i CPX8216 and CPX8216T Installation and Use 6806800A52C October 2008 Edition
© Copyright 2008 Emerson All rights reserved. Trademarks Emerson, Business-Critical Continuity, Emerson Network Power and the Emerson Network Power logo are trademarks and service marks of Emerson Electric Co. © 2008 Emerson Electric Co. All other trademarks are the property of their respective owners. PICMG®, CompactPCI®, AdvancedTCA® and the PICMG, CompactPCI and AdvancedTCA logos are registered trademarks of the PCI Industrial Computer Manufacturers Group.
Safety Summary The following general safety precautions must be observed during all phases of operation, service, and repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual could result in personal injury or damage to the equipment. The safety precautions listed below represent warnings of certain dangers of which Emerson is aware.
Flammability All Emerson PWBs (printed wiring boards) are manufactured with a flammability rating of 94V-0 by ULrecognized manufacturers. EMI Caution Caution ! Caution This equipment generates, uses and can radiate electromagnetic energy. It may cause or be susceptible to electromagnetic interference (EMI) if not installed and used with adequate EMI protection. CE Notice (European Community) Warning ! This is a Class A product.
FCC Class A This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Contents About This Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix Overview of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix Summary of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xx Comments and Suggestions . . . . . . . . . . . . . . . . . .
Contents Device Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3 Platform Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parts of the Chassis . . . . . . . . . . . . . . . . .
Contents Weight Distribution Within a Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing the Chassis in a Frame Relay Rack/Cabinet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing the Chassis in an EIA Equipment Rack/Cabinet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connecting the Chassis Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents Removing a Carrier Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hot Swap IDE Drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing an IDE Carrier Frame and Assigning Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabling the IDE Carrier Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents Primary (Front) Side CPU Slot Connectors (7 and 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Secondary (Rear) Side I/O Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Primary (Front) Side I/O Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Primary (Front) Side (Slots 1-6 and 11-16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents xii CPX8216 and CPX8216T Installation and Use (6806800A52C)
List of Figures Figure 2-1. Bus Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 2-2. CPX8216 Standard Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2-3. CPX8216T (H.110) Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2-4. CPX8216 I/O Bus Connectivity . . . . . . . . . . . . . . . . . . . . .
List of Figures xiv CPX8216 and CPX8216T Installation and Use (6806800A52C)
List of Tables Table 3-1. Alarm LED Color and Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 3-2. DC Analog Voltages for H.110 Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 6-1. System Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Table 6-2. Telco Alarm Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Tables Table 10-31. P3 Connector, CPU Transition Slots 7 and 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 10-32. ALARM Connector Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 10-33. PS1, PS2, and PS3 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 10-34. Fan Module Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 10-35. H.
About This Manual The CPX8216 and CPX8216T Installation and Use manual is written for system installers and administrators. Software developers, system integrators, and service and support personnel will also benefit from the reference information contained in this book. This manual presents a technical discussion of installation requirements and procedures, as well as operating information and reference material. The information in this manual applies to these models.
About This Manual Chapter 10, Pin Assignments, provides pin assignments and signal descriptions for the backplane interconnects, power, and other interface connectors Appendix A, Specifications, describes the mechanical, electrical, and power supply characteristics of the CPX8216 chassis. Appendix B, Systeminstallationsanleitung, describes the system installation procedures in the German language. Appendix C, Related Documentation, lists Emerson, vendor, and specification documents and how to access them.
About This Manual Conventions Used in This Manual The following typographical conventions are used in this document: bold is used for user input that you type just as it appears; it is also used for commands, options and arguments to commands, and names of programs, directories and files. italic is used for names of variables to which you assign values, for function parameters, and for structure names and fields. Italic is also used for comments in screen displays and examples, and to introduce new terms.
About This Manual xx CPX8216 and CPX8216T Installation and Use (6806800A52C)
1 Introduction 1 Overview The CPX8000 Series Platforms, when combined with the appropriate software, are designed for critical telecommunications infrastructure applications that need to meet five-nines (99.999%) availability. These platforms have built-in redundancy for active system components—including system-slot CPU boards—enabling active modules to be exchanged for repair or upgrade while the system continues to operate.
Chapter 1 Introduction In addition, the CPX8216T has the following additional features: 2 ■ H.110 across P4 on the backplane ■ BAT and Ring voltage connectors on the H.
2 System Architecture 2 Overview The CPX8000 Series Platform is designed to be fully compliant with the CompactPCI Hot Swap Specification developed by the PCI Industrial Computers Manufacturing Group (PICMG). With the proper software support and testing, it should be possible to integrate all proprietary and third-party I/O modules which are compatible with this specification.
Chapter 2 System Architecture For further information on domain control or ownership, see the section, Hot Swap Controller on page 8. Figure 2-1. Bus Domains Alarm Controls Bus A Bus B Drive Bays Domain A Domain B Domain A/B P o w e r S u p p l y / F a n Tr a y s 4279 0504 Platform Layout The CPX8216 is a 16-slot, high-availability CompactPCI chassis with two separate 6-slot CompactPCI I/O domains and the capability to contain redundant CPU modules and redundant Hot Swap Controller (HSC) modules.
Chapter 2 System Architecture CPX8216 Standard Layout The CPX8216 chassis consists of two 8-slot subsystems, or domains, each with two slots for the host processor and six slots for nonhost CompactPCI boards. The HSC board mounts in the rear of the chassis, behind the secondary CPU slot. The next figure provides a diagram of this configuration. Figure 2-2.
Chapter 2 System Architecture CPX8216T (H.110) Layout The CPX8216T H.110 chassis consists of two 8-slot subsystems, or domains, each with one slot for the host processor, one slot for the front-loaded HSC, and six slots for nonhost CompactPCI boards. The next figure provides a diagram of this configuration. Figure 2-3. CPX8216T (H.
Chapter 2 System Architecture Bus Access and Control In the fully redundant configuration, the CPU in the left system slot, CPU A, is associated with the HSC in the right HSC slot, HSC A (note that HSC A actually sits on the Domain B bus). There is a local connection between each CPU-HSC pair that allows the CPU in one domain to control the other domain through its HSC. This architecture is illustrated in the following figure. Figure 2-4.
Chapter 2 System Architecture Hot Swap Controller Each of the nonhost slots in the chassis can be controlled from either HSC. When an HSC has control over a domain, it has control over the nonhost boards in that domain. Each host processor/bridge pair is controlled as a single item by the other processor/bridge pair. The bridge and the host processor are linked together so that both must be present for power to be applied. A host processor cannot be operated without its HSC.
Chapter 2 System Architecture System Processor Configurations The CPX8216 is a flexible platform that allows for multiple configurations of processor control, I/O redundancy, and peripheral configurations.
Chapter 2 System Architecture The Active/Passive Configuration In the active/passive configuration, one CPU manages all twelve I/O slots, much like in the simplex configuration. In addition, the second CPU serves as a warm standby, ready to run the system in the event of a failure on the active system. The active/passive configuration is illustrated in the following figure. Figure 2-6.
Chapter 2 System Architecture The active/active configuration is illustrated in the following figure. Figure 2-7. Active/Active Configuration CPU HSC Bridge I/O Slot None A B I/O Domain A B A I/O Domain B 4287 0504 Note H.110 traffic and HA Linux do not support a load-sharing configuration. I/O Configurations The CPX8216 contains two independent 8-slot CompactPCI buses. One slot in each bus is dedicated to a system processor, and another is needed for the HSC.
Chapter 2 System Architecture CPU Complex Architecture The CPU complex in the CPX8216 contains two CPU modules and their corresponding Hot Swap Controller (HSC) modules. The figure below illustrates the architecture, including elements on the boards as well as local connections between the CPU modules and the PCIto-PCI (P2P) connections to the local CompactPCI buses.
Chapter 2 System Architecture Board Insertion and Extraction Features The PICMG Specification details software and hardware features in order to support hotswapping of I/O boards.
Chapter 2 System Architecture Typical Insertion and Extraction Processes Many of the steps in the insertion and extraction processes are automated by software. After the operator installs a board, it automatically advances to P1, see The Hot Swap Process. The hardware connection process proceeds automatically and asserts the ENUM# signal to initiate the software connection process.
Chapter 2 System Architecture Physical Connection Process The physical connection process is the basic process of putting a board into a live chassis, or physically removing the board. The process includes two states: ■ P0 - The board is physically separate from the chassis ■ P1 - The board is fully seated, but not powered, and not active on the PCI bus. All pins are connected. Hardware Connection Process The hardware connection process involves the electrical connection or disconnection of the board.
Chapter 2 System Architecture Software Disconnection Process The software disconnection process defines two additional states which are used when quiescing activity on a board in preparation for extraction: ■ S3Q - The software is completing current operations, but is not allowed to start new ones. When current operations are completed, the board transitions to S2. ■ S2Q - The board is quiesced. This is the same state as S2, except that no new operations are allowed to be initiated.
3 Platform Description 3 Overview This chapter provides a description and reference information for the various subassemblies of the CPX8216 and CPX8216T chassis. It covers only those items associated with the chassis enclosure. For information about CompactPCI board components, refer to the appropriate chapter in this manual. Following is a list of the chassis components covered in this chapter: ■ Parts of the Chassis ■ CompactPCI Card Cage Reference ■ Backplane Reference ■ H.
Chapter 3 Platform Description Parts of the Chassis Figure 3-1.
Chapter 3 Platform Description CompactPCI Card Cage Reference Industry standard CompactPCI cardguides are used for the front controller boards and rear transition boards. The CPU slot is identified with red guide rails, the I/O slots with black rails, and the Hot Swap Controller/Bridge slots with tan rails. Figure 3-3.
Chapter 3 Platform Description Backplane Reference The backplane provides the interconnect for all 16-slots, 6U CompactPCI bus, N+1 power distribution, alarm signal distribution, and IDE device signal/status distribution. All sixteen CompactPCI slots accept any standard 6U CompactPCI board or transition module which meet IEEE 1101.1, IEEE 1101.10, and IEEE1101.11 specifications. The slots are 64-bit, 33 MHz PCI compliant. Figure 3-5.
Chapter 3 Platform Description H.110 Bus Connectors—CPX8216T Chassis Only On each domain, the H.110 bus passes through connector P4 across the I/O and HSC slots. It does not connect to the CPU slot. Figure 3-6. The CPX8216 H.110 Bus P5 P4 H.
Chapter 3 Platform Description Alarm Display Panel The alarm display panel provides the chassis LEDs and remote alarm functions for the CPX8216 and the CPX8216T. It is powered and controlled from each of the two Hot Swap Controllers within the chassis (see Figure 3-7). In order to provide a uniform appearance, without depending on individual board manufacturers, the CPX8216 contains a separate alarm display panel, which runs across the top of the chassis.
Chapter 3 Platform Description The alarm display panel LEDs are controlled by bits in the Hot Swap Controller’s register, which are set by the system software. This allows full user customization of alarm event reporting. The next table provides the color and standard nomenclature for the LEDs on the alarm panel. Table 3-1.
Chapter 3 Platform Description Power Distribution Panel The power distribution panels, located in the rear of the chassis below the transition module card cage, distribute the AC or DC input power to the chassis’ power supplies. The following section describes the characteristics of the AC and DC power distribution panels for CPX8216 and CPX8216T chassis. The CPX8000 series chassis provides for the following power inputs. Warning ! Warning ■ Single Input AC ■ Dual Input DC ■ Dual Breaker DC ■ H.
Chapter 3 Platform Description Dual Breaker DC Power Distribution Panel (CPX8216) The dual breaker 48VDC version also allows redundant input power supplies for full highavailability applications. It is recommended that each input source be independent of the other. This power distribution panel has two 30A push/pull circuit breakers and is designed for use with a Smart cable that includes breakers and additional circuitry that detect the failure of a single input DC power supply. Figure 3-11.
Chapter 3 Platform Description The analog voltages on the H.110 bus are: Table 3-2. DC Analog Voltages for H.110 Bus Description Voltage Inputs Battery -48V DC Return Nominal 48V, range of 40V to 72V Ringing 90 VAC nominal SELV 24V DC nominal, range of <60V Use 12 AWG or larger wire with a #10 ring terminal to connect the DC chassis power source to the chassis. Use 12 AWG or larger wire with a #6 ring terminal to connect the DC TNV voltages to the H.110 power connectors. Figure 3-13.
4 Site Preparation 4 Overview This chapter discusses the proper placement recommendations, environmental conditions, and installation options for the CPX8216 and CPX8216T chassis. Safety and Regulatory Compliance The base chassis complies with the safety and regulatory standards applicable to componentlevel equipment. It is possible to use this product with other components that produce a chassis not in compliance with chassis guidelines.
Chapter 4 Site Preparation Preparing the Site for Installation This section provides the necessary instructions and information for installing the CPX8216 chassis. Guidelines for Chassis Location Before you begin to set up and cable your new chassis, consider these guidelines: ■ Locate the chassis in a stable area free of excess movement and jarring ■ Install the chassis safely.
Chapter 4 Site Preparation Guidelines for Branch Circuits All branch circuits for the chassis must come from the same circuit breaker panel. Failure to do this can cause power to flow in the data cables interconnecting the various devices of the chassis. Do not overload branch circuits. Check the manual and/or rating plate of all devices and verify that the sum of the ampere ratings do not exceed two-thirds of the branch rating.
Chapter 4 Site Preparation Power Cords Emerson chassis have detachable power cords that you can plug in at both the wall socket and the equipment. Place the chassis within six feet of the electric receptacle. Note Do not use extension cords. Cables The CPX8216 chassis, console, and some other peripherals use shielded cables. You can successfully use shielded cables for communication over extended distances.
Chapter 4 Site Preparation Environmental Considerations When installing the chassis in a particular environment, keep the environmental specifications of the chassis in mind, you can refer to Appendix A, Specifications for more information. For example, floppy and hard disk drives typically do not operate reliably above 50º C (122º F) ambient temperature. In an enclosed environment, you need to consider the internal temperature rise over the worst case external ambient temperature.
Chapter 4 Site Preparation 32 CPX8216 and CPX8216T Installation and Use (6806800A52C)
5 Chassis Installation 5 Overview This chapter discusses the installation options for the CPX8000 Series Platforms. The following topics are discussed in this chapter.
Chapter 5 Chassis Installation Note The CPX8216 has one ESD bonding point on the front of the chassis, and one on the back of the chassis. Mounting Hole Locations This section provides mechanical drawings to aid in determining the correct mounting brackets and locations for your application. Included is information on the 19" and 23" EIA or frame relay rack/cabinets. The following illustrations show typical mounting hole locations on the rear and side views of the chassis enclosure.
Chapter 5 Chassis Installation Mounting Dimension for a 19" Frame Relay or EIA Rack The next illustration shows the mounting hole locations and the positioning of the brackets for mounting a chassis in a 19" frame relay rack/cabinet. Figure 5-1.
Chapter 5 Chassis Installation Mounting Dimension for a 23" Frame Relay or EIA Rack The next illustration shows the mounting hole locations and the positioning of the brackets for mounting a chassis in a 23" frame relay rack/cabinet. Note When mounting the chassis in an EIA equipment rack, extension brackets need to be obtained from your rack manufacturer. Figure 5-2. 23" Rack Mounting Dimensions 5.00 6.09 .09 2.90 07-W5432C01A TOP VIEW 23.00 22.33 .40 6.26 5.37 17.20 2.66 5.25 Use 4 Screws 20.
Chapter 5 Chassis Installation Installing the Chassis in a Frame Relay Rack/Cabinet The CPX8216 chassis can be mounted in either a 19" or 23" Frame Relay rack/cabinet, which are common in Central Office locations. In this configuration, the CPX8216 is held along the center of the rack with optional mounting brackets, providing a balanced weight distribution on the chassis and aiding in reliability of the chassis when subject to earthquake, shock, or vibration.
Chapter 5 Chassis Installation 5. Attach two mounting brackets to the rear mounting holes on the sides of the CPX8216 chassis (see the figure on page 38). ■ For 19" racks, the long side of the bracket should be fastened to the chassis ■ For 23" racks, the short side of the bracket should be fastened to the chassis 6. Secure the rear mounting bracket to the rack with the remaining eight Phillips head screws.
Chapter 5 Chassis Installation Installing the Chassis in an EIA Equipment Rack/Cabinet The CPX8216 can be mounted in a 19" or 23" EIA equipment rack/cabinet. If installing the chassis in a 19" rack/cabinet, no additional mounting equipment is necessary. The preferred method of mounting the CPX8216 chassis is to use the mid-mount brackets, as seen in the previous illustration. However, the CPX8216 chassis may be mounted in an EIA equipment rack/cabinet using only the front mounting flange ears.
Chapter 5 Chassis Installation Connecting the Chassis Cables Often, to avoid damage during shipping, all external cables are removed before packing. Refer to the following illustrations and instructions to connect the cables to the chassis. Connecting the Chassis Power Source Follow these steps to connect your chassis to either AC or DC power. Note You can find more information on the power distribution panels and cabling requirements for the CPX8216 in Chapter 3, Platform Description 1.
Chapter 5 Chassis Installation Use either a standard DC Smart cable or the optional right-angle Smart cable (for limited space requirements) to connect the DC power source to the chassis. Cable length is 10 feet. Part Number Cable Description CPX8200SMTCON5E HA, DC Smart cable CPX8200SMTCBL15E Right-angle DC Power Sense Cable 3. If you are cabling a CPX8216T chassis, connect the H.110 BAT and Ring voltage connectors to an approved TNV voltage source.
Chapter 5 Chassis Installation 5. Attach the other end of the SCSI cable to the SCSI connector on the back of the floppy housing Note Typically, the Domain A SCSI controller cable will attach to the upper SCSI connector, and the Domain B SCSI controller cable will attach to the lower connector (if present). Your chassis may be configured differently. Connecting a Serial Console This section will help Different boards used with the CPX8216 platform may have different console interfaces and defaults.
Chapter 5 Chassis Installation 3. Connect the keyboard and mouse cables into the correct ports on the split end of the keyboard and mouse adapter cable. Plug all power cords into a grounded, surge-protected power source.
Chapter 5 Chassis Installation 44 CPX8216 and CPX8216T Installation and Use (6806800A52C)
6 Chassis Operations 6 Overview This chapter provides the basic operating procedures for the CPX8216 chassis. For softwarespecific information or information regarding the operation of third-party and add-on components, please refer to the product’s vendor documentation.
Chapter 6 Chassis Operations Note The voltage on the rating label adjacent to the power receptacle must agree with the type of line or cord and the applied voltage. 4. Flip the rocker switch in the rear of the chassis to | (ON). Recommended Power-Off Procedure To shut down your CPX8216 chassis, follow these steps. 1. Shut down all software operations and the operating system. For dual-configured chassis, both domains must be shut down. 2. Flip the rocker switch in the rear of the chassis to O (OFF).
Chapter 6 Chassis Operations Input Power Rocker Switch The input power rocker switch is located on the Power Distribution Panel at the rear of the chassis. See the following figure. Figure 6-1. Input DC Power Rocker Switch -48 VDC ON -48 VDC ON -48 VDC RTN -48 VDC RTN 2572 9907 It has two states: ON and OFF.
Chapter 6 Chassis Operations These indicators are controlled by the system software and are configured by the user. The following table provides the color scheme for the system status indicators. Table 6-1. System Status Indicators LED Color System In Service Green Component Out of Service Yellow System Out of Service Red Telco Alarm Indicators The Telco alarm LEDs are located in the upper-right corner of the alarm board as shown in the next figure. Figure 6-3.
Chapter 6 Chassis Operations CompactPCI Slot Status Indicators Each CompactPCI slot has three status indicators located above it on the alarm board. Note An overlay covers the bottom LED and makes two LEDs visible to the user. Figure 6-4.
Chapter 6 Chassis Operations Power Supply/Fan Indicators Each power supply/fan is equipped with four status LEDs on the front panel. Figure 6-5. Power Supply/Fan Status Indicators POWER IN OUT OF SERVICE SERVICE FAN IN OUT OF SERVICE SERVICE 2437 0900 The next table describes the functions of each power supply LED. Table 6-4.
Chapter 6 Chassis Operations Drive Indicators The drive status indicators are located on the front of the hot-swap drive carrier (they are not available on drives mounted in a standard carrier). Figure 6-6. Drive Status Indicators Drive Activity Keyswitch Out-of-Service In-Service 2438 0900 The next table provides a functional description of the drive LED activity. Table 6-5. Drive Status Indicators LED Color Description Drive Activity Yellow Illuminates when the drive is engaged.
Chapter 6 Chassis Operations The illustration below shows the S2 location of the rotary switch and J14 header. Figure 6-7. S2 Switch Location and J14 Header S2 1 BCD J14 89 A 0 1 EF 2 67 34 5 2 J4 J5 J3 J2 J1 S2 U28 J14 J10 J7 J13 J11 J12 2963 0601 Table 6-6.
Chapter 6 Chassis Operations Table 6-6.
Chapter 6 Chassis Operations Fans should be put in temperature controlled mode to reduce the noise level of the chassis. This is done using API calls supplied by the operating system software. The chassis is designed with N+1 cooling. If one fan fails, the chassis may operate at normal operating temperatures up to 45° C air inlet temperature. Note that this is below the maximum operating temperature of 55° C. The fans are mounted on the front of the fan/power supply sled.
Chapter 6 Chassis Operations Cooling Monitoring Input air temperature is monitored by cooling sensors located on the power supply/fan sled in back of the fan. Two temperature trip points are hard-wired into the sensors.
Chapter 6 Chassis Operations 56 CPX8216 and CPX8216T Installation and Use (6806800A52C)
7 Installing Boards in the Chassis 7 Before You Install or Remove a Board Boards may be damaged if improperly installed or handled. Please read and follow the guidelines in this section to protect your equipment. Observe ESD Precautions ESD Use ESD Wrist Strap Emerson strongly recommends that you use an antistatic wrist strap and a conductive foam pad when installing or upgrading a system.
Chapter 7 Installing Boards in the Chassis When inserting or removing a board in a slot adjacent to other boards, use extra caution to avoid damage to the pins and components located on the primary or secondary sides of the boards.
Chapter 7 Installing Boards in the Chassis Recognize Different Injector/Ejector Lever Types The modules you install may have different ejector handles and latching mechanisms. The following illustration shows the typical board ejector handles used with ECC payload cards: (A) Elma Latching, (B) Rittal Type II, (C) Rittal Type IV. All handles are compliant with the CompactPCI specification and are designed to meet the IEEE1101.10 standards. Figure 7-1.
Chapter 7 Installing Boards in the Chassis The following table lists the colors and glyphs common to ECC chassis. Table 7-1.
Chapter 7 Installing Boards in the Chassis Refer to the following illustration and perform these steps when installing modules. Note that this illustration is for general reference only and may not accurately depict the connectors and handles on the board you are installing. Stage 2 (Detail) J5 P5 J5 P5 J4 P4 J4 P4 J3 P3 J3 P3 J2 P2 J2 P2 J1 P1 J1 P1 4200 0804 Stage 1 Stage 2 Stage 3 1.
Chapter 7 Installing Boards in the Chassis To remove a board module, follow these steps: 1. Loosen the module’s captive screws at both ends of the faceplate. 2. Begin to remove your module by unlatching the ejector lever closest to the blue LED (the lower lever on vertically mounted boards). See Recognize Different Injector/Ejector Lever Types on page 59. Do not remove the module immediately.
Chapter 7 Installing Boards in the Chassis Installing a Transition Module Transition modules provide the interface between the standard parallel port, EIDE port, floppy port, keyboard/mouse port, and the serial port connectors, and the CompactPCI Single Board Computer module.All port I/O controllers reside on the Single Board Computer module. All port circuitry on the transition module is passive, except for serial ports 3 and 4, whose circuitry provides multiplexing and buffering functions.
Chapter 7 Installing Boards in the Chassis 5. Connect the power cable to the AC power source. BACKPLANE MCP750 TMCP700 2089 9804 For detailed information on configuring your transition module, refer to the manual specific to your hardware.
8 Drive Removal and Installation 8 Introduction The CPX8216 is equipped with a front peripheral bay that can accommodate up to four drives of a variety of types: SCSI or IDE, 3.5-inch or 5.25-inch, removable-media or hard disk drives. The first part of this chapter discusses the hot swapping of IDE and SCSI hard disk drives when the drives are mounted in a hot swap drive carrier and have supporting software for hot swap.
Chapter 8 Drive Removal and Installation These procedures for working with hot swap drive modules are covered in the next several sections. Please read this information before attempting to replace your drives. ■ Overview of Carrier Frames ■ Hot Swap IDE Drives ■ Hot Swap SCSI Drives Overview of Carrier Frames The carrier frame provides the connectivity between the hot swap drive carrier and the system. There are two types of drive carrier frames, one for SCSI carriers and another for IDE carriers.
Chapter 8 Drive Removal and Installation Hot Swap IDE Drives This section provides information specifically for the IDE drive. It details the procedures for: installing and cabling an IDE carrier frame, setting domains, and installing an IDE drive into an IDE drive carrier, and finally installing the drive module in the chassis.
Chapter 8 Drive Removal and Installation Drive Type Configuration Notes Notes 1. Installing both jumpers allows both processors to notice a particular hard drive is present even though only one processor can read the data from the drive. This enables the A processor to acknowledge the drive in the B domain, and the B processor to acknowledge the drive in the A domain. This is done by routing a drive present bit to the HSC if the associated signal cable is also installed.
Chapter 8 Drive Removal and Installation Cabling the IDE Carrier Frame This section describes the cabling of the IDE carrier frame to the system. Follow these steps to cable your carrier frame. 1. If necessary, remove the floppy housing from the rear of the chassis, refer to Floppy Housing Removal and Installation on page 98. 2. Connect a power cable to the backplane power connector (PWR1, PWR2, PWR3, or PWR4). Each connector provides two ground connections plus a +5V and a +12V output.
Chapter 8 Drive Removal and Installation 7. Connect the other end of the IDE drive cable to the hot swap carrier frame using these guidelines.
Chapter 8 Drive Removal and Installation 2. When the yellow status LED illuminates, pull the drive module straight out of the drive bay. 3. Pull off the top and bottom covers from the drive carrier. 4. Remove the four mounting screws from the sides of the drive. 5. Push the drive up through the carrier and disconnect all signal and power cables from the drive. 6. Configure the replacement drive.
Chapter 8 Drive Removal and Installation 7. Connect the drive activity cable, see the following illustration for cable location. Hard Drive—FRONT VIEW J6 Activity LED Cable Location Wire Color Drive Activity Cable Detail Red Black Signal LED (or POWER) Ground Note The location of the activity LED header varies depending upon the manufacturer of your drive. Refer to your drive vendor’s documentation for the exact location.
Chapter 8 Drive Removal and Installation Installing the IDE Hot Swap Drive Module Before performing this procedure, you must have installed the carrier frame in the drive bay and installed the drive into the hot swap drive carrier. 1. Make sure you have configured the drive identification on the back of the drive carrier. Refer to page 72 for steps on setting the drive identification.
Chapter 8 Drive Removal and Installation Hot Swap SCSI Drives This section provides information specifically for the SCSI drive. It details the procedures for: installing and cabling a SCSI carrier frame, setting domains and addresses, installing a drive into a SCSI drive carrier, and finally installing the drive module into the drive bay.
Chapter 8 Drive Removal and Installation 5. For a SCSI carrier frame, set the carrier frame’s CPU assignment according to the following information. JP2 JP7 R1 R6 JP11 R4 R3 JP4 R5 J1 J2 R2 Q1 Q2 J1 J2 CPU A Drive Type Configuration SCSI Set CPUs using J1 and J2 on the back of the carrier frame. J1 J2 1. The SCSI controller resides on a domain’s host processor board. Configure only for that domain (CPU A or CPU B) 2. The device is configured to boot domain A or B 3.
Chapter 8 Drive Removal and Installation 6. Slide the carrier frame into the open peripheral bay and fasten with the captive screws provided (see the following figure). The keyswitch/LED should be at the top of the drive bay. 2417 9811 7. Replace the front peripheral bay bezel (the bezel is required for EMI shielding). 8. Cable the carrier frame according to the instructions in Cabling the SCSI Carrier Frame.
Chapter 8 Drive Removal and Installation 4. Connect the signal cable to the appropriate signal connector header on the backplane (PSIG1, PSIG2, PSIG3, PSIG4). Refer to the following figure and table for the header locations and appropriate signal connector/drive bay use. I O 4084 0302 Connector Configuration Domain PSIG1 0 Drive A domain PSIG2 1 Drive A domain PSIG3 0 Drive B domain PSIG4 1 Drive B domain 5.
Chapter 8 Drive Removal and Installation Replacing a Hot Swap SCSI Drive Module Follow these steps to remove a SCSI drive module from the chassis enclosure. This is in preparation for replacing a drive module. Caution ! Caution Prior to removing power from the SCSI drive, shutdown any running processes and the operating system. This will help prevent any data loss or damage to the operating system. 1. Push in the keyswitch and turn it counterclockwise 1/4 turn.
Chapter 8 Drive Removal and Installation Each drive can only be replaced with a drive of the same kind (SCSI with SCSI) and the replacement drive should be given the same address as the drive being replaced. To install the replacement drive into a hot swap carrier, refer to the sample figure below and perform the next steps. Top Cover SCSI/IDE Cable Power Cable Drive Activity Cable (not shown) SCSI Address /IDE Identification Cables Bottom Cover 3.5" SCSI/IDE Drive 2422 9811 7.
Chapter 8 Drive Removal and Installation Note The location of the activity LED header varies depending upon the manufacturer of your drive. Refer to your drive vendor’s documentation for the exact location. If a drive activity LED header is not provided, the cable can be connected to a spare +5V power header (the activity LED will remain lit) or be left disconnected (and remain unlit). 8. Refer to the next table and figure and connect the SCSI address wires.
Chapter 8 Drive Removal and Installation 11. Align the drive’s side mounting holes with the mounting holes in the carrier. Secure the drive with the four mounting screws. 12. Tuck all loose cables into the drive carrier. 13. Snap on the top carrier cover. The top cover is labeled “TOP” and has a flange along the back edge. 14. Snap on the bottom carrier cover. Note the position of the tapered corner. The bottom cover is labeled “BOTTOM” (the label is located on the back edge).
Chapter 8 Drive Removal and Installation 3. Align the drive module connector and the carrier frame connector, then slide the replacement drive module into the slot and seat firmly. 4. Push in the drive’s keyswitch and turn it clockwise 1/4 turn. This latches the drive module into the frame to prevent accidental removal, and alerts the system to the drive’s availability (if configured with the appropriate hot swap software).
Chapter 8 Drive Removal and Installation 4. Remove the two retaining screws from the top and bottom of the drive carrier. 5. Pull the drive carrier straight out of the peripheral bay.
Chapter 8 Drive Removal and Installation 3. Replace the drive bay bezel. If you are going to install another drive in the empty drive bay, proceed to Installing the Drive In the Standard Carrier. Drive Configuration This section describes the configuration of a 3.5-inch SCSI or IDE hard drive. Configuring Non-Hot Swap SCSI Drives Each SCSI drive must be configured with a unique SCSI address. The next figure provides the configuration information for SCSI drives installed in a non-hot swap drive carrier.
Chapter 8 Drive Removal and Installation Installing the Drive In the Standard Carrier After you configure the drive, follow these steps to install it in the drive carrier. Refer to the next figure. 1. If the drive carrier has guide rails installed, remove them. 2414 9811 2. Lay the drive carrier open-side up on a flat, static-free surface. 3. Position the drive in the carrier component-side down so that the mounting holes in the drive and the carrier line up. 4.
Chapter 8 Drive Removal and Installation Installing the Drive Module into the Drive Bay After installing the drive into the carrier, follow these steps to install the drive module into the drive bay. 1. If not already removed, remove the drive bay bezel on the front of the chassis. 2. Insert the drive module into the empty drive slot. The open end of the carrier (the top) should face the left (towards the CompactPCI card cage). Refer to the next figure showing the drive module installation. 2420 9811 3.
Chapter 8 Drive Removal and Installation Replacing a Non-Hot Swap 5.25-inch Drive This section describes the removal and installation of a 5.25-inch drive from the front peripheral bay. It applies to both SCSI and IDE drives. The 5.25-inch drive requires drive guide rails instead of a drive carrier for installation. You must shut down the operating system and remove the input power before performing these procedures. Removing a 5.25-inch Drive Follow these procedures to remove a 5.
Chapter 8 Drive Removal and Installation Installing the 5.25-inch Drive This section describes the installation and configuration of 5.25-inch drives, such as CD-ROM drives, in the front peripheral bay. Shut down the operating system and remove the input power before performing these procedures. Caution ! Caution 1. Configure the drive according to your drive manufacturer’s instructions. Each SCSI drive must have a unique SCSI address. 2.
Chapter 8 Drive Removal and Installation Cabling the SCSI or IDE Non-Hot Swap Drive Follow these steps to connect the cables to either a SCSI or IDE drive. For reference, you may refer to the sections Cabling the SCSI Carrier Frame on page 76 or Cabling the IDE Carrier Frame on page 69. 1. If necessary, remove the floppy housing from the rear of the chassis, refer to Floppy Housing Removal and Installation on page 98. 2.
Chapter 8 Drive Removal and Installation Replacing a Floppy Drive This section gives information on how to remove and install a floppy drive in your chassis. Removal Follow these steps to remove a floppy drive from the floppy housing in the rear of the chassis. The drives mounted in this bay are not hot-swappable. Shut down the system and remove the input power before performing these procedures. Caution ! Caution 1. Remove the floppy housing from the rear of the chassis.
Chapter 8 Drive Removal and Installation The floppy housing can have either one, two, or no spaces for mounting a floppy drive. Make sure you have an available floppy drive slot before performing this procedure. 1. Remove the floppy housing from the rear of the system. Refer to Floppy Housing Removal and Installation on page 98. 2. If present, remove the blank filler panel from the floppy drive opening in the floppy housing. 3. Insert the floppy drive into the floppy housing.
Chapter 8 Drive Removal and Installation 92 CPX8216 and CPX8216T Installation and Use (6806800A52C)
9 Subassembly Removal and Installation 9 Overview This chapter provides the removal and installation procedures for field-replaceable subassemblies. Note that the CPX8216 backplane is not a field-replaceable unit. These procedures should be performed by trained service personnel only. The list below shows the subassembly removal/installation procedures included in this chapter.
Chapter 9 Subassembly Removal and Installation Removal To remove a fan/power supply sled, refer to the next figure and follow these steps. 1. If the chassis is NOT equipped with a redundant power supply, and you are removing one of them, shut the chassis down. If the chassis IS equipped with a redundant power supply, or if the chassis is NOT equipped with a redundant power supply but you are removing the fan-only sled, the chassis can remain operational during this procedure. 2406 0900 2.
Chapter 9 Subassembly Removal and Installation Installation Follow these steps to install a new power supply and fan assembly into the chassis. 1. The fan/power supply sled should be inserted with a single, steady motion. Slowly slide the fan/power supply sled into the chassis. Guides on the chassis and rails on the sled assist in properly aligning the sled during insertion. Bouncing the sled during insertion may cause an alarm condition in the system. Also, the sled should not be forced into the slot.
Chapter 9 Subassembly Removal and Installation Alarm Panel Removal and Installation (Hot Swap) The alarm panel is hot swappable—it can be removed from a live chassis without affecting system functions or performance, or the function of the alarm panel itself. Removal Refer to the next figure and follow these steps to remove the alarm panel from the chassis: 1. Loosen the two captive screws at the top of the alarm panel. 2. Pull the top of the alarm panel away from the chassis.
Chapter 9 Subassembly Removal and Installation Installation Refer to the preceding figure and follow these instructions: 1. Push the connector on the alarm cable into header J4 on the alarm panel. The cable connector and header are keyed—they will only fit together in the proper direction. The retaining clips automatically close as the connector is seated. 2. Gently squeeze the retaining clips towards each other to ensure that they are fully closed and the connector is fully seated. 3.
Chapter 9 Subassembly Removal and Installation Floppy Housing Removal and Installation The floppy housing is located in the rear of the chassis. It can accommodate up to two floppy drives and two SCSI connectors. The floppy housing is not hot swappable. Removal Refer to the next figure and follow these steps to remove the floppy housing from the chassis. 1. Shut down the operating system. If the system is configured as a dual-8 system, make sure that both domains are shut down. 2.
Chapter 9 Subassembly Removal and Installation Make sure the internal floppy and SCSI drives are cabled before installing the floppy housing. Refer to Chapter 8, Drive Removal and Installation for drive cabling information. 1. Slide the housing straight into the chassis and secure with the four captive screws in the corners of the housing. 2. Attach the external SCSI cables to the SCSI connectors on the face of the housing.
Chapter 9 Subassembly Removal and Installation 100 CPX8216 and CPX8216T Installation and Use (6806800A52C)
10 Pin Assignments 10 Overview This chapter provides pin assignments and reference information for the backplane connectors of the CPX8216 and CPX8216T chassis and other major connectors associated with the chassis and transition modules. Following is a list of the backplane and other chassis connectors covered in this chapter: ■ Backplane Connectors ■ Transition Module Slots ■ Power Supply Connectors (PS1, PS2, PS3) ■ H.
Chapter 10 Pin Assignments Table 10-2. P4 Connector, I/O Slots 1-6 and 11-16 (User I/O) POS Row Z Row A Row B Row C Row D Row E Row F 25-15 GND I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O GND 14 KEY AREA 13 12 11-1 GND All I/O pins pass through the backplane to the transition module, they do not make any connection to the backplane. Table 10-3.
Chapter 10 Pin Assignments Table 10-4.
Chapter 10 Pin Assignments Table 10-5. P1 Connector, I/O Slots 1-6 and 11-16 (CPCI Bus) (continued) POS Row Z Row A Row B Row C Row D Row E Row F 19 GND 3.3V _AD[15] _AD[14] GND _AD[13] GND 18 GND _SERR# GND 3.3V _PAR _C/BE[1] GND 17 GND 3.3V _SDONE _SBO# GND _PERR# GND 16 GND _DEVSEL# GND VIO _STOP# _LOCK# GND 15 GND 3.3V _FRAME# _IRDY# BD_SEL[n]# _TRDY# GND 1412 KEY AREA 11 GND _AD[18} _AD[17] _AD[16] GND _C/BE[2]# GND 10 GND _AD[21] GND 3.
Chapter 10 Pin Assignments Primary (Front) Side CPU Slot Connectors (7 and 9) Table 10-6.
Chapter 10 Pin Assignments Table 10-7. P4 Connector, CPU Slots 7 and 9 POS Row Z Row A Row B Row C Row D Row E Row F 25 GND _AD36 _AD35 _AD34 _AD33 _AD32 GND 24 GND _AD40 _AD39 _AD38 GND _AD37 GND 23 GND _AD45 _AD44 _AD43 _AD42 _AD41 GND 22 GND _AD49 _+3.3 _AD48 _AD47 _AD46 GND 21 GND _AD53 _AD52 _AD51 GND _AD50 GND 20 GND _AD57 _+3.3 _AD56 _AD55 _AD54 GND 19 GND _AD61 _AD60 _AD59 GND _AD58 GND 18 GND _CBE4# _+3.
Chapter 10 Pin Assignments Table 10-8. P3 Connector, CPU Slots 7 and 9 POS Row Z Row A Row B Row C Row D Row E Row F 19 GND I/O I/O I/O I/O I/O GND 18 GND HS_REQ_ I/O I/O I/O I/O GND 17 GND HS_GNT_ I/O I/O I/O I/O GND 16 GND HS_FLT_ I/O I/O I/O I/O GND 15 GND HS_EJ_ I/O I/O I/O I/O GND 14-1 GND I/O I/O I/O I/O I/O GND All I/O pins pass through the backplane to the transition module; they do not make any connection to the backplane.
Chapter 10 Pin Assignments Table 10-9.
Chapter 10 Pin Assignments Table 10-10.
Chapter 10 Pin Assignments Table 10-11. P1 Connector, CPU Slots 7 and 9 (continued) POS Row Z Row A Row B Row C Row D Row E Row F 15 GND 3.3V _FRAME# _IRDY# BD_SEL[n ]# _TRDY# GND 14-12 KEY AREA 11 GND _AD[18} _AD[17] _AD[16] GND _C/BE[2]# GND 10 GND _AD[21] GND 3.3V _AD[20] _AD[19] GND 9 GND _C/BE[3] _IDSEL _AD[23] GND _AD[22] GND 8 GND _AD[26] GND VIO _AD[25] _AD[24] GND 7 GND _AD[30] _AD[29] _AD[28] GND _AD[27] GND 6 GND (REQ#) GND 3.
Chapter 10 Pin Assignments Table 10-13. P4 Connector, I/O Slots 1-6 and 11-16 (User I/O) POS Row Z Row A Row B Row C Row D Row E Row F 25-15 GND I/O I/O I/O I/O I/O GND I/O I/O I/O I/O GND 14 13 KEY AREA 12 11-1 GND I/O All I/O pins pass through the backplane to the transition module, they do not make any connection to the backplane. Table 10-14.
Chapter 10 Pin Assignments Primary (Front) Side (Slots 1-6 and 11-16) The I/O connectors for slots 1-6 and 11-16, except for the P4 connector, which carries the H.110 bus, use the same pinouts as the standard CPX8216 backplane. Table 10-15.
Chapter 10 Pin Assignments Primary (Front) Side CPU Connectors The CPU connectors on the CPX8216T H.110 backplane use the same pinouts as the CPX8216 standard backplane. For Pinout Information for Connector: See: P5 Table 10-6 on page 105 P4 Table 10-7 on page 106 P3 Table 10-8 on page 107 P2-Domain A Table 10-9 on page 107 P2-Domain B Table 10-10 on page 108 P1 Table 10-11 on page 109 Primary (Front) Side HSC Connectors The HSC/Bridge slot is unique.
Chapter 10 Pin Assignments Table 10-16.
Chapter 10 Pin Assignments Table 10-17. P4 Connector, HSC Slots 8 and 10 (continued) POS Row Z Row A Row B Row C Row D Row E Row F 1412 KEY AREA 11 NP CT_D29 CT_D30 CT_D31 V(I/O) CT_FRAME_A# GND 10 NP CT_D27 +3.3V CT_D28 +5V CT_FRAME_B# GND 9 NP CT_D24 CT_D25 CT_D26 GND FR_COMP# GND 8 NP CT_D21 CT_D22 CT_D23 +5V CT_C8_A GND 7 NP CT_D19 +5V CT_D23 GND CT_C8_A GND 6 NP CT_D16 CT_D17 CT_D18 GND CT_NETREF_1 GND 5 NP CT_D13 CT_D14 CT_D15 +3.
Chapter 10 Pin Assignments Table 10-18.
Chapter 10 Pin Assignments Table 10-19.
Chapter 10 Pin Assignments Table 10-20.
Chapter 10 Pin Assignments Table 10-21. P1 Connector, HSC Slots 8 and 10 (continued) POS Row Z Row A Row B Row C Row D Row E Row F 19 GND 3.3V _AD[15] _AD[14] GND _AD[13] GND 18 GND _SERR# GND 3.3V _PAR _C/BE[1] GND 17 GND 3.3V _SDONE _SBO# GND _PERR# GND 16 GND _DEVSEL# GND VIO _STOP# _LOCK# GND 15 GND 3.3V _FRAME# _IRDY# BD_SEL[n]# _TRDY# GND 1412 KEY AREA 11 GND _AD[18} _AD[17] _AD[16] GND _C/BE[2]# GND 10 GND _AD[21] GND 3.
Chapter 10 Pin Assignments Transition Module Slots Hot Swap Controller/Bridge Connectors (Transition Slots 8 and 10) The Hot Swap Controller/Bridge for Domain A resides in transition module slot 10. The Hot Swap Controller/Bridge for Domain B resides in transition module slot 8. Table 10-24. P5 Connector, HSC/Bridge (Slots 8 and 10) POS Row Z Row A Row B Row C Row D Row E Row F 22-1 GND RSVD RSVD RSVD RSVD RSVD GND Connector P5 is reserved for future use. Table 10-25.
Chapter 10 Pin Assignments Table 10-25.
Chapter 10 Pin Assignments Table 10-26.
Chapter 10 Pin Assignments Table 10-27.
Chapter 10 Pin Assignments Table 10-28.
Chapter 10 Pin Assignments Table 10-29. P1 Connector, HSC Slots 8 and 10 (continued) POS Row Z Row A Row B Row C Row D Row E Row F 6 GND REQ[N]# GND 3.3V CLK[N] _AD[31] GND 5 GND _BRSVP1A 5 _BRSVP1B 5 RST[N]# GND GNT[N]# GND 4 GND _BRSVP1A 4 HLTY[N]# VIO _INTP _INTS GND 3 GND _INTA# _INTB# _INTC# 5V _INTD# GND 2 GND TCK 5V TMS TDO TDI GND 1 GND 5V -12V TRST# +12V 5V GND A_ENUM# in Domain A (slot 10); B_ENUM# in Domain B (slot 8).
Chapter 10 Pin Assignments Table 10-30.
Chapter 10 Pin Assignments Alarm Interface Connector (ALARM) The alarm interface connector is located on the secondary side of the backplane. Alarm signals are routed through the backplane to the ALARM connector. The alarm board attaches to this connector by ribbon cable. Table 10-32.
Chapter 10 Pin Assignments Table 10-34. Fan Module Pin Assignments Pin Signal Color Pin Signal 1 N/C 2 +12V_System In 3 Color 6 N/C Grey 7 +12V_System Out Brown +12V_Fan Red 8 +12V_Fan_Rtn Black 4 Tach Blue 9 Speed Ctl Yellow 5 N/C 10 N/C H.110 Power Connector (CPX8216T Only) H.110 BAT and Ring voltages are supplied to the backplane directly from the Power Distribution Panel. This section applies to CPX8216T chassis only. Table 10-35. H.
Chapter 10 Pin Assignments Peripheral Signal Connectors (SIG1, SIG2, SIG3, SIG4) The four peripheral signal connectors are located on the secondary side of the CPX8216 backplane. All four connectors have the same pin-out. The connectors map to different locations in the Hot Swap Controller peripheral registers, and cannot be used interchangeably. Table 10-37.
Chapter 10 Pin Assignments Remote Alarm Connector (J1) The RJ-45 remote alarm connector (J1) provides standard telco alarm signals to remote alarm equipment. The connector also has a jacket shield to protective earth ground through two separate pins (E1 and E2). Table 10-39.
Chapter 10 Pin Assignments Table 10-40. FDA and FDB Pin Assignments (continued) Pin Signal Signal Pin 27 GND F_[n]_WPROT# 28 29 GND F_[n]_RDATA# 30 31 GND F_[n]_HDSEL# 32 33 GND F_[n]_DSKCHG# 34 IDE Drive (IDEA and IDEB) The two IDE drive connectors are located on the secondary side of the backplane. IDEA is controlled by Domain A; IDEB by Domain B. Table 10-41.
Chapter 10 Pin Assignments 132 CPX8216 and CPX8216T Installation and Use (6806800A52C)
A Specifications A Environmental Characteristics ENVIRONMENTAL CHARACTERISTICS Temperature Operating: 0º to 50º C (32º to 122º F) continuous duty with linear current derating between +50º C to +60º C (122º to 140º F) to 50% maximum rated power Storage and Transit: -25º TO +85º C (-13º to 185º F) Maximum Altitude Operating: Linear current derating to 85% between 8,000 feet and 12,000 feet Storage and Transit: 30,000 feet Shock No degradation at 25g shock of 11ms duration at 1/2 sine wave in three
Appendix A Specifications DC Input DC Voltage: -36 Vdc to -72 Vdc (autoranging) Turn-on Threshold: -38.5 Vdc to -41Vdc Turn-on Surge Current: 20 Amps at -36 Vdc maximum in less than 4 msec. Efficiency: 70% minimum at full load and nominal line, including output Oring diodes Input Current: Measured 13A @ -48 Vdc at 475W Output All measurements are made at the output connector of the power supply. The power supply is used in an N+1 power system. Each voltage output supports power sharing.
Appendix A Specifications Overshoot Overshoot does not exceed 2.0% of any output voltage under the following conditions: power failure, enabled, disabled, and AC input cycled on/off. Overshoot is the phenomena where the magnitude of voltage of an output temporarily exceeds its final or stabilized value. Load Change Transient Any DC voltage returns to 1% within 2mS in response to a 25% change in Response the load. The +5V output does not vary more than 3% in response to a 25% change in load.
Appendix A Specifications NEBS The CPX8216 meets the requirements of the Bellcore Network Equipment Building System (NEBS) Requirements: Physical Protection, GR-63-CORE and the Electromagnetic Compatibility and Electrical Safety—Generic Criteria for Network Telecommunication Equipment, GR-1089-CORE as listed in the following table. The product has been tested to the requirements for NEBS Level 3 criteria. Table A-2.
Appendix A Specifications Table A-2. NEBS Specification Compliance (continued) Criteria NEBS Specification Reference Heat Dissipation Documentation GR-63-CORE, R4-11 300/w/m2 GR-63-CORE, R4-12 /m max per shelf 38° C max. aisle-facing surface GR-63-CORE, O4-13 temp @ 26° C ambient Fire Resistance and Materials All material UL94V-1 or better. See GR-63-CORE, Section 4.2 GR-63-CORE, R4-14 to O4-40 Illumination See GR-63-CORE, Section 4.
Appendix A Specifications 138 CPX8216 and CPX8216T Installation and Use (6806800A52C)
B Systeminstallationsanleitung B Empfangen und Auspacken Dem Gerät sollte eine Teileliste beiliegen, die alle im Lieferumfang des Systems enthaltenen Teile auflistet. Vergleichen Sie diese Teileliste mit den erhaltenen Teilen. Sollte die Teileliste mit den erhaltenen Teilen nicht übereinstimmen, benachrichtigen Sie unverzüglich den Lieferungsagenten und Emerson. Alle mit dem System bestellten Optionen sind werkseitig installiert und nicht separat auf der Teileliste aufgelistet.
Appendix B Systeminstallationsanleitung Kühlen des Gehäuses Es ist äußerst wichtig, daß alle Geräte eines Systems sachgemäß gekühlt werden. Die Eingangslufttemperatur der Systemkomponenten muß im allgemeinen unter 50º C (122º F) liegen. Interne, durch Gleichstrom betriebene Ventilatoren kühlen die Laufwerke und Module des Systems ab. Die Übergangsmodule an der Rückseite des Chassis werden durch natürliche Konvektion gekühlt.
Appendix B Systeminstallationsanleitung gefährliche Spannungen anliegen, auch wenn sich der Schalter in der ausgeschalteten Position befindet. Das System darf nicht bei abgenommener Gehäuseabdeckung betrieben werden. Vor dem Einschalten des Systems ist die Gehäuseabdeckung stets anzubringen. Sicherheits- und Betriebsnormen Diese Systeme entsprechen den Sicherheits- und Betriebsnormen, die für einzelne Geräteteile gelten.
Appendix B Systeminstallationsanleitung Um Verletzungen von Personen oder Beschädigungen der Geräte zu vermeiden sollten folgende Schritte von zwei Personen ausgeführt werden, 1. Schieben Sie das Chassis vorne in das Rack. 2. Befestigen Sie das Chassis mit Schrauben. (Um Genaueres über die hierzu empfohlenen Schraubenarten zu erfahren, wenden Sie sich bitte an den Hersteller des Racks.) Anschließen des Systems Um das System zu verkabeln, gehen Sie folgendermaßen vor: 1.
Appendix B Systeminstallationsanleitung Um den Netzstrom einzuschalten, stellen Sie den Netzschalter (EIN/AUS) am Chassis auf EIN (1). Die normale Startroutine des Systems erfolgt, und das System ist dann einsatzbereit.
Appendix B Systeminstallationsanleitung 144 CPX8216 and CPX8216T Installation and Use (6806800A52C)
C Related Documentation C Emerson Network Power - Embedded Computing Documents The Emerson Network Power - Embedded Computing publications listed below are referenced in this manual. You can obtain electronic copies of Emerson Network Power - Embedded Computing publications by contacting your local Emerson sales office. For documentation of final released (GA) products, you can also visit the following website: http://www.emersonnetworkpowerembeddedcomputing.
Appendix C Related Documentation Table C-1.
Appendix C Related Documentation Table C-2. Related Specifications (continued) Document Title and Source Publication Number Compact PCI Specification CPCI Rev. 2.1 Dated 9/2/97 PCI-to-PCI Bridge Specification PCI-ISA Specification Rev. 1.02 Rev. 2.0 CompactPCI Hot Swap Specification PICMG 2.1 R1.0 PCI Industrial Computers Manufacturers Group (PICMG) PCI Special Interest Group (PCI SIG) http://www.pcisig.com/ Peripheral Component Interconnect (PCI) Local Bus Specification, Revision 2.0, 2.1, 2.
Appendix C Related Documentation 148 CPX8216 and CPX8216T Installation and Use (6806800A52C)
Index A AC inputs 134 AC power distribution panel 24 acoustic noise 133 addressing SCSI drives 80, 84, 88 alarm board. See alarm display panel alarm board.
Index fan module 128 HSC 113, 118 I/O 111, 119 power 128 transition module 126 contents of this manual xxv conventions used in the manual xxvii cooling 133 fans 53 monitoring 55 sensors 55 cooling requirements 31 CPU assignment, IDE drives 67 CPU assignment, SCSI drive 75 CPU connectors, H.110 113 CPU module, features 12 CPU service switchover 12 CPU slot connectors 105 CPX8216 bus access 7 CPU modules 12 hot swap controller 12 standard system 5 subsystems 5 system description 3 CPX8216T bus connectors, H.
Index HSC controller 75 HSC.
Index problems 29 supply 55 power cable, connecting 69, 76 power connectors 128 power distribution panel, 48 VDC 25 power distribution panel, DC dual 24 power distribution panel, DC, H.
Index jumpering serial ports 63 transition slot connectors 125 typeface, meaning of xxvii V U W unpacking system 27 153 vibration 133 voltage, monitoring 55 weight distribution, rack installation 36 wire gauge, backplane power 69, 76 CPX8216 and CPX8216T Installation and Use (6806800A52C)
Index 154 CPX8216 and CPX8216T Installation and Use (6806800A52C)
