Application Note Guide for user design Version：V1.0 Application Note Date：2019-03-14 Introduction This note lists the matters need attention in each stage of designing and manufacturing while using MXCHIP module. In order to achieve rapid mass production, application designers need learn this note first. Consider and avoid all possible problems which may happen during designing, manufacturing, firmware programming and testing ahead of time.
Catalogue 1. Hardware design considerations............................................................ 1 1.1 Mechanical dimensions ................................................................................................................ 1 1.2 Recommended package design .................................................................................................... 1 1.3 DC power design ..............................................................................................................
4. Mass production testing and firmware upgrading................................ 17 4.1 Mass production test ................................................................................................................... 17 4.1.1 EMSP command way .................................................................................................................................. 17 4.1.2 Limited development firmware ...........................................................................................
Figure 14 Power Led .......................................................................................................................... 10 Figure 15 COM Name in Device Manager ........................................................................................
Figure 16 FWUpdate.exe ................................................................................................................... 11 Figure 17 Place Module ..................................................................................................................... 11 Figure 18 Programming ..................................................................................................................... 12 Figure 19 Programming Over ........................................................
1. Hardware design considerations 1.1 Mechanical dimensions EMW3091 mechanical dimension of vertical view: Figure 1 Vertical view EMW3091 mechanical dimension of side view: Figure 2 Bottom view 1.2 Recommended package design The figure followed below is the recommended package design MXCHIP suggested while designing the baseplate. EMW3091 applies two solutions for hand-soldering: DIP and half-hole footprint.
The solder window has the same size of the pad. The stencil aperture that suggested for SMT is 0.12mm-0.14mm. The solder paste recommended is SAC305 and lead free.
1.3 DC power design Peak current of EMW3091 is about 320mA. The DC/DC power chip MXCHIP recommended should be whose maximum output current is over 600mA. DC/DC gets more superiority on power conversion than LDO. When using DC/DC power chip, except for the requirements of output voltage (3.3V) and maximum current (600mA), application designer should pay more attention on the arrangement of wires.
Figure 7 5V UART to 3.
Figure 9 PCB Recommended Design 1.5 RF design 1.5.1 Antenna placement In the structural design, enough clearance area should be set aside for the antenna. We recommend not less than 15 mm.
Figure 10 Minimum Size of Keep-out Zone Around Antenna Areas on the mother board MXCHIP recommended showed below can reduce the noise to Copper tube antenna and radio signal.
1.5.2. T U.F.L RF Connector Make sure the connector is matched when choosing the external antenna. Mechanical dimensions of U.F.L RF connector shows as followed. Figure 2 U.F.L Connector Size 1.
(CDM) sensitivity is 500V. If a higher ESD level is required, the pins that may be connected to the outside should be reserved place for the ESD protection device. If the module connects the mother board by outside leads, application designers should notice the EMI problems. Using shield cable or reserving the position for common mode choke to solve this problem.
2. Firmware programming and warehouse entry inspection method 2.1 Receiving Inspection Device List Equipment list shows below: Equipment Quantity PC 1（pcs） Fixture 1（pcs） EMW3091 Development Board s 1（pcs） Table 1 Warehouse Entry Inspection Equipment List Application software and firmware: CP210x_VCP_Windows (drivers on PC), download link: http://www.silabs.com/products/mcu/Pages/SoftwareDownloads.aspx Programming firmware should be confirmed by MXCHIP FAE and guests. Its size is 1M bytes.
Figure 13 Development Board Switch Settings 2.2 System Connection Fixture connects to EMW3091 by USB data line. Red led lights if connected. Figure 3 Power Led 2.
Decompress “FWUpdate-3091.rar” and open the file “FWUpdate.exe”. Upload the firmware prepared already. Set COM as “COM 5”. Take “test” for example. Figure 16 FWUpdate.exe Put module on fixture and lead the antenna left side. Module auto programs after pressing down the fixture. Figure 17 Place Module Make sure power supply continuing while programming.
Figure 18 Programming Program over after the screen shows “Succeed…Please change the module”. Figure 5 Programming Over 2.4 Testing Download the testing software “MicoQcAutoCheck-1.2.6.3”. Download link: http://yunpan.
Set “BOOT”, “STATUS” switch as “L” and “ELINK” switch as “H”. Place the module on the fixture. Figure 20 Switch Setting Open the text “3091 testing method”. Decompress and open the file “MicoQcAutoCheck1.2.6.3.rar”. Set up “working number”, “module type”, ”number”, “SN setting”, ”APP CRC”, “boot version”, ”library version”, “app version”, ”drivers version”, “ssid” and “COM number”. et serial baud rate as “921600”. Click “log in”, then “start”. Place module on fixture.
The testing results are placed in the file “log”. Figure 22 Log Saving Please refer to the “Programming and Testing Methods of EMW3091.PDF” for more information. 2.5 Statements MXCHIP has the obligation to guarantee there is no quality problem for the module delivered at each batch. If problems are found while sampling module, customer has the right to require MXCHIP to give a timely replacement.
3. SMT matters 3.1 Note for stencil aperture The recommended stencil aperture: 0.12mm (0.1~0.15mm), laser polishing hole. The recommended solder paste is SAC305 and lead free. The recommended extend length of welding pad: 0.15mm. It can enhance the adhesive ability of solder as shown below. It can check the right position of the module by eyes if using SMT line without AOI testing to reduce the risk of cold solder joint. Figure 23 Recommended Stencil Aperture 3.
Figure 6 Reflow soldering temperature curve 16 / 18
4. Mass production testing and firmware upgrading In addition to considering the product features, application designer need to think over how to do test and upgrade firmware when developing. 4.1 Mass production test Avoid finding problem after installing the PCB boards in machine 4.1.1 EMSP command way Connect the module to the MCU of the mother board by serial port and use the EMSP command. Choose one triggering way---- set one combination key, to send the test command from the MCU.
5. Firmware encrypt In order to make sure the firmware could not be modified after programming in the module, firmware must be encrypted with the bootloader drivers and the chip ID MXCHIP offered. Bootloader driver is used to drive the device in the module and integrated with one AES encryption way. The application part of the firmware must be combined with the bootloader driver to generate one MVA/bin file after adding the chip ID details which can be used to identify MXCHIP module.
ISED Notice This device complies with Innovation, Science and Economic Development Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence.
FCC Regulations: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device , pursuant to Part 15 of the FCC Rules.
End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: P53-EMW3091” The FCC ID can be used only when all FCC compliance requirements are met.
