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Page 1Rev 1.1 MMB Networks 2013 MMB Module Data Sheet

MMB Networks EM357 ZigBee Module

Z357PA20-SMT, Z357PA21-SMT

Document Rev 1.1

The MMB Networks EM357 ZigBee Module is a drop-in ZigBee

Smart Energy solution. Preloaded with MMB Research’s RapidSE

ZigBee Smart Energy application or RapidHA Home Automation

application, it oﬀers hardware vendors an easy way to integrate

a fully-implemented, automated ZigBee Smart Energy or ZigBee

Home Automation platform into their existing devices.

MMB Networks oﬀers a variety of hardware and software

development tools to facilitate integration. For more information,

please visit http://www.mmbnetworks.com

Contents

1 | General Information ......................................................................................................................2

2 | Memory ...........................................................................................................................................2

3 | Module Pinout ................................................................................................................................2

3.1 | Debug and Programming Interface .........................................................................................................................3

4 | Electrical Specications ................................................................................................................ 3

4.1 | Absolute Maximum Ratings ..........................................................................................................................................3

4.2 | Recommended Operating Conditions ...................................................................................................................3

4.3 | DC Electrical Characteristics ...........................................................................................................................................4

5 | RF Specications ............................................................................................................................4

5.1 | Receive Speciﬁcations .......................................................................................................................................................4

5.2 | Transmit Speciﬁcations .....................................................................................................................................................5

6 | Functional Specications ............................................................................................................. 5

6.1 | Serial Ports .................................................................................................................................................................................5

6.2 | GPIO ..............................................................................................................................................................................................6

6.3 | Analog to Digital Converter (ADC) ............................................................................................................................7

7 | Mechanical Specications ............................................................................................................8

7.1 | Physical Dimensions ...........................................................................................................................................................8

7.4 | Labelling .....................................................................................................................................................................................9

8 | Soldering Temperature Time Prole for reow soldering (Lead-free solder).....................9

9 | Regulatory Approvals .................................................................................................................10

9.1 | FCC ..............................................................................................................................................................................................10

9.2 | Industry Canada (IC) .......................................................................................................................................................10

10 | Ordering Information ...............................................................................................................11

Summary of content (11 pages)

PAGE 1
MMB Networks EM357 ZigBee Module Z357PA20-SMT, Z357PA21-SMT Document Rev 1.1 The MMB Networks EM357 ZigBee Module is a drop-in ZigBee Smart Energy solution. Preloaded with MMB Research’s RapidSE ZigBee Smart Energy application or RapidHA Home Automation application, it offers hardware vendors an easy way to integrate a fully-implemented, automated ZigBee Smart Energy or ZigBee Home Automation platform into their existing devices.
PAGE 2
1 | General Information Note that some of the specifications refer to either EM357 or Module. Please note specifications cited as EM357 are taken from the EM357 datasheet (this should also be noted where referred to). Module means measurements taken with our production module. 2 | Memory SKU RAM (kB) On-Chip Flash (kB) Serial Flash (kB) Z357A.1.0 12 192 512 3 | Module Pinout Module Pad Function EM357 GPIO (EM357 Pin Number) 1 VCC (3.
PAGE 3
.1 | Debug and Programming Interface In order to access the EM357 for programming and debug purposes, it is recommended that the designer incorporate Ember’s 10-pin InSight Port connector. This will allow Ember’s InSight Adapter (ISA3) to be used. Contact Ember for details regarding the InSight Port connector and ISA3. The following table shows a pin mapping between Ember’s 10-pin InSight Port connector and the module, and the graphic to the right displays the layout of the InSight Port connector.
PAGE 4
.3 | DC Electrical Characteristics Parameter Test Condition Deep sleep current Minimum Typical Maximum Units At 25 °C, VCC = 3.3v, shutdown mode 0.65 TBD μA Idle current At 25 °C, VCC = 3.3v, sleep mode 13 mA RX current At 25 °C, VCC = 3.3v 32 mA TX current At 25 °C, VCC = 3.3v, normal mode, 20 dBm 175 Low Schmitt switching threshold Schmitt input threshold going from high to low High Schmitt switching threshold Schmitt input threshold going from low to high 235 mA 0.
PAGE 5
EM357 Receive Characteristics This table lists the key parameters of the integrated IEEE 802.15.4-2003 receiver on the EM357. This information is taken from the Ember EM357 Datasheet. This document is available at: http://www.silabs.com/Support%20Documents/TechnicalDocs/EM35x.pdf Note: Receive measurements were collected with Ember’s EM35x Ceramic Balun Reference Design (Version A0) at 2440MHz. The Typical number indicates one standard deviation above the mean, measured at room temperature (25°C).
PAGE 6
• • • • Selectable data shift direction (either LSB or MSB first) Receive and transmit FIFOs Receive and transmit DMA channels The following signals can be made available on the GPIO pins: ʳʳ MOSI (serial data out) ʳʳ MISO (serial data in) ʳʳ MCLK (serial clock out) The SPI slave controller has the following features: • Full duplex operation • Up to 4 Mbps data transfer rate • Programmable clock polarity and clock phase • Selectable data shift direction (either LSB or MSB first) • Slave select input • The
PAGE 7
• • General purpose input General purpose input with pull-up or pull-down resistor 6.3 | Analog to Digital Converter (ADC) The ADC is a first-order sigma-delta converter with the following features: • Resolution of up to 14 bits • Sample times as fast as 5.
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7 | Mechanical Specifications 7.1 | Physical Dimensions Symbol Description Distance L Length of the module 34.2 mm W Width of the module 15 mm H Height of the module 2.88 mm A1 Pitch 1.27 mm A2 Distance centre of pad to PCB edge 6 mm A3 Distance center of pad to PCB edge 3.7 mm A Length of keep-out zone 7.55 mm B Width of keep-out zone 6.2 mm C Keep-out zone from corner of PCB 5 mm (minimum) D Keep-out zone from corner of PCB 5 mm (minimum) Rev 1.
PAGE 9
11mm 7.4 | Labelling 11mm 8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder) Temp [ ˚C ] 230˚C - 240˚C max 220˚C 30 +20/-10s 150˚C - 190˚C 90 ±30s Time [ s ] Maximum reflow cycles: 2 Opposite-side reflow is prohibited due to the module weight. You must not place the module on the bottom / underside of your PCB and re-flow. Rev 1.
PAGE 10
9 | Regulatory Approvals 9.1 | FCC 9.1.1 | FCC Notice This device (Z357PA20-SMT, Z357PA21-SMT) complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
PAGE 11
9.2.2 | Labeling Requirements The host device shall be properly labelled to identify the modules within the host device.