EMB1082 Datasheet BLE module Vision：1.2 Date：2020-03-18 Number: DS0135EN Abstract Features ⚫ Based on an ultra-low power BLE SOC ▪ ARM Cortex-M4F Core 20MHz ▪ 160KB RAM ▪ 512KB Flash in chip, and support external flash up to 8Mbyte ▪ 32K RCOSC in chip, and support external 32K clock ⚫ Operating Voltage: 2.7V～3.3V ⚫ Support up to 16 IOs pin mux. ⚫ Bluetooth Features ▪ Support Bluetooth 5.
Datasheet [Page 1] Version history Date Vision Details 2018-10-23 1.0 Initial release 2019-03-25 1.1 Update power consumpiton 2020-03-18 1.
Datasheet [Page 2] Content Abstract ............................................................................................................................................................................... 1 Version history .................................................................................................................................................................... 1 1. Product Introduction ........................................................................................
Datasheet [Page 3] Figure 6 EWB1082 mechanical size (Unit: mm) ............................................................................................... 16 Figure 7 Humidity Card ..................................................................................................................................... 17 Figure 8 Storage Condition ................................................................................................................................
Datasheet [Page 4] 1. Product Introduction EMB1082 is an embedded BLE module by MXCHIP. It integrates a BLE5.0 single mode SOC, including ARM Cortex-M4F Core, BLE/2.4G Radio, 160KB RAM, 512KB Flash and rich peripherals. EMB1082 uses half-hole package which is easy for soldering, and also DIP package. Hardware diagram is shown below with three main parts: ⚫ 32-bit Cortex-M4F Core ⚫ BLE 2.4GHz RF ⚫ Power management With: 1.
Datasheet [Page 5] 2. Pins and dimension Pin Arrangement EMB1082 has 21 pins, with 2.0mm pin pitch. EMB1082 uses half-hole package and DIP package (as shown in figure 2, figure3) , which could effectively reduce the quality risk of SMT re-flow. Solder mask openness has the same size with land. The width of solder mask is suggested to be 0.12mm to 0.14mm in SMT.
Datasheet Figure 1 EMB1082 DIP pacakge Figure 2 EMB1082 half hole package EMB1082 [Page 6]
Datasheet [Page 7] Pin Definition Figure 3 EMB1082 Package Definition Table 1 EMB1082 Pin Definition NO.
Datasheet NO.
Datasheet EMB1082 [Page 9]
Datasheet [Page 10] 3. Electrical Parameters Operating Conditions EMB1082 would be unstable when input voltage is less than the lowest rated voltage. Table 2 Range of input voltage Details Symbol Illustration Condition Minimum Typ Maximum Unit 2.7 3.0 3.3 V Power Supply VDD There would be permanent damage in hardware if the device operates at the voltage over rated value. Meanwhile, reliability could be influenced when the device has a long-term operating at maximum voltage.
Datasheet [Page 11] Working Environment Table 5 Temperature and humidity condition Symbol Name Maximum Unit TSTG Storage Temperature -40 to +110 ℃ TA Operation Temperature -40 to +105 ℃ Humidity Non-condensing, Relative humidity 95 % Electrostatic Discharge Table 6 Electrostatic Discharge Parameters Symbol Name Details Level Maximum TA= +25 °C , JESD22-A114 2 2000 Unit Electrostatic discharge VESD(HBM) voltage (Human Body Model) V Electrostatic discharge VESD(CDM) voltage (Cha
Datasheet [Page 12] 4. RF parameters Basic RF parameters Table 7 Radio-frequency standards Name Illustration Working frequency 2.4GHz ISM band Wi-Fi wireless standard Bluetooth5.0 Modulation GFSK Data rate 1Mbps PCB (Default) Antenna type IPEX Connector (Optional) GFSK Parameters Table 8 GFSK mode parameters Item Notes Modulation Frequency range Data rate GFSK 2.400GHz-2.4835GHz ISM band 1Mbps Table 9 GFSK mode RX parameters RX parameter Min Typ.
Datasheet [Page 13] Table 10 GFSK TX parameters BT Spec test item datarate 输出功率 （POWER_AVERAGE） 初始载波频率容许量 (Frequency Drift Error) Measurement Min Typical Max Max LE -20 6.5 7.5 6.49 6.18 6.18 6.49 6.31 LE -50KHz 50KHz 2.501 -3.055 1.398 2.501 -3.055 Carrier frequency offset and drift at NOC: Average Min Channel Frequency CH0 CH19 CH39 (2402MHz) (2440MHz) (2480MHz) 在正常操作模式下的载波频率偏移和漂移 |Fn|max LE |F0-Fn| -150KHz 150KHz 4.858 2.872 2.872 4.858 4.007 LE 50KHz 4.394 2.
Datasheet [Page 14] 5. Antenna Information Antenna Type EMB1082 has two types of antenna: PCB antenna (EMB1082-P), IPEX connector (EMB1082-E). PCB Antenna Clearance Zone Main PCB should have a distance over 16mm with other metal elements when using PCB antenna in Wi-Fi device. Shadow parts in the figure below should keep away from metal elements, sensor, interference source and other material that could cause signal interference.
Datasheet External Antenna Connector Figure 5 Size of External Antenna Connector EMB1082 [Page 15]
Datasheet [Page 16] 6. Assembly Information and Production Guidance Assembly Size Figure 6 EWB1082 mechanical size (Unit: mm) Production Guidance（Important） ⚫ The stamp hole package module produced by Mxchip must completely being patched by SMT machine in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping and drying before patch.
Datasheet [Page 17] ▪ Moisture bag must be stored in temperature below 30 and humidity less than 85%RH. ▪ Dry packaging products, the guarantee period should be from 6 months date of packing seal. ▪ Humidity indicator card is in the hermetic package.
Datasheet [Page 18] ⚫ In order to guarantee the reflow soldering qualification rate, vision and AOI detection should be done in 10% products for the first patch to make sure the rationality of temperature control, device adsorption mode and position. Detect 5 to 10 sample every hour in the following batch production.
Datasheet Storage Condition Figure 8 Storage Condition EMB1082 [Page 19]
Datasheet [Page 20] Temperature Curve of Secondary Reflow Suggested solder paste type: SAC305, unleaded, solder paste thickness from 0.12 to 0.15, less than 2 times reflow.
Datasheet [Page 21] 7. Reference Circuit Power source circuit is shown in figure 11, USB to UART is shown in figure 12, external interface circuit is shown in figure 13.
Datasheet [Page 22] Figure 12 External Interface Circuit of EMB1082 Voltage of EMB1082 UART is 3.3V. 5V UART should convert to 3.3V UART for the users that have 5V chips. Convert circuit is shown in figure 14. Figure 13 3.
Datasheet 8. [Page 23] FCC and IC Information FCC Warning ✓ Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. ✓ Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
Datasheet [Page 24] Note 1: Compliance of this device in all final host configurations is the responsibility of the Grantee. OEM integrators are responsible to satisfy RF exposure requirements.
Datasheet [Page 25] 9.
Datasheet 10. Sales Information and Technical Support For consultation or purchase the product, please contact Mxchip during working hours: From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9thFloor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai. Postcode：200333 Email: sales@mxchip.
