Specifications

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XJ-B1A Module Series
B1A BLEmesh Standard Module (PCB Antenna)
XJ-B1A series of low-power Bluetooth module is a high-performance Bluetooth module which
is developed based on the Telink low-power Bluetooth SOC TLSR8250 chip. The module adopts
the stamp-type and side plug-in interfaces, is exquisite and compact, is fully lead out via ports and
convenient to use, and helps the users omit the complicated RF hardware design, development and
production links. Therefore, the users can easily realize the development of Bluetooth application
programs on that basis, shorten the R&D cycle, and seize the market opportunities. This model is a
pure hardware module that excludes any software. If you need the edition with software, please notify in
advance.
Product Characteristics
·Working Frequency Band
- Working frequency band: 2402-2480MHz
·Ultra-low Power Consumption
- Support 2.7V-3.6V power supply
- Emission current: ≤20mA (10dBm power
configuration)
- Receiving current: ≤7.5mA (overall current)
- Sleep current: 400nA (SRAM not saving)
·High-link Budget
- Sensitivity-96dBm±1dBm (1Mbps, PER<30.8%)
- Emission power: Max.1.391dBm
·Memory Resources
- Internal 512kB Flash (the capacity that
the client can actually use is less than
512kB)
- 48kB on-chip SRAM, wherein 32kB can
sleep and save
·Compatibility
- Designed interface mode with side
plug-in and stamp holes compatible
·Mesh Functions
- Support BLE
- Support the Bluetooth SIG Mesh
- Support the exclusive Mesh of Telink
·Communication Interface
- 2 PWM / 4 GPIO / 1 UART Pin
multiplexing
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