SN2100 Bluetooth Class 1 Module User Manual And Datasheet Version: 0.62 April 10, 2012 Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use.
Revision History Revision Date 0.1 Jul-07-2011 0.5 Nov-15-2011 Author Change Description Release the first datasheet. N. Nagayama Update the block diagram / BT IC product number Update the SyChip Part Number 0.6 Jan-05-2012 Viet H. 0.61 Jan-31-2012 Yong Fang 0.62 Apr-10-2012 JAG SyChip/Murata Confidential Update the spec table Added disclaimer Added packaging, labeling and regulatory information Page 2 of 27 SN2100 Datasheet V0.
Table of Contents 1 SYSTEM DESCRIPTIONS ......................................................................................................................... 5 1.1 1.2 1.3 2 MECHANICAL SPECIFICATIONS ............................................................................................................ 7 2.1 2.2 2.3 2.4 2.5 3 BLUETOOTH SPECIFICATION .................................................................................................................... 13 RF CHARACTERISTICS (TX) ..
LIST OF FIGURES FIGURE 1 SN2100 MODULE BLOCK DIAGRAM .................................................................................................................. 6 FIGURE 2 MODULE TOP AND SIDE VIEW ............................................................................................................................ 7 FIGURE 3 MODULE BOTTOM VIEW .....................................................................................................................................
System Descriptions 1.1 Applications SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with onboard antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO and chip antenna into a small LGA form factor and can be simply dropped into the OEM’s design. The SN2100 offers total 110 dB link budget, which is significantly better than most of the Bluetooth® modules do in the market.
1.3 Block Diagram Figure 1 SN2100 Module Block Diagram SyChip/Murata Confidential Page 6 of 27 SN2100 Datasheet V0.
2 Mechanical Specifications 2.1 Module Dimension Parameter Dimension (LxWxH) Dimension tolerances (LxWxH) 2.2 Typical Unit 17.5 x 16.0 x 2.0 +/- 0.2 mm mm mm Module top and side view UNIT : mm Figure 2 Module Top and Side View SyChip/Murata Confidential Page 7 of 27 SN2100 Datasheet V0.
2.3 Module bottom view Figure 3 Module Bottom View SyChip/Murata Confidential Page 8 of 27 SN2100 Datasheet V0.
2.4 Detailed mechanical data (top view) Figure 4 Detailed Mechanical Data (top view) SyChip/Murata Confidential Page 9 of 27 SN2100 Datasheet V0.
2.5 Module Pin-out Table 1 Module Connector Signal Description Pin # Pin name I/O Description 1 GND - Ground 2 VIN I Module Power Supply 3 Reserved O Internal for debugging use only 4 HCI_CTS I HCI UART Clear-To-Send. Module is allowed to send data when HCI_CTS is low. 5 HCI_TX O HCI UART data transmit 6 HCI_RTS O HCI UART Request-To-Send Host is allowed to send data when RTS is low.
Pin # Pin name I/O Description 29 GND - Ground 30 GND - Ground 31 GND - Ground 32 GND - Ground SyChip/Murata Confidential V0.
3 DC Electrical Specifications 3.1 Typical Power Consumption Table 2 Typical Power Consumption Values Item Condition Units Min Typ Max VIN = 3.0V, TEMP = 25°C - 3.5 - DH1 Packet 50% Rx/Tx slot duty 1 cycle Average VIN = 3.0V, TEMP = 25°C - 60 - mA DH5 Packet 50% Rx/Tx slot duty 1 cycle Average VIN = 3.0V, TEMP = 25°C - 87 - mA TX maximum current VIN = 3.0V, TEMP = 25°C - 150 - mA RX maximum current VIN = 3.0V, TEMP = 25°C - 50 - mA Standby mode send script) 3.
4 RF Specifications 4.1 Bluetooth Specification Parameter Contents Bluetooth Specification Ver.4.0 Channel Spacing 1 MHz The number of channel 79 Power Class 1 4.2 RF Characteristics (TX) VIN = 3.0V, TEMP = 25°C, at 50Ω terminal load connected to the RF connector Table 4 RF Specifications Parameter Min Typ Max - 18 - 2402 - 2480 - MHz - 0.
5150 – 5300 MHz (Operation Mode) SyChip/Murata Confidential V0.
4.3 RF Characteristics (RX) VIN = 3.
5 Environmental Specifications 5.1 Absolute maximum ratings Table 6 Absolute Maximum Rating Symbol Description Min Max Units Top Operating temperature -40 85 C Tst Storage temperature -40 85 C VIN Power supply -0.3 5.0 V MSL Moisture Sensitivity Level RoHS Restriction of Hazardous Substances 5.2 3 Compliant Operation conditions Table 7 Recommended Operating Conditions Symbol Parameter Min Typ Max Units VIN Power supply 2.2 3.0 3.
6 Application Information 6.1 Host PCB layout recommendations The SN3020 module has an onboard antenna therefore it requires some special host PCB layout underneath the module such that the radio can achieve its best RF performance. Refer to Figure 5 for the requirements. Zone 1 Zone 2 Figure 5 Recommended Host Circuit Board Design underneath the Module Notes: 1.
6.2 Module Location For optimum EIRP, customer is advised to use the recommended module location on their respective PCB. 6.2.1Location in x-y plane Antenna Connector No GND in this area (See Fig.8) Antenna Shield Case Figure 6 Recommended Locations in xy-plane Figure 7 Locations Not Recommended in xy-plane SyChip/Murata Confidential V0.
6.2.2 Location in z-plane Metal Module Antenna Connector Antenna Mother Board Metal Figure 8 Recommended Locations in z-plane Metal Metal Metal Figure 9 Locations Not Recommended in xy-plane SyChip/Murata Confidential V0.
7 Assembly Information 7.1 Lead-free soldering reflow profile The lead-free solder reflow profile is recommended in the table & graph below. The profile is used to attach the module to its host PCB. The module is designed to withstand 2 reflows. Opposite side reflow is prohibited due to the module weight.
8 Packaging and Marking Information 8.1 Carrier Tape Dimensions Figure 11 Carrier Tape Dimensions 8.2 Module Marking Information The following marking information may be printed on a permanent label affixed to the module shield or permanently laser written into the module shield itself. The 2D barcode is used for internal purposes. A pin 1 ID is stamped into the shield. Figure 12 Module Marking Detail SyChip/Murata Confidential V0.
9 Ordering Information Table 9 Ordering Information Product Evaluation/Development Kit Module in Tape and Reel SyChip Model Number SyChip Part Number Standard Order Increment SN2100EVK 88-0150-85 1 pc SN2100 88-0150-00 500 pcs 10 RoHS Declaration Given supplier declarations, this product does not contain substances that are banned by Directive 2002/95/EC or contains a maximum concentration of 0.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s).
band, the power must be limited to 10 mW instead of 100 mW. The OEM must account for this and the product must have the alert mark. It does not require country notifications, however. 12 Technical Support Contact SyChip, LLC 2805 Dallas Parkway, Suite 400 Plano, TX 75093 USA Tel: (972) 202-8900 Fax: (972) 633-0327 Note: SyChip, LLC is an operating unit within Murata Wireless Solutions 13 Disclaimer Please read this notice before using the SN2100 product. 1.
i) Please conduct validation and verification of the products in actual condition of mounting and operating environment before commercial shipment of the equipment. ii) Please pay attention to minimize any mechanical vibration or shock, not to drop the product or a substrate that contains the product during transportation.
SyChip’s liability under this warranty shall be limited to products that are returned during the warranty period to the address designated by SyChip and that are determined by SyChip not to conform to such warranty. If SyChip elects to repair or replace such products, SyChip shall have reasonable time to repair such products or provide replacements. Repaired products shall be warranted for the remainder of the original warranty period. Replaced products shall be warranted for a new full warranty period.
