ON_OFF*/WAKE* pad directly with an ON/OFF button: Warning: It is recommended to set the ON_OFF*/WAKE* line LOW to power on the module only after VBATT is higher than 3.20V.
ME910G1 Hardware Design Guide Power Off Turning off of the device can be done in two ways: • via AT command (see ME910G1 Software User Guide, AT#SHDN) • pin ON_OFF*/WAKE* for at least 3 seconds In both cases, the device sends a disconnection request to the network informing that the device will no longer be reachable. Note: To check if the device has been powered off or IN PSM mode, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low.
ME910G1 Hardware Design Guide The following flow chart shows the proper turn off procedure: “Modem OFF Proc.” START N PWRMON=ON? Y Key AT OFF Mode ON_OFF*/WAKE* = LOW Delay >= 3 sec AT#SHDN ON OFF*/WAKE* = HIGH N PWRMON=ON? “Modem OFF Proc.” END Y N Looping for more than 15s? Y GO TO “HW SHUTDOWN Unconditional” Figure 8: turn off procedure flow chart 1VV0301593 Rev.
ME910G1 Hardware Design Guide Wake from Deep Sleep Mode ME910G1 supports Power Saving Mode (PSM) functionality defined in 3GPP Release 12. When Periodic Update Timer expires, ME910G1 power off until the next scheduled wakeup time. Host-controlled asynchronous event can wake up from deep sleep mode by asserting the ON_OFF*/WAKE* pin LOW for at least 5 seconds. The Host can detect deep sleep mode by pulling VAUX/PWRMON pin if previously configured.
ME910G1 Hardware Design Guide A typical circuit is the following: Figure 9: typical circuit For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): Figure 10: typical circuit 1VV0301593 Rev.
ME910G1 Hardware Design Guide In the following flow chart the proper restart procedure is detailed: “HW SHUTDOWN Unconditional” START HW_SHUTDOWN* = LOW Delay = 1s Delay = 200ms Disconnect VBATT HW SHUTDOWN* = HIGH Y PWRMON = ON N “HW SHUTDOWN Unconditional” END Figure 11: restart procedure flow chart Note: In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OF
ME910G1 Hardware Design Guide Fast Shut Down The procedure to power off ME910G1 described in the Power Off section. It normally takes more than 1 second to disconnect from the network and make ME910G1 internal filesystem properly closed. In case of unwanted supply voltage loss the system can be switched off without any risk of filesystem data corruption by implementing the Fast Shut Down feature. Fast Shut Down feature permits to reduce the current consumption and the time-topoweroff to minimum values.
ME910G1 Hardware Design Guide The capacitor is rated with the following formula: Tip: Make the same plot during system verification to check timings and voltage levels. Fast Shut Down by Software The fast shut down can be triggered by AT command. Communication Ports Note: It is recommended to add PCB test points to UART, UART_AUX and USB of unused modules (for products supporting USB), it may be useful to reflash, test and debug the application.
ME910G1 Hardware Design Guide should be minimized. The characteristic impedance value should be as close as possible to 90 Ohms differential. ESD protection can be added to USB D+/D- lines in case of external connector for cable connection. Proper components for USB 2.0 must be used. SPI The ME910G1 Module is provided by a standard 3-wire master SPI interface + chip select control. The following table lists the available signals: PAD Signal I/O Function Type NOTE D15 SPI_MOSI O SPI MOSI CMOS 1.
ME910G1 Hardware Design Guide Serial Ports The ME910G1 module is provided with by 2 Asynchronous serial ports: • MODEM SERIAL PORT 1 (Main) • MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are: • RS232 PC com port • microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) • microcontroller UART @ 5V or other voltages different from 1.
ME910G1 Hardware Design Guide Note: According to V.24, some signal names refer to the application side, so on the ME910G1 side these signal are in the opposite direction: TXD on the application side is connected to the receiving line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD). For reduced implementation, only the TXD, RXD lines can be connected, the other lines can be left open.
ME910G1 Hardware Design Guide 5.7.3.3. RS232 Level Translation To interface the ME910G1 with a PC com port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must: • invert the electrical signal in both directions; • change the level from 0/1.8V to +15/-15V. Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing for a lower voltage-multiplying ratio on the level translator.
ME910G1 Hardware Design Guide The RS232 serial port lines are usually connected to a DB9 connector with the following layout: Figure 15: example RS232 serial port lines General Purpose I/O The ME910G1 module includes a set of Configurable Digital Input / Output pins (CMOS 1.8V). The Input pads can only be read; they report the digital value (high or low) present on the pad at the time of reading. The Output pads can only be written or queried and set the value of the pad output.
ME910G1 Hardware Design Guide Using a GPIO as INPUT GPIO pads, when used as inputs, can be connected to the digital output of another device to report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad of ME910G1 has interface levels other than the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V supplied by VAUX/POWERMON R11 pad.
ME910G1 Hardware Design Guide In the following reference schematic for LED indicator, R3 must be calculated taking in account VBATT value and LED type: Figure 16: LED indicator reference schematic External SIM Holder Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a). ADC Converter The ME910G1 is includes one AD converter. It can read a voltage level in the range of 0÷1.8 volts applied on the ADC pin input, store it and convert it into 10 bit word.
ME910G1 Hardware Design Guide Refer to SW User Guide or AT Commands Reference Guide for the full description of this function. Forced USB Boot If standard firmware upgrade procedures are not possible, the FORCED_USB_BOOT pin must be set to 1.8V when power-on of the module. The input current is very low so 10K resistor can be used to keep this pin in HI state. FORCED_USB_BOOT pin must be connected only during the firmware upgrade operation. It must be left open during normal operation.
ME910G1 Hardware Design Guide MIPI The MIPI interface is intended to be used in bundle with Qualcomm QAT3516 Adaptive Aperture Tuner. 1VV0301593 Rev.
ME910G1 Hardware Design Guide 6. RF SECTION Antenna Requirements The antenna connection and the board layout design are the most important aspect of the complete product design. It strongly affects the general performance of the product, so read carefully and follow the requirements and the guidelines for a proper design.
ME910G1 Hardware Design Guide PCB Design Guidelines When using the ME910G1, as there is no antenna connector on the module, the antenna must be connected to the ME910G1 antenna pad (K1) by means of a transmission line implemented on the PCB.
ME910G1 Hardware Design Guide • Place the noisy EM devices as far as possible away from the ME910G1 antenna line; • Keep the antenna line far away from the ME910G1 power supply lines; • If there are noisy EM devices (such as fast switching ICs, LCD and so on) on the PCB hosting the ME910, shield the antenna line by burying it in an inner layer of the PCB and surrounding it with the Ground planes, or shield it with a metal frame cover.
ME910G1 Hardware Design Guide possible power losses. A Grounded Coplanar Waveguide (G-CPW) line was chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line. The interface board is made on a FR4, 4-layers PCB. The substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.
ME910G1 Hardware Design Guide Return Loss plot of line under test is shown below: Figure 19: Return Loss plot of line under test Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure: Figure 20: Line input impedance 1VV0301593 Rev.
ME910G1 Hardware Design Guide Insertion Loss of G-CPW line plus SMA connector is shown below: Figure 21: Insertion Loss of G-CPW line plus SMA connector 6.1.2.3. Antenna Installation Guidelines • Install the antenna in a place covered by the LTE signal with CAT-M1 support. • The Antenna must not be installed inside metal cases. • The Antenna must be installed according Antenna manufacturer instructions. • The Antenna integration should optimize the Radiation Efficiency.
ME910G1 Hardware Design Guide 7. AUDIO SECTION The Telit digital audio interface (DVI) of the ME910G1 Module is based on the I2S serial bus interface standard. The audio port can be connected to the end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).
ME910G1 Hardware Design Guide 8. GNSS SECTION The ME910G1 module includes a state-of-art receiver that can simultaneously search and track satellite signals from multiple satellite constellations. This multi-GNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS. GNSS Signals Pin-out Pin Signal I/O Function R9 ANT_GNSS I GNSS Antenna (50 ohm) R7 GNSS_LNA_EN O GNSS External LNA Enable Type CMOS 1.
ME910G1 Hardware Design Guide • Keep the antenna line far away from power supply lines. • Keep the antenna line far away from GSM RF lines. • If there are noisy EM devices around the PCB hosting the module, such as fast switching ICs, take care of the antenna line shielding by burying it inside the PCB layers and surround it with Ground planes, or shield it with a metal frame cover.
ME910G1 Hardware Design Guide GNSS Antenna Requirements GNSS active antenna must be used or integrated in the application. GNSS Antenna Specification Item Value Frequency range 1559.0 ~ 1610.0 MHz Gain 15 ~ 30dB Impedance 50 ohm Noise Figure of LNA < 1.5 (recommended) DC supply voltage DC 1.8 ~ 3.
ME910G1 Hardware Design Guide The electrical characteristics of the GPS_LNA_EN signal are: Level Min Max Output High Level 1.6V 1.9V Output Low Level 0V 0.3V Table 36: Electrical characteristics of the GPS_LNA_EN Example of external antenna bias circuitry: Figure 23: External antenna bias circuitry example Pay attention to the maximum bias current in case of an unwanted short circuit on the antenna cable, as the decoupling inductor could be damaged. In case of LNA with 1.
ME910G1 Hardware Design Guide 9. MECHANICAL DESIGN Drawing PIN B1 Lead Free Alloy: Surface Finishing Ni/Au for all solder pads Figure 24: ME910G1 Mechanical Drawing (without label applied) 1VV0301593 Rev.
ME910G1 Hardware Design Guide 10. APPLICATION PCB DESIGN The ME910G1 modules have been designed to be compliant with a standard lead-free SMT process Recommended Footprint for the Application Copper Pattern (top view) Figure 25: Footprint 1VV0301593 Rev.
ME910G1 Hardware Design Guide INHIBIT WIRING AREA (dimensions in mm) Figure 26:: Inhibit Wiring Area SOLDER RESIST PATTERN (TOP TRANSPARENT VIEW) Figure 27: Solder Resist pattern 1VV0301593 Rev.
ME910G1 Hardware Design Guide To easily rework the ME910G1 it is recommended to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. Note: In the customer application, the region in WIRING INHIBIT (see figure above) must be clear from signal or ground paths.
ME910G1 Hardware Design Guide Recommendations for PCB Pad Dimensions It is not recommended to place vias or micro-vias not covered by solder resist in an area of 0,3 mm around the pads unless they are transmitting the same signal of the pad itself Inhibit area for micro-via Figure 29: Pad dimensions recommendations Holes in pad are allowed only allowed for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer Thickness (um) Electro-less Ni / Immersion Au 3 –7 / 0.
ME910G1 Hardware Design Guide thermal transfer for FR-4 PCBs is to add thermal vias - plated through-holes (PTH) between the conductive layers. Vias are created by drilling holes and copper plating them, in the same way that a PTH or via is used for electrical interconnections between layers. A series of plated through-hole thermal vias, should be placed in the GND area under the Telit module of the PCB to provide a thermal connection from the PCB GND to the additional metal layers of the PCB.
ME910G1 Hardware Design Guide Solder Paste Various types and grades of solder paste can be used for surface mounting Telit modules. For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used. Any Type 3 solder paste either water-soluble or no clean is acceptable. We recommend using only “no clean” solder paste to avoid cleaning the modules after assembly.
ME910G1 Hardware Design Guide Note: All temperatures refer to topside of the package, measured on the package body surface Warning: THE ME910G1 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY. Warning: The above solder reflow profile represents the typical SAC reflow limits. It does not guarantee the proper adherence of the module to the customer’s application throughout the temperature range.
ME910G1 Hardware Design Guide 11. PACKAGING Tray ME910 modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the ME910G1 series will be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each).
ME910G1 Hardware Design Guide Figure 32: Tray dimensions 1VV0301593 Rev.
ME910G1 Hardware Design Guide Reel The ME910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. Figure 33: Module positioning into the carrier Carrier Tape Detail Figure 34: Carrier Tape detail 1VV0301593 Rev.
ME910G1 Hardware Design Guide Reel Detail Figure 35: Reel detail Figure 36: Detail 1VV0301593 Rev.
ME910G1 Hardware Design Guide Packaging Detail Figure 37: Packaging detail Moisture Sensitivity The ME910G1 is a level 3 Moisture Sensitive Device, in accordance with the standard IPC/JEDEC J-STD-020, it takes care of all related requirements for using this kind of components. Moreover, the customer must take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
ME910G1 Hardware Design Guide 12.
ME910G1 Hardware Design Guide EMEA Approvals EU RED 12.2.1.1. EU Declaration of Conformity In accordance with the above Approval Compliance Summary table, where applicable (green ball), hereby, Telit Communications S.p.A declares that the equipment is in compliance with the Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: https://www.telit.com/red Text of 2014/53/EU Directive (RED) requirements can be found here: https://eur-lex.
ME910G1 Hardware Design Guide Max Gain for RED (dBi) Band ME910G1-W1 ME910G1-WW ME910G1-WWV ME910G1-W3 FDD 20 11.20 8.20 8.20 8.20 FDD 28 10.47 7.47 7.47 7.47 Table 44: Max Gain for RED UK UKCA 12.2.2.1. UKCA Declaration of Conformity In accordance with the above Approval Compliance Summary table, where applicable (green ball), hereby, Telit Communications S.p.A declares that the equipment is in compliance with the Radio Equipment Regulations 2017 for UKCA.
ME910G1 Hardware Design Guide Max Gain for RED/UKCA (dBi) Band ME910G1-W1 ME910G1-WW ME910G1-WWV ME910G1-W3 GPRS/EGPRS 1800 --- 9.34 9.34 --- FDD 1 14.84 11.84 11.84 11.84 FDD 3 14.33 11.33 11.33 11.33 FDD 8 11.45 8.45 8.45 8.45 FDD 20 11.20 8.20 8.20 8.20 FDD 28 10.47 7.47 7.47 7.47 Table 46: Max Gain for UKCA Americas Approvals USA FCC 12.3.1.1. FCC Certificates The FCC Grants can be found here: https://www.fcc.gov/oet/ea/fccid 12.3.1.2.
ME910G1 Hardware Design Guide Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
ME910G1 Hardware Design Guide Manual Information to the End User The OEM integrator should be aware not to provide information to the end user on how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warming as shown in this manual Information on test modes and additional testing requirement The module has been evaluated in mobile stand-alone conditions.
ME910G1 Hardware Design Guide Max Gain for FCC (dBi) Band ME910G1-W1 ME910G1-WW ME910G1-WWV ME910G1-W3 GSM 850 --- --- 8.4 --- GSM 1900 --- --- 10.0 --- GPRS/EGPRS 850 --- 6.9 6.9 --- GPRS/EGPRS 1900 --- 2.5 2.5 --- FDD 2 11.0 8.0 8.0 8.0 FDD 4 8.0 5.0 5.0 5.0 FDD 5 12.4 9.4 9.4 9.4 FDD 12 11.6 8.6 8.6 8.6 FDD 13 12.1 9.1 9.1 9.1 FDD 25 11.0 8.0 8.0 8.0 FDD 26 12.3 9.3 9.3 9.3 FDD 66 8.0 5.0 5.0 5.0 FDD 71 11.4 11.4 11.4 --- FDD 85 11.
ME910G1 Hardware Design Guide Canada ISED 12.3.2.1. ISED Database The product ISED certified can be found here Le certificat ISDE est disponible ici: https://smssgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en Model Applicable ISED Rules Modèle Règles ISDE applicables ME910G1-W1 RSS: 132 Issue3, 133 Issue 6, 130 Issue 2, 139 Issue 3; RSS-Gen Issue 5 ME910G1-WW ME910G1-WWV ME910G1-W3 Table 51: Applicable ISED rules 12.3.2.2.
ME910G1 Hardware Design Guide Radio Exposure Notice / Avis d'exposition radio This device complies with ISED radiation exposure limits set forth for an uncontrolled environment and meets the RSS‐102 of the ISED radio frequency (RF) Exposure rules.
ME910G1 Hardware Design Guide This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
ME910G1 Hardware Design Guide Labelling requirements for the host device / Exigences d'étiquetage pour le périphérique hôte The host device shall be properly labelled to identify the modules within the host device.
ME910G1 Hardware Design Guide APAC Approvals Taiwan NCC 12.4.1.1. NCC Regulatory Notices According to NCC Taiwan requirements, the module and the packaging shall be identified as described in the following lines. Shall be added also the specified safety warning statement. Brand name: Telit Model name: ME910G1-WW Equipment name: WWAN module NCC logo: NCC ID: CCAF20NB0050T0 NCC safety warning statement: “減少電磁波影響，請妥適使用” NCC Note: 注意：行動電話業務(2G)於 106 年 6 月停止提供服務後，本設備 2G 功能在國內將無法使 用。 Japan JRL/JTBL 12.4.2.1.
ME910G1 Hardware Design Guide 13. PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein. The information contained in this document has been carefully checked and is believed to be reliable.
ME910G1 Hardware Design Guide computer programs, including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the Third-Party software supplier.
ME910G1 Hardware Design Guide Trademarks TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners. Third Party Rights The software may include Third Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights.
ME910G1 Hardware Design Guide Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where: • • it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc. there is a risk of explosion such as gasoline stations, oil refineries, etc.
ME910G1 Hardware Design Guide 14.
ME910G1 Hardware Design Guide 15. DOCUMENT HISTORY Revision 15 Date 2022-07-27 Changes “B86” has been 3GPP standardized as B103 Antenna aperture Tuning Application note not yet available Added Switched off power consumption CONFORMITY ASSESSMENT ISSUES Chapter updated 14 2022-04-08 Forced USB Boot chapter added B14 removed in chapter 2.5.1 for ME910G1-W1 variant Figure 26: right title set Figure 24: box filled up UKCA for W3 variant Anatel restricted radiation statement removed 2.7.
ME910G1 Hardware Design Guide Revision Date Changes Section 8.4, measurements update Section 2.2, 2.5, 12.3, adding B86 update 6 2020-09-14 Section 2.5, TX Power update Section 2.8, Temperature range update Chapter 12, Conformity assessment update 5 2020-07-22 Conformity assessment update with ANATEL 4 2020-06-18 The title of chapter 5.7.3.2 has been changed from "Modem serial port 2" in "Modem serial port 2 (USIF1)". The title of chapter 5.7.3.
