Data Sheet

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LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 1 of 26 www.murata.com

Features

• LTE Cat M1 – Class 3, up to 23dBm

• NB-IoT (NB1) Rel. 13

• STM32L462RE/Cortex M4 w/512KB Flash and 160 KB SRAM

• 1MB on-board Serial Flash

• Dimension: 15.4 x 18.0 x 2.5 mm (max)

• Package: LGA

• SIM card: internal eSIM (WLCSP)

• Antenna configurations: U.FL antenna connection

• 3GPP eDRX and PSM modes

• Power Consumption: enables up to 10-year battery life

• Support PSM and eDRX

• Operating temperature range: -40 °c to 85 °c

• OTA firmware upgrade

• Global Certifications: GCF and PTCRB

• IPv4/IPv6 stack with TCP and UDP protocol

• SSL/TLS

• LTE universal modem supports (low-band and mid-band):

• Low-band B5/B8/B12/B13/B14(CAT M1 Only)/B17/B18/B19/B20/B26/B28

• Mid-band B1/B2/B3/B4/B25

Benefits

• Certified as a host device for ease of integration with several different types of applications

• Quicker time to market (no additional carrier or regulatory certification)

• Less development time and costs for developer/device manufacturer in need of LTE Cat M1/NB-loT connectivity

• eSIM included in certification

• Build/Develop applications with the use of ST's vast set of software modules

• Availability of ST's Community and Development Forums

• Secure boot architecture and a robust hardware-based security framework

LBAD0ZZ1SE

LTE CAT

M1/NB-IoT

Module

Summary of content (26 pages)

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LBAD0ZZ1SE Features • • • • • • • • • • • • • • • • • LTE CAT M1/NB-IoT Module LTE Cat M1 – Class 3, up to 23dBm NB-IoT (NB1) Rel. 13 STM32L462RE/Cortex M4 w/512KB Flash and 160 KB SRAM 1MB on-board Serial Flash Dimension: 15.4 x 18.0 x 2.5 mm (max) Package: LGA SIM card: internal eSIM (WLCSP) Antenna configurations: U.
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Revision History Revision Date Author Change Description 1.0 10/05/2020 RF PD Initial release Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 2 of 26 www.murata.
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Table of Contents FEATURES ............................................................................................................................................................................. 1 BENEFITS............................................................................................................................................................................... 1 REVISION HISTORY ..........................................................................................................
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11 ORDERING INFORMATION ........................................................................................................................................ 17 12 NOTICE ........................................................................................................................................................................ 18 12.1 12.2 12.3 12.4 12.5 12.6 Storage Conditions .................................................................................................................
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1 Block Diagram Figure 1 Type 1SE Block Diagram 2 Module Specifications Table 2-1 Module Specifications Part Number LBAD0ZZ1SE Connectivity 3GPP Release 13/Optimized for LTE Class 3 output power (+23 dBm) Universal LTE (LB & MB) Low-band: B5/B8/B12/B13/B14(CAT M1 Only) /B17/B18/B19/B20/B26/B28 Mid-band: B1/B2/B3/B4/B25 GNSS GPS and GLONASS Voltage Input 3.3-5V Antenna Off board multi-band antenna Dimension 15.4 x 18.0 x 2.
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3 Mechanical Specification 3.1 Module Dimensions Table 3-1: Module Dimensions Parameter Dimension (L x W x H) Typical 15.4 ±0.2mm x 18.0 ±0.2mm x 2.5 (max) Unit mm 3.2 Top and Side View Figure 3.1 Module Top and Side View (Unit: mm) Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 1 of 26 www.murata.
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3.3 PCB Footprint Top View Figure 3.2 Module Footprint Top View (Unit: mm) Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 2 of 26 www.murata.
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3.4 Pin Configuration For further detail of the built-in STM32, please refer to the STM32L462CE STM32L462RE STM32L462VE datasheet [1].
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Pin # Pin Name Type1SC STM32L462 Type Description 36 NC No Connect 37 PMU_AT_IN 38 NC No Connect 39 NC No Connect 40 NC No Connect 41 NC No Connect 42 GND GND 43 VDD Power Power supply for Type1SE 44 VDD Power Power supply for Type1SE 45 VDD Power Power supply for Type1SE 46 GND GND GND 47 NC No Connect 48 NC No Connect 49 NC_SIM_CLK 69 I/O SIM clock 50 NC_VSIM 8 O SIM power supply 51 GND GND GND 52 NC_SIM_DETECT 70 I/O SIM detect 53 NC_SIM
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Pin # Pin Name 76 TIM2_CH2 77 NC No Connect 78 NC No Connect 79 GND 80 NC 81 eSIM_SWP 82 NC No Connect 83 NC 84 VDDUSB A1 Power 85 SWCLK C3 I/O No Connect 3.0 to 3.
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4 DC Electrical Specification 4.1 Tx Output Power The module is compliant to the 3GPP spec for release 13 and rated at a Class 3 device (23 dBm) 4.2 Rx Sensitivity Table 4-1 Rx Sensitivity Items Frequency Range Rx Sensitivity Contents Typ. Max 960 2170 -103 Min 703 1710 LB MB MCS5, BER<5% Unit MHz MHz dBm 5 Environmental Specification 5.1 Absolute Maximum Rating Table 5-1 Absolute Maximum Rating Description Max 6 6:1 Min -0.3 VDD PA Stability Unit V VSWR 5.
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6 Application Information 6.1 Recommended PCB Landing Pattern The recommended PCB landing pattern is the same as the module footprint, see Figure 3.2. 6.2 External Antenna The Type 1SE module has a built-in standard u.FL RF connector. To select any external antenna please read the regulatory information in section 9 Regulatory Information first. Make sure that you pick the antenna that covers the correct frequency for the appropriate band and make sure 50-Ohm impedance matching. 6.
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7 Assembly Information The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the conditions mentioned above to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions Figure 7.
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8 Packaging and Marking Information 8.1 Dimensions of Tape (Plastic tape) To be added Figure 8.1 Tape Dimensions (Unit in mm) 8.2 Dimensions of Reel Figure 8.2 Reel Dimensions (Unit: mm) Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 9 of 26 www.murata.
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8.3 Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62 um in thickness [4] Base tape : As specified in (1) Feeding Hole Feeding Direction Pin 1 Marking Chip Figure 8.3 Tape Diagram Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 10 of 26 www.murata.
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8.4 Leader and Tail tape Feeding direction Tail tape (No components) Components 40 to 200mm No components 150mm min. Leader tape (Cover tape alone) 250mm min. Figure 8.4 Tape Leader and Tail The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. The cover tape and base tape are not adhered at none components area for 250 mm min. Tear off strength against pulling of cover tape: 5 N min. Packaging unit: 500 pcs.
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8.5 Peeling Force 1.3 N max. in the direction of peeling as shown below. 1.3 N max. 165 to 180 ° Cover tape Base tape Figure 8.5 Peeling Force Diagram 8.6 PACKAGE (Humidity proof Packaging) Label べル表示ラ Desiccant 乾燥剤 Humidity 湿度 Indicator インジケ－タ表示ラ Labelベル Figure 8.6 Packaging Diagram 防湿梱包袋 Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Copyright © Murata Manufacturing Co., Ltd.
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8.7 Module Marking Information Error! Reference source not found. shows the module marking. Dimensions are nominal, not absolute. Figure 8.7 Module Marking Diagram 8.8 Moisture Sensitivity Level The LBAD0ZZ1SE is planned to be qualified to moisture sensitivity level 4 (MSL4) in accordance with JEDEC J-STD-020. Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 13 of 26 www.murata.
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9 Regulatory Information 9.1 FCC Info This device has Single Modular Approval. This device is approved for mobile and fixed use with respect to RF exposure compliance and may only be marketed to OEM installers. The antenna(s) used for this transmitter, as described in this filing, must be installed to provide a separation distance of at least 20 cm from all persons. Installers and end-users must be provided with operating conditions for satisfying RF exposure compliance.
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9.3 ISED Test Data Table 9-2 ISED Test Data ISED CAT M1 Conducted Max. output EIRP Operation Average Antenna Operation Freq. Power include (ERP) Distance output Gain Mode (MHz) tolerance Limit (cm) power (dBi) (dBm) (dBm) (dBm) Band 2 1850.7 20 22.80 23.00 10.20 33.00 Band 4 1710.7 20 22.97 23.00 7.03 30.00 Band 5 824.7 20 22.46 23.00 8.12 38.45 Band 12 699.7 20 20.85 23.00 7.63 34.77 Band 13 779.5 20 20.71 23.00 7.95 34.77 Band 17 704.1 20 22.94 23.00 7.65 34.77 Band 25 1850.7 20 21.11 23.00 10.52 33.
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9.5 Labeling Requirements Any device incorporating this module must include an external, visible, permanent marking or label which states: “Contains FCC ID: HSW-TY1SCDM” and “Contains IC :4492A-TY1SCDM” Obligation d'étiquetage du produit final: Tout dispositif intégrant ce module doit comporter un externe, visible, marquage permanent ou une étiquette qui dit: "Contient IC : 4492A-TY1SCDM” 9.6 Additional Testing Requirements The modular transmitter is only FCC authorized for the specific rule parts (i.e.
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10 RoHS Information The LBAD0ZZ1SE module is conformed to RoHS requirement. 11 Ordering Information Table 11-1 Ordering Information Product Model Name Murata Ordering Part Number Standard Order Increment Sample Module Type 1SE LBAD0ZZ1SE-TEMP 1 pcs Production Module Type 1SE LBAD0ZZ1SE-493 500 pcs STMirco B-L462E-CELL1 Discovery kit B-L462E-CELL1 1 pcs Development Kit Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.
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12 Notice 12.1 Storage Conditions Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non-corrosive gas (Cl2, NH3, SO2, NOx, etc.).
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- In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 12.
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13 PRECONDITIONS TO USE MURATA PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification.
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14 References [1] STMicro Semiconductor, STM32L462CE STM32L462RE STM32L462VE datasheet, May 2018. [2] STMicro Semiconductor, B-L462E-CELL1 Discovery Kit for NB/M1 communication Discovery Board, UMxxxx, User Manual Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 21 of 26 www.murata.