Preliminary Specification Number : SP-ABZ-F 1 / 19 USER MANUAL MP P/N: CMWX1ZZABZ Sample P/N: CMWX1ZZABZ-TEMP For LoRaTM
Preliminary Specification Number : SP-ABZ-F 2 / 19 Revision History Revision Code A B June 8, 2016 July 1, 2016 C July 30,2016 D Aug 29,2016 E F Oct 11, 2016 Aug 20, 2018 Date Description Initial Draft Updated height and package info Revised some formats and ΔRF_OPH_V test condition from 2.4-3.7V to 2.2-3.6V. Updated some electronic Characteristics. Added the recommended land pattern. Updated the RF performance, Electrical Characteristics and power up sequence. Added FCC and IC statements.
Preliminary Specification Number : SP-ABZ-F 3 / 19 TABLE OF CONTENTS 1. Features ·······················································································································4 2. Part Number ·················································································································4 3. Block Diagram ···············································································································4 4.
Preliminary Specification Number : SP-ABZ-F 4 / 19 1. Features Interfaces Main ICs Reference Clocks Supported Frequencies Module Size Package RoHS : I2C, UART, USB, SPI : STM32L082, SX1276 : Integrated 32MHz clock (TCXO with frequency error=±2 ppm) and 32.768KHz clock (frequency error=±20 ppm) : 868 MHz, 915 MHz : 12.5 mm x 11.6 mm x 1.76 mm (Max) : Metal Shield can : This module is compliant with the RoHS directive 2. Part Number Ordering Part Number CMWX1ZZABZ CMWX1ZZABZ-TEMP 3.
Preliminary Specification Number : SP-ABZ-F 5 / 19 4. Dimensions, Marking and Terminal Configurations Top View Bottom View Side View Table 1 Dimension (Unit: mm) Mark Dimension 12.5±0.20 L 0.50±0.10 a1 0.20±0.15 b1 3.50±0.15 b4 2.55±0.15 b7 1.50±0.10 c3 1.00±0.10 e3 Mark W a2 b2 b5 c1 e1 e4 Dimension 11.6±0.20 0.50±0.10 1.60±0.15 0.20±0.15 0.80±0.10 0.30±0.10 1.00±0.10 Mark T a3 b3 b6 c2 e2 Dimension 1.76 max 1.50±0.10 3.00±0.15 1.15±0.15 0.80±0.10 0.30±0.
Preliminary Specification Number : SP-ABZ-F 6 / 19 Terminal Configurations < Top View > Table 2 Terminal Configurations Pin NO.
Preliminary Specification Number : SP-ABZ-F 7 / 19 19 PA9/USART1_TX I/O STM32L082_PA9 20 PA8/MCO I/O STM32L082_PA8 21 PA5/ADC5/DAC2 I/O STM32L082_PA5 GPIO Mode:PA9 USART1_TX GPIO Mode:PA8 MCO GPIO Mode:PA5 COMP2_INM ADC_IN5 DAC_OUT2 22 PA4/ADC4/DAC1 I/O STM32L082_PA4 GPIO Mode:PA4 COMP2_INM ADC_IN4 DAC_OUT1 23 PA3/ADC3 I/O STM32L082_PA3 GPIO Mode:PA3 COMP2_ INP ADC_IN3 24 PA2/ADC2 I/O STM32L082_PA2 GPIO Mode:PA2 COMP2_OUT ADC_IN2 25 GND Ground - Ground 26 ANT A,I/O - Tra
Preliminary Specification Number : SP-ABZ-F 8 / 19 44 GND Ground - - 45 PH1-OSC_OUT I/O STM32L082_PH1 GPIO Mode:PH1 High-speed external clock OSC output 46 PH0-OSC_IN I/O STM32L082_PH0 GPIO Mode:PH0 High-speed external clock OSC input 47 TCXO_OUT O - Internal TCXO output 48 VDD _TCXO Power - Power supply for the TCXO IC GND Ground - Ground 49~57 Note: GPIO pins are to be left OPEN if not used. 5. Label Information TBD 6.
Preliminary Specification Number : SP-ABZ-F 9 / 19 8. Electrical Characteristics 8.1 FSK/OOK Transceiver Specification Conditions: Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx and Tx path matching, unless otherwise specified.
Preliminary Specification Number : SP-ABZ-F 10 / 19 LoRa Transmitter Specification Symbol IDDT_L IDDT_H_L Description Supply current in transmitter mode Supply current in transmitter mode 9. Power Sequences 9.1 Power Up Sequence Conditions RFOP setting = 14 dBm RFOP setting = 10 dBm Using PA_BOOST pin RFOP setting = 20 dBm Min.
Preliminary Specification Number : SP-ABZ-F 11 / 19 10.
Preliminary Specification Number : SP-ABZ-F 12 / 19 11. Reference circuit C1 C2 10uF 0.1uF C4 1uF C5 0.
Preliminary Specification Number : SP-ABZ-F 13 / 19 12. Tape and Reel packing 2.0±0.1 4.0±0.1 *1 1.5+0.1/-0.0 0.30±0.05 11.5±0.1 13±0.1 24.0±0.3 1.75±0.10 12.1 Dimension of Tape (Plastic tape) 1.5+0.1/-0 12.1±0.1 24.0±0.1 2±0.15 feeding direction (unit : mm) 12.2 Dimensions of Reel Label 5 120 φ13±0.2 R5 10 22 φ 80±1 R135 φ φ330±2 R80 ° W1 W2 Reel inside width W1: 25.5±1.0 Reel outside width W2: 29.5±1.
Preliminary Specification Number : SP-ABZ-F 14 / 19 12.3 Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62μm in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Chip 12.4 Leader and Tail tape Tail tape (No components) Components No components Leader tape (Cover tape alone) 40 to 200mm 150mm min. Feeding direction 250mm min.
Preliminary Specification Number : SP-ABZ-F 15 / 19 - - The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. The cover tape and base tape are not adhered at no components area for 250mm min. Tear off strength against pulling of cover tape : 5N min. Packaging unit : 1000 pcs/ reel Material Base tape : Plastic Reel : Plastic Cover tape, cavity tape and reel are made the anti-static processing. Peeling of force: 1.3N max.
Preliminary Specification Number : SP-ABZ-F 16 / 19 13. Notice 13.1 Storage Conditions Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH. (Packing materials, in particular, may be deformed at the temperature over 40 °C) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used.
Preliminary Specification Number : SP-ABZ-F 17 / 19 Reflow Soldering Standard Conditions (Example) Within 3 s 240 ~ 250 °C 220 °C Cooling down Slowly 180 °C 150 °C Pre-heatin g Within 120 s Within 60 s time(s) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 13.6 Cleaning : Since this Product is Moisture Sensitive, any cleaning is not permitted. 13.
Preliminary Specification Number : SP-ABZ-F 18 / 19 14. Regulatory Statements 14.1 FCC Statements This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Cet appareil est conforme à la section 15 des réglementations de la FCC.
Preliminary Specification Number : SP-ABZ-F 19 / 19 14.2 IC Statements This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence.
Preliminary Specification Number : SP-ABZ-F 20 / 19 CAUTION PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product.
Preliminary Specification Number : SP-ABZ-F 21 / 19 on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples.
