MultiConnect® xDotTM MTXDOT Developer Guide
MULTICONNECT XDOT DEVELOPER GUIDE MultiConnect xDot Developer Guide Models: MTXDOT-NA1-xxx, MTXDOT-EU1-xxx Part Number: S000645, Version 1.0 Copyright This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright © 2016 by Multi-Tech Systems, Inc. Multi-Tech Systems, Inc.
CONTENTS Contents Chapter 1 Product Overview .................................................................................................................................... 6 Overview ....................................................................................................................................................................... 6 Documentation Overview .................................................................................................................................
CONTENTS Antenna Specifications ............................................................................................................................................. 23 RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 24 Coaxial Cable Specifications .....................................................................................................................................
CONTENTS Chapter 9 Labels .................................................................................................................................................... 40 Label Examples............................................................................................................................................................ 40 Chapter 10 Developer Kit Overview .......................................................................................................................
CHAPTER 1 PRODUCT OVERVIEW Chapter 1 Product Overview Overview The MultiConnect xDot (MTXDOT) is a LoRaWANTM, low-power RF device, capable of two way communication over long distances, deep into buildings, or within noisy environments* using the unlicensed ISM bands in North America, Europe and worldwide. The xDot is a compact surface-mount device with an mbed enabled processor and enhanced security.
CHAPTER 1 PRODUCT OVERVIEW Programming the xDot Microcontroller Note: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on a developer board. Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resulting binary file to the mbed USB drive, and reset the xDot. On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot.
CHAPTER 1 PRODUCT OVERVIEW Product Build Options Product Description Package Quantity MTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1 or 100 MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) 100 MTXDOT-EU1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100 MTXDOT-EU1-A01 868 MHz LoRa Module TRC (EU) 100 North America EMEA Developer Kits MTMDK-XDOT-NA1-A00 MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDot MTMDK-XDOT-EU1-A00 MultiConnect xDot Micro Developer Kit - Includes a 868 MH
CHAPTER 2 GETTING STARTED Chapter 2 Getting Started Getting Started with the xDot Developer Kit Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command Reference Guide. Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot and the other is for debug messages.
CHAPTER 2 GETTING STARTED ■ AT Command Port: XR21V1410 USB UART You may need to install a driver for the debug port to function properly. Go to: https://developer.mbed.org/handbook/Windows-serial-configuration Mac On Mac systems, COM ports appear in the Device Manager as: ■ /dev/cu.usbmodemx Where x is a string of numbers and possibly letters, ending in a number. The COM port with lower number is the AT command port and COM port with the higher number is the debug port.
CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS Chapter 3 Mechanical Drawings with Pinouts xDot MultiConnect® xDotTM MTXDOT Developer Guide 11
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Chapter 4 Specifications and Pin Information MTXDOT Specifications Category Description General Compatibility LoRaWAN 1.0 specifications Interfaces Note that pin functions are multiplexed.
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Description Environment Operating Temperature -40° C to +85° C Storage Temperature -40° C to +85° C Humidity 20%-90% RH, non-condensing Power Requirements Operating Voltage 2.4 to 3.57 V Certifications and Compliance EMC and Radio Compliance Safety Compliance EN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012 EN 301 489-03 V1.6.1:2013 ICES-003:2012 FCC 15.247:2015 CISPR 22:2008 FCC 15.109:2015 AS/NZS CISPR 22 FCC 15.
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Description Receive Sensitivity Spreading Factor North America Typical Sensitivity2 EMEA Typical Sensitivity3 6 -111 dBm -121 dBm 7 -116 dBm -124 dBm 8 -119 dBm -127 dBm 9 -122 dBm -130 dBm 10 -125 dBm -133 dBm 11 -127 dBm -135 dBm 12 -129 dBm -137 dBm 1 Greater link budget is possible with higher gain antenna. 2 RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx path.
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Power Draw Note: ■ Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source when determining product load. ■ Transmit power measured with MTXDOT-NA1-xxx transmitting to a MultiConnect Conduit with an MTAC-LORA-915 accessory card installed. ■ Power measurements are similar for MTXDOT-EU1-xxx models. Some 868 MHz sub-band frequencies do not support maximum TXP power of 20.
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Electrical Characteristics Signal Description Min Max Vin Low Input low level -- 0.3 * VDD Vin High Input high level 0.45 * VDD +0.6 -- Vout Low Output low level -- .4 Vout High Output high level 0.4 -- VCC Standard operating voltage 2.4 3.6 ICC Operating current (mA) @5V -- 135 Operating current (mA) @3.
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description Processor Pin Alt1 Processor Pin Alt2 25 9 PB12 SPI2_NSS GPIO / SPI TIM10_CH1/ I2C2_SMBA/ SPI2_NSS/ I2S2_WS/ USART3_CK/ LCD_SEG12 ADC_IN18/ COMP1_INP/ VLCDRAIL2 26 10 PB13 SPI2_SCK GPIO / SPI TIM9_CH1/ SPI2_SCK/ I2S2_CK/ USART3_CTS/ LCD_SEG13 ADC_IN19/ COMP1_INP 28 11 PB15 SPI2_MOSI GPIO / SPI TIM11_CH1/ SPI2_MOSI/ I2S2_SD/ LCD_SEG15 ADC_IN21/ COMP1_INP/ RTC_REFIN 27 12 PB14 SPI2_
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description Processor Pin Alt1 Processor Pin Alt2 46 28 PB9 I2C1_SDA GPIO / I2C TIM4_CH4/ TIM11_CH1/ I2C1_SDA/ LCD_COM3 - 37 29 PA14 MBED SWCLK JTCK-SWCLK - 34 30 PA13 MBED SWDIO JTMS-SWDIO - 33 31 PA12 UART1_RTS GPIO / UART USART1_RTS/ SPI1_MOSI USB_DP 32 32 PA11 UART1_CTS GPIO / UART USART1_CTS/ SPI1_MISO USB_DM 7 33 NRST NRESET - - 10 34 PA0-WKUP1 GPIO / WAKE TIM2_CH1_ET
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description Processor Pin Alt1 Processor Pin Alt2 38 PA15 LORA_NSS LORA Radio 11 PA1 LORA_RESET LORA Radio 39 PB3 LORA_SCK LORA Radio 22 PB11 SE_CLK Secure Element 19 PB1 SE_CTRL Secure Element 21 PB10 SE_IO Secure Element 2 PC13-WKUP2 SE_RESET Secure Element 44 BOOT0 Boot0 - - 3 PC14OSC32_IN(4) RTC_CLK - OSC32_IN 4 PC15OSC32_OUT RTC_CLK - OSC32_OUT 5 PH0OSC_IN(5) Main 24M
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION xDot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations. ■ All pins that go to connectors are directly connected to the processor. ■ Refer to Pin Information table for pull up and pull down information. xDots allow you to program pins depending on your application: ■ Serial: Available out of the box. See Serial Pinout Notes for details.
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION The following table provides example settings and the theoretical maximum range based on these settings. Example 18dB Transmit Power for 915 MHz Models Units Example 14dB Transmit Power for 868MHz Models Frequency 915 MHz 868 TX Power 19 dBm 14 3 dB 3 RX Sensitivity -120 dBm -120 RX Antenna Gain 3 dB 3 Fade Margin2 30 dB 30 Distance 8.14 Miles 5.41 Distance 13.08 Km 8.
CHAPTER 5 ANTENNAS Chapter 5 Antennas Antenna System The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. If changes are made to the device's certified antenna system, then recertification will be required.
CHAPTER 5 ANTENNAS Pulse Electronics Antenna Manufacturer: Pulse Electronics Description: 868-915 MHz RP-SMA Antenna, 8" Model Number: W1063 MultiTech Part Number: 45009830L MultiTech ordering information: Ordering Part Number Quantity AN868-915A-1HRA 1 AN868-915A-10HRA 10 AN868-915A-50HRA 50 Antenna Specifications Category Description Frequency Range 868-928 MHz Impedance 50 Ohms VSWR < 2.0 Gain 3.
CHAPTER 5 ANTENNAS Category Description Polarization Vertical RSMA-to-U.FL Coaxial Cables Coaxial Cable Specifications Optional antenna cables can be ordered from MultiTech Cable Type Coaxial Cable Attenuation <1.
CHAPTER 5 ANTENNAS Ethertronics Chip Antenna This is the developer board's default antenna. Manufacturer: Ethertronics Description: 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount Model Number: M620710-1K Datasheet: http://www.ethertronics.com/files/2914/0652/9246/2Savvi_M620710_ISM__6x2.pdf Antenna Specifications Category Description Electrical Specifications Frequency Range 902—928 MHz Peak Gain 2.
CHAPTER 5 ANTENNAS Stackup Table Impedance Polar trial balance (L1 refer to L2) impedance 50.87 ohms, using 11 mil tracs, 22mil space.
CHAPTER 5 ANTENNAS Polar trial balance (L1 refer to L2/L4 refer to L3) impedance 93.54 ohms, using 8 mil tracs, 7mil space.
CHAPTER 5 ANTENNAS Chip Antenna Design Guidelines When designing antenna placement for the chip antenna, note the following: ■ The antenna's long side must be along the edge of the ground plane. ■ Remove the ground plane from all layers below the antenna. ■ The distance from the antenna to the enclosure or plastic cover should be greater than 1.5 mm. The distance from the antenna to relatively large perturbations, such as a shield or large components, depends on the height of surrounding components.
CHAPTER 5 ANTENNAS Antenna Pad Layout PCB Layout MultiConnect® xDotTM MTXDOT Developer Guide 29
CHAPTER 5 ANTENNAS OEM Integration FCC & IC Information to Consumers The user manual for the consumer must contain the statements required by the following FCC and IC regulations: 47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4. FCC Grant Notes The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may be necessary. FCC Definitions Portable: (§2.
CHAPTER 6 SAFETY INFORMATION Chapter 6 Safety Information Handling Precautions To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellular device. Although input protection circuitry has been incorporated into the devices to minimize the effect of static build-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting the device.
CHAPTER 6 SAFETY INFORMATION ■ Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sont susceptibles d'être utilisés. Interference with Pacemakers and Other Medical Devices Potential interference Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI).
CHAPTER 7 REGULATORY INFORMATION Chapter 7 Regulatory Information EMC, Safety, and R&TTE Directive Compliance The CE mark is affixed to this product to confirm compliance with the following European Community Directives: Council Directive 2014/30/EU on the approximation of the laws of Member States relating to electromagnetic compatibility; and Council Directive 2014/35/EU on the harmonization of the laws of Member States relating to electrical equipment designed for use within certain voltage limits; and
CHAPTER 7 REGULATORY INFORMATION MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified. To ensure this level of compliance, the software code is provided in binary form only. Users are prohibited from making any changes that affect the operation of the radio performance.
CHAPTER 8 ENVIRONMENTAL NOTICES Chapter 8 Environmental Notices Waste Electrical and Electronic Equipment Statement Note: This statement may be used in documentation for your final product applications. WEEE Directive The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to takeback electronics products at the end of their useful life.
CHAPTER 8 ENVIRONMENTAL NOTICES REACH Statement Registration of Substances After careful review of the legislation and specifically the definition of an “article” as defined in EC Regulation 1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view Multi-Tech Systems, Inc. products would be considered as “articles”. In light of the definition in § 7.
CHAPTER 8 ENVIRONMENTAL NOTICES Restriction of the Use of Hazardous Substances (RoHS) Multi-Tech Systems, Inc. Certificate of Compliance 2011/65/EU Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS).
CHAPTER 8 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc.
CHAPTER 8 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards (in Chinese) 依照中国标准的有毒有害物质信息 根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准－中华人民共和国《电子信息产品污染 控制管理办法》（第 39 号），也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc.
CHAPTER 9 LABELS Chapter 9 Labels Label Examples Note: Actual labels vary depending on the regulatory approval markings and content. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The label shown is not the actual size. 1 - MultiTech Model Identification.
CHAPTER 10 DEVELOPER KIT OVERVIEW Chapter 10 Developer Kit Overview xDot Developer Kit The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application.
CHAPTER 10 DEVELOPER KIT OVERVIEW xDot Developer Kit Mechanical Drawings Note: The Reset and Wake buttons reset and wake the xDot processor.
CHAPTER 10 DEVELOPER KIT OVERVIEW Micro Developer Board LEDs LED Description LED1 User-definable LED. LED3/SDA Programming Status. LED2/PWR Power, blue light when the board has power. LED4/PROXY LED for the proximity sensor, which is next to it (labeled U14 on the top assembly diagram).
CHAPTER 11 DEVELOPER BOARD SCHEMATICS Chapter 11 Developer Board Schematics Assembly Diagrams and Schematics Assembly Diagrams Top 44 MultiConnect® xDotTM MTXDOT Developer Guide
CHAPTER 11 DEVELOPER BOARD SCHEMATICS Bottom MultiConnect® xDotTM MTXDOT Developer Guide 45
CHAPTER 11 DEVELOPER BOARD SCHEMATICS Schematics 46 MultiConnect® xDotTM MTXDOT Developer Guide
CHAPTER 11 DEVELOPER BOARD SCHEMATICS MultiConnect® xDotTM MTXDOT Developer Guide 47
CHAPTER 11 DEVELOPER BOARD SCHEMATICS 48 MultiConnect® xDotTM MTXDOT Developer Guide
CHAPTER 11 DEVELOPER BOARD SCHEMATICS MultiConnect® xDotTM MTXDOT Developer Guide 49
CHAPTER 12 DESIGN CONSIDERATIONS Chapter 12 Design Considerations Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing.
CHAPTER 12 DESIGN CONSIDERATIONS ■ Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. ■ Locate cables and connectors to avoid coupling from high frequency circuits. ■ Lay out the highest frequency signal traces next to the ground grid. ■ If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground plane covers all traces. ■ Minimize the number of through-hole connections on traces carrying high frequency signals.
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Chapter 13 Mounting xDots and Programming External Targets Mounting the Device on Your Board A footprint diagram is included on the xDot Mechanical Diagram. Solder Profile Solder Paste: SAC NC 254 Note: Calculate slope over 120 seconds 52 Name Low Limit High Limit Units Max Rising Slope (Target=1.0) 0 2 Degrees/Second Max Falling Slope -2 -0.
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Setpoints (Celsius) Zone 1 2 3 4 5 6 7 Top 130 160 170 190 230 245 255 Bottom 130 160 170 190 230 245 255 Conveyer Speed 32.0 inch/minute Max Rising Slope Max Falling Slope Soak Time 150170C Peak Temp Total Time /218C TC Position Slope PWI Slope PWI Time PWI Temp PWI Time PWI 1 1.38 38% -0.63 45% 28.82 -8% 240.22 -30% 43.61 -55% 2 1.38 38% -0.75 32% 26.75 -22% 241.21 -17% 43.
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS 3. 1 When the xDot developer board detects a target voltage on Pin 1 of header JP1, it redirects the mbed programming interface to the external target. You can use the mbed programming environment as normal to program and debug the external target. MultiTech recommends the Samtec FFSD-05-D-06.00-01-N ribbon cable. JTAG/SWD Connector The developer board uses an unshrouded 10-pin header.
INDEX Index schematics Developer Board ...................................................44 A antenna ....................................................................22 23 developer board ......................................................25 antenna design guidelines ............................................28 assembly diagrams Developer Board ......................................................44 AT command port ............................................................................
INDEX labels .............................................................................40 Linux ................................................................................9 LoRa range ........................................................................20 related products..............................................................6 ribbon cable ..................................................................53 RoHS.............................................................................
